Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2005
08/11/2005US20050173787 Method for assembling a ball grid array package with two substrates
08/11/2005US20050173786 Semiconductor package and method for manufacturing the same
08/11/2005US20050173785 Anisotropic conductive film and bump, and packaging structure of semiconductor having the same
08/11/2005US20050173784 Stacked semiconductor device having mask mounted in between stacked dies
08/11/2005US20050173783 Semiconductor package with passive device integration
08/11/2005US20050173782 Electromagnetic shield with vee-slot panel joints
08/11/2005US20050173775 Integrated circuit device and fabrication method therefor
08/11/2005US20050173765 Device for electrostatic discharge protection and circuit thereof
08/11/2005US20050173732 Wire for a display device, a method for manufacturing the same, a thin film transistor array panel including the wire, and a method for manufacturing the same
08/11/2005US20050173721 Surface-mount type light emitting diode and method for manufacturing it
08/11/2005US20050173713 Multi-pin light-emitting diode device
08/11/2005US20050173708 Light emitting device and sealing material
08/11/2005US20050173702 Chip mis-position detection method
08/11/2005US20050173657 Contact opening metrology
08/11/2005US20050173532 Semiconductor chip with coil antenna and communication system
08/11/2005US20050173498 Brazing filler metal, assembly method for semiconductor device using same, and semiconductor device
08/11/2005US20050173288 Packaging structure and component installation method for oscillator
08/11/2005US20050173238 Applying electroconductive tracks; forming main layer at perpendicular flux direction; deposition of conductive, semiconductive and/or insulating materials at different angles of incidence; simplification; photovoltaics
08/11/2005US20050173105 Protect shield for a radiator
08/11/2005US20050173098 Three dimensional vapor chamber
08/11/2005US20050173097 Liquid circulation type cooling system
08/11/2005US20050173096 Heat dissipating device
08/11/2005US20050173094 Particulate aluminum nitride and method for producing thereof
08/11/2005US20050173024 IC die configured to reduce post-fabrication damage to the device. The IC die is formed such that at least a portion of one or more perimeter edges of the die are beveled by an etching process. The semiconductor device may include a plurality of IC dies, at least one of the IC dies being separated from
08/11/2005US20050172713 Sensor stem, sensor device having the same, and method of manufacturing sensor device
08/11/2005DE19733411B4 Verfahren zur Identifizierung von Wafern Method for identifying wafers
08/11/2005DE10347912B4 Verbesserter Leiterrahmen für elektronische Schaltungen im Automobilbereich Improved ladder framework for electronic circuits in the automotive sector
08/11/2005DE102005002631A1 Multi-chip pack consists of a substrate with numerous contact points, and primary and secondary semiconductor chips
08/11/2005DE102005001713A1 Verfahren zum Herstellen eines Verbindungsaufbaus A method of manufacturing a connection setup
08/11/2005DE102005001458A1 In einem Gehäuse enthaltener Drucksensor In one case contained pressure sensor
08/11/2005DE102005000734A1 Verfahren zum Einstellen einer Abweichung einer kritischen Abmessung von Mustern Method for adjusting a deviation of a critical dimension of patterns
08/11/2005DE102004062194A1 Integrierte Halbleiterschaltungs-Vorrichtung A semiconductor integrated circuit device
08/11/2005DE102004061585A1 Direkte Verwendung spannungsvariabler Materialien, Bestandteile davon und Einrichtungen, bei denen diese zum Einsatz kommen Direct use voltage variable materials, components thereof and institutions where they come to use
08/11/2005DE102004053595A1 Doppeltdichte quasi-koaxiale Übertragungsleitungen Double density quasi-coaxial transmission lines
08/11/2005DE102004048688A1 Halbleitervorrichtung Semiconductor device
08/11/2005DE102004019443B3 Power module has passive semiconductor chip arranged above active semiconductor chip on second film in close contact with surfaces of planar conducting tracks and first film of insulating material with planar conducting tracks
08/11/2005DE102004003413A1 Verfahren zum Verpacken von Halbleiterchips und entsprechende Halbleiterchipanordnung A method of packaging a semiconductor chip and corresponding semiconductor chip assembly
08/11/2005DE102004002423A1 Band-gap reference circuit, has first- and second-circuit sections each with bipolar transistor arrangement
08/11/2005DE102004001956A1 Umverdrahtungssubstratstreifen mit mehreren Halbleiterbauteilpositionen Rewiring substrate having a plurality of semiconductor component positions
08/11/2005DE102004001661A1 Verfahren zum elektrischen Verbinden eines elektrischen Leiters mit einem elektronischen Bauelement und Vorrichtung A method for electrically connecting an electrical conductor to an electronic component device and
08/11/2005DE102004001578A1 Integrierte Schaltung und Verfahren zum Erzeugen eines Bereitschaftssignals Integrated circuit and method for generating a ready signal
08/11/2005DE10158185B4 Leistungshalbleitermodul mit hoher Isolationsfestigkeit Power semiconductor module with high insulation strength
08/11/2005CA2554750A1 Partially etched dielectric film with conductive features
08/11/2005CA2554003A1 Silicon carbide on diamond substrates and related devices and methods
08/10/2005EP1562411A1 Metal/ceramic bonding member and method for producing same
08/10/2005EP1562289A2 Electronic part and method of manufacturing the same
08/10/2005EP1562277A1 Three-phase ac generator for vehicle
08/10/2005EP1562255A1 Coplanar filter
08/10/2005EP1562230A1 Packaging structure
08/10/2005EP1562229A2 Method for manufacturing metal structures having different heights
08/10/2005EP1562227A1 Semiconductor device
08/10/2005EP1562166A2 Semiconductor device
08/10/2005EP1561368A1 Multi-layer circuit assembly and process for preparing the same
08/10/2005EP1561243A1 Highly adaptable heterogeneous power amplifier ic micro-systems using flip chip and microelectromechanical technologies on low loss substrates
08/10/2005EP1561241A1 Reliable low-k interconnect structure with hybrid dielectric
08/10/2005EP1358489A4 Accelerometer protected by caps applied at the wafer scale
08/10/2005EP0922299A4 Post mounted heat sink method and apparatus
08/10/2005EP0839322B1 Microelectronic contact structure and method of making same
08/10/2005CN2717020Y Heat exchanger for cooling facility of water-cooled computer CPU
08/10/2005CN2717019Y Heat sink assembly
08/10/2005CN2717018Y Heat sink assembly
08/10/2005CN2717017Y Heat sink
08/10/2005CN2717016Y Fan-shaped heat sink
08/10/2005CN2717015Y A plurality of module packaging boxes
08/10/2005CN2716894Y Separate type heat pipe radiator for microprocessor
08/10/2005CN1653871A 印刷布线板 A printed circuit board
08/10/2005CN1653614A Circuit comprising a capacitor and at least one semiconductor component, and method for designing same
08/10/2005CN1653613A Interconnect for a semiconductor device
08/10/2005CN1653612A Cooling unit and flow distributing element for use in such unit
08/10/2005CN1653611A Semiconductor device with components embedded in backside diamond layer
08/10/2005CN1653610A Thermosetting adhesive sheet with electroconductive and thermoconductive properties
08/10/2005CN1653607A Multiple thickness semiconductor interconnect and method therefor
08/10/2005CN1653604A Packaging system for semiconductor devices
08/10/2005CN1653603A Wafer-level coated copper stud bumps
08/10/2005CN1653557A Wiring material and wiring board using the same
08/10/2005CN1653405A A liquid cooling device for a notebook computer
08/10/2005CN1653388A Patterning semiconductor layers using phase shifting and assist features
08/10/2005CN1653016A Method for producing a ceramic-copper composite substrate
08/10/2005CN1652881A Method and apparatus for two dimensional assembly of particles
08/10/2005CN1652666A Method for mfg wired substrate and method for mfg electronic apparatus
08/10/2005CN1652663A Stereoscopic electronic circuit device, and relay board and relay frame used therein
08/10/2005CN1652662A Multilayer printed wiring board and method of producing multilayer printed wiring board
08/10/2005CN1652457A Vertical-type power metal oxide semiconductor device with excess current protective function
08/10/2005CN1652445A Power inverter
08/10/2005CN1652392A Coplanar filter
08/10/2005CN1652365A Surface-mount type light emitting diode and method for manufacturing it
08/10/2005CN1652359A LED structure with electrostatic protection function
08/10/2005CN1652342A Optical device
08/10/2005CN1652341A Optical device
08/10/2005CN1652340A Light sensitive chip packaging structure
08/10/2005CN1652339A Nonvolatile semiconductor memory and manufacturing method for the same
08/10/2005CN1652335A Stacking packaging structure for light sensitive chips and semiconductor chips
08/10/2005CN1652332A Electronic assembly stacking structure
08/10/2005CN1652331A Device for electrostatic discharge protection and circuit thereof
08/10/2005CN1652330A Semiconductor device and method of manufacturing the same
08/10/2005CN1652329A Semiconductor device
08/10/2005CN1652328A Electronic component cooling apparatus
08/10/2005CN1652327A Optical device, method for fabricating optical device, cap component, and method for forming cap component
08/10/2005CN1652322A Area ratio/occupancy ratio verification method and pattern generation method
08/10/2005CN1652320A Interconnect structure , method for its fabricating and IC assembly
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