Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2005
08/10/2005CN1652319A Plasma enhanced ALD of tantalum nitride and bilayer
08/10/2005CN1652318A Wafer collective reliability evaluation device and wafer collective reliability evaluation method
08/10/2005CN1652317A Sn ball flatening method
08/10/2005CN1652316A Method for mfg multi-layer package
08/10/2005CN1652314A Lead frame, semiconductor chip package using the lead frame, and method of manufacturing the semiconductor chip package
08/10/2005CN1652313A Automatic assembing machine
08/10/2005CN1652312A Method for fabricating a thin film transistor
08/10/2005CN1652311A Semiconductor device and manufacturing process therefor as well as plating solution
08/10/2005CN1652310A Semiconductor device and manufacturing process therefor as well as plating solution
08/10/2005CN1652309A Heterogeneous low K dielectric and forming method thereof
08/10/2005CN1652179A 半导体装置 Semiconductor device
08/10/2005CN1652005A Display device and method for fabricating the same
08/10/2005CN1652002A Thin film transistor array panel and liquid crystal display including the panel
08/10/2005CN1214695C Method for manufacturing electric field lighting display device
08/10/2005CN1214691C Piezo-electric acoustical component and its making method
08/10/2005CN1214464C Semiconductor device and method of manufacture thereof
08/10/2005CN1214462C Vertical electrical interconnections in stack
08/10/2005CN1214461C Method for assembling QFN type image sensor
08/10/2005CN1214460C Non-pin square flat package with enhanced heat radiation
08/10/2005CN1214459C Electrode structure on carrier bottom of semiconductor device
08/10/2005CN1214458C RF module member including surface elastic wave element and its manufacture method
08/10/2005CN1214452C Semiconductor device and mfg. method therefor
08/10/2005CN1214448C Method for substrate noise distribution
08/10/2005CN1214344C Method for making electronic module or label and medium containing such a module or label
08/10/2005CN1214225C Cooling and heating device using thermoelectric module
08/10/2005CN1213942C Ozone generator
08/09/2005US6928632 Method of designing semiconductor device using power supply bump connections
08/09/2005US6928627 Method for recognizing and avoiding etch-critical regions
08/09/2005US6927982 Method of connecting a device to a support, and pad for establishing a connection between a device and a support
08/09/2005US6927981 CPU clamp (1)
08/09/2005US6927979 Heat-emitting element cooling apparatus
08/09/2005US6927978 Electronic apparatus and method of cooling the electronic apparatus
08/09/2005US6927964 Structure for preventing burnt fuse pad from further electrical connection
08/09/2005US6927655 Optical transmission module
08/09/2005US6927594 Evaluation device for evaluating semiconductor device
08/09/2005US6927498 Bond pad for flip chip package
08/09/2005US6927497 Multi-die semiconductor package
08/09/2005US6927496 Wafer-level thick film standing-wave clocking
08/09/2005US6927495 Semiconductor device and method of manufacturing same
08/09/2005US6927493 Sealing and protecting integrated circuit bonding pads
08/09/2005US6927492 Solder pads and method of making a solder pad
08/09/2005US6927491 Back electrode type electronic part and electronic assembly with the same mounted on printed circuit board
08/09/2005US6927490 Buried solder bumps for AC-coupled microelectronic interconnects
08/09/2005US6927489 Semiconductor device provided with rewiring layer
08/09/2005US6927487 Protective device with spacer for subassemblies
08/09/2005US6927486 Photo-interrupter and semiconductor device using the same
08/09/2005US6927485 Substrate for semiconductor package
08/09/2005US6927483 Semiconductor package exhibiting efficient lead placement
08/09/2005US6927481 Leadframe inductors
08/09/2005US6927480 Multi-chip package with electrical interconnection
08/09/2005US6927479 Method of manufacturing a semiconductor package for a die larger than a die pad
08/09/2005US6927478 Reduced size semiconductor package with stacked dies
08/09/2005US6927477 Coplanar line, and a module using the coplanar line
08/09/2005US6927474 Method of programming an antifuse
08/09/2005US6927473 Semiconductor fuses and semiconductor devices containing the same
08/09/2005US6927472 Fuse structure and method to form the same
08/09/2005US6927471 Electronic system modules and method of fabrication
08/09/2005US6927457 Circuit structure for connecting bonding pad and ESD protection circuit
08/09/2005US6927453 Metal-oxide-semiconductor device including a buried lightly-doped drain region
08/09/2005US6927440 Metal-insulator-metal capacitor
08/09/2005US6927431 Semiconductor circuit constructions
08/09/2005US6927421 Graphite impregnated with molten metal
08/09/2005US6927420 Thin film transistor array panel and manufacturing method thereof
08/09/2005US6927410 Memory device with discrete layers of phase change memory material
08/09/2005US6927180 Reducing line to line capacitance using oriented dielectric films
08/09/2005US6927167 Method for manufacturing semiconductor device having controlled surface roughness
08/09/2005US6927161 Low-k dielectric layer stack including an etch indicator layer for use in the dual damascene technique
08/09/2005US6927158 Method of forming a semiconductor device with thermally conductive gas between wirings
08/09/2005US6927157 Integrated circuit and method for producing a composite comprising a tested integrated circuit and an electrical device
08/09/2005US6927156 Apparatus and method extending flip-chip pad structures for wirebonding on low-k dielectric silicon
08/09/2005US6927119 Semiconductor device having landing pad and fabrication method thereof
08/09/2005US6927113 Semiconductor component and method of manufacture
08/09/2005US6927100 Method of fabricating semiconductor device having blocking layer and fuse
08/09/2005US6927099 Process for producing semiconductor device and semiconductor device
08/09/2005US6927096 Method of manufacturing a semiconductor device
08/09/2005US6927095 Low cost and compliant microelectronic packages for high I/O and fine pitch
08/09/2005US6927094 Method for assembling a semiconductor chip utilizing conducting bars rather than bonding wires
08/09/2005US6927085 Web fabrication of devices
08/09/2005US6927083 Method for constructing a wafer-interposer assembly
08/09/2005US6927080 Structures for analyzing electromigration, and methods of using same
08/09/2005US6926861 Semiconductor package and method for producing heat-radiating substrate for it
08/09/2005US6926751 Overcoating metal particles with high electroconductive paste; high density integrated circuits
08/09/2005US6926190 assembling chips onto substrates includes applying a flux-free, no-flow underfill material
08/09/2005US6926078 Multi-load thermal regulating system with multiple serial evaporators
08/09/2005US6926071 Heat dissipation device
08/09/2005US6926070 System and method for providing cooling systems with heat exchangers
08/09/2005US6926057 Thin film forming apparatus and thin film forming method
08/09/2005US6925922 Apparatus for removing tiebars after molding of semiconductor chip
08/09/2005US6925875 Packaged accelerometer
08/09/2005US6925829 Cooling system and electronic apparatus having the same
08/04/2005WO2005071765A1 Monolithic thin-film thermoelectric device including complementary thermoelectric materials
08/04/2005WO2005071750A2 Conductive material compositions, apparatus, systems, and methods
08/04/2005WO2005071749A1 Efficient use of wafer area with device under the pad approach
08/04/2005WO2005071748A1 Method and system for cooling at least one electronic device
08/04/2005WO2005071747A1 Heat pipe radiator of heat-generating electronic component
08/04/2005WO2005071746A1 Semiconductor device and method for manufacturing same
08/04/2005WO2005071745A1 Laminated electronic part and its manufacturing method
08/04/2005WO2005071744A1 Multilayer electronic part and structure for mounting multilayer electronic part
08/04/2005WO2005071743A1 Semiconductor package and semiconductor device
08/04/2005WO2005071742A1 Multilayer electronic component manufacturing method
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