Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2005
08/04/2005WO2005071741A2 Coupling organic coatings in semiconductor housings
08/04/2005WO2005071733A1 Semiconductor device, power converter employing it, motor employing it, hybrid automobile employing it, and motor drive system employing it
08/04/2005WO2005071001A1 Thermally conductive thermoplastic resin compositions
08/04/2005WO2005070851A1 Non oxide ceramic having oxide layer on the surface thereof, method for production thereof and use thereof
08/04/2005WO2005070178A2 Test result marking of electronic packages
08/04/2005WO2005069828A2 Thermal protection for electronic components during processing
08/04/2005WO2005057654A3 Wire-bonded semiconductor component with reinforced inner connection metallization
08/04/2005WO2005053021A3 Thermal interface and method of making the same
08/04/2005WO2005048262A3 Mram architecture with a flux closed data storage layer
08/04/2005WO2005046020A3 Electric motor and method for producing said motor
08/04/2005WO2005033720A3 Testing apparatus and method for determining an etch bias associated with a semiconductor-processing step
08/04/2005WO2005022597A3 Integrated circuit package having an inductance loop formed from a multi-loop configuration
08/04/2005WO2005006362A3 Methods for the control of flatness and electron mobility of diamond coated silicon and structures formed thereby
08/04/2005WO2004114365A3 Lost cost chip carrier manufactured from conductive loaded resin-based material
08/04/2005WO2004109756A3 Method and system for using ion implantation for treating a low-k dielectric film
08/04/2005US20050172256 Mask set for measuring an overlapping error and method of measuring an overlapping error using the same
08/04/2005US20050172248 Area ratio/occupancy ratio verification method and pattern generation method
08/04/2005US20050171301 Reworkable thermosetting resin compositions
08/04/2005US20050170652 Method for manufacturing wiring substrate and method for manufacturing electronic device
08/04/2005US20050170647 Electroplating and electroless plating of conductive materials into openings, and structures obtained thereby
08/04/2005US20050170641 Multilayered wiring structure, method of forming buried wiring, semiconductor device, method of manufacturing semiconductor device, semiconductor mounted device, and method of manufacturing semiconductor mounted device
08/04/2005US20050170635 Semiconductor device and manufacturing method thereof
08/04/2005US20050170634 High performance system-on-chip discrete components using post passivation process
08/04/2005US20050170633 Semiconductor device and method of manufacturing a semiconductor device
08/04/2005US20050170631 Manufacturing method for wiring substrates
08/04/2005US20050170630 Methods for reducing flip chip stress
08/04/2005US20050170627 Interconnect apparatus, system, and method
08/04/2005US20050170626 Semiconductor device and method for fabricating the device
08/04/2005US20050170622 Method for manufacturing wiring substrate and method for manufacturing electronic device
08/04/2005US20050170615 Method of manufacturing a semiconductor device having an alignment mark
08/04/2005US20050170605 Airdome enclosure for components
08/04/2005US20050170602 Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment
08/04/2005US20050170600 Three-dimensional semiconductor package, and spacer chip used therein
08/04/2005US20050170583 Methods of fabricating MIM capacitors of semiconductor devices
08/04/2005US20050170582 Semiconductor device and its manufacturing method
08/04/2005US20050170561 Fabrication method of semiconductor package with photosensitive chip
08/04/2005US20050170560 Method of manufacturing an electronic device
08/04/2005US20050170555 Method of manufacturing a semiconductor device including electrodes on main and reverse sides of a semiconductor chip
08/04/2005US20050170535 Calibration standards for dopants/impurities in silicon and preparation method
08/04/2005US20050170534 Ferroelectric capacitor, method of manufacturing same, and semiconductor memory device
08/04/2005US20050170294 Exposing a resist film formed on semiconductor substrate to a light using photomask in which patterns are arranged two-dimensionally at a predetermined altitude; development; reducing an opening size; setting a reflow start temperature, heating; coating with water soluble resin; crosslinking; etching
08/04/2005US20050170079 Method for manufacturing wiring substrate and method for manufacturing electronic device
08/04/2005US20050169620 Optical device
08/04/2005US20050169328 Magnetically controlled heat sink
08/04/2005US20050168961 Stereoscopic electronic circuit device, and relay board and relay frame used therein
08/04/2005US20050168960 Module with a built-in component, and electronic device with the same
08/04/2005US20050168952 Semiconductor package
08/04/2005US20050168950 Semiconductor cooling device and stack of semiconductor cooling devices
08/04/2005US20050168949 Three dimensional packaging and cooling of mixed signal, mixed power density electronic modules
08/04/2005US20050168947 Chip packaging module with active cooling mechanisms
08/04/2005US20050168946 Heat-emitting element cooling apparatus
08/04/2005US20050168940 Controlling thermal, acoustic, and/or electromagnetic properties of a computing device
08/04/2005US20050168939 Electronic component cooling apparatus
08/04/2005US20050168917 Method for manufacturing ceramic multilayer substrate
08/04/2005US20050168914 Integrated capacitor
08/04/2005US20050168906 Contact sensor package
08/04/2005US20050168894 ESD protective circuit for an electronic circuit having two or more supply voltages
08/04/2005US20050168845 Optical device
08/04/2005US20050168319 Semiconductor resistor
08/04/2005US20050168316 Encapsulation with oxide bond to borosilicate mixture
08/04/2005US20050168238 Power plane system of high-speed digital circuit for suppressing ground bounce noise
08/04/2005US20050168224 Receiver electronics proximate antenna
08/04/2005US20050168197 Power module
08/04/2005US20050167857 Semiconductor wafer and a method for manufacturing a semiconductor wafer
08/04/2005US20050167855 Resin-encapsulation semiconductor device and method for fabricating the same
08/04/2005US20050167854 hermetic sealing; for chip-size surface acoustic wave packages on die disposed on electrically nonconductive carrier separated by electrically conducting bumps
08/04/2005US20050167853 Carrier
08/04/2005US20050167851 Semiconductor part for component mounting, mounting structure and mounting method
08/04/2005US20050167850 Flip-chip adaptor package for bare die
08/04/2005US20050167849 Semiconductor module
08/04/2005US20050167848 Filp chip in leaded molded package and method of manufacture thereof
08/04/2005US20050167846 Semiconductor device and method of manufacturing the same
08/04/2005US20050167845 Semiconductor device and method of manufacturing the same
08/04/2005US20050167844 Semiconductor device
08/04/2005US20050167843 Semiconductor device having multilayer wiring structure and method of fabricating the same
08/04/2005US20050167842 Semiconductor device
08/04/2005US20050167841 Use of supercritical fluid for low effective dielectric constant metallization
08/04/2005US20050167840 Via structure for semiconductor chip
08/04/2005US20050167839 Structure comprising amorphous carbon film and method of forming thereof
08/04/2005US20050167838 Device and methodology for reducing effective dielectric constant in semiconductor devices
08/04/2005US20050167837 Device with area array pads for test probing
08/04/2005US20050167834 Semiconductor device including semiconductor element mounted on another semiconductor element
08/04/2005US20050167833 Bumped IC, display device and electronic device using the same
08/04/2005US20050167832 Semiconductor device and method for manufacturing the same
08/04/2005US20050167831 Semiconductor device and method of fabricating the same
08/04/2005US20050167830 Pre-solder structure on semiconductor package substrate and method for fabricating the same
08/04/2005US20050167829 Partially etched dielectric film with conductive features
08/04/2005US20050167828 High performance RF inductors and transformers using bonding technique
08/04/2005US20050167827 Solder alloy and semiconductor device
08/04/2005US20050167826 Bumpless wafer scale device and board assembly
08/04/2005US20050167825 Fuse corner pad for an integrated circuit
08/04/2005US20050167824 Integrated circuit with protective moat
08/04/2005US20050167823 Integrated VCSELs on traditional VLSI packaging
08/04/2005US20050167822 Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods
08/04/2005US20050167821 Semiconductor device having radiation structure
08/04/2005US20050167820 Device and method for cooling hot spot in micro system
08/04/2005US20050167819 Method and apparatus for high electrical and thermal performance ball grid array package
08/04/2005US20050167818 Mold release layer transferring film and laminate film
08/04/2005US20050167817 Microelectronic adaptors, assemblies and methods
08/04/2005US20050167815 Circuit carrier and package structure thereof
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