Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2014
04/02/2014CN103700645A MOM (metal-oxide-metal) capacitor and manufacturing method thereof
04/02/2014CN103700644A Adapter plate deep-groove capacitor based on TSV (Through Silicon Via) process and manufacturing method thereof
04/02/2014CN103700643A Adapter plate deep groove capacitor on basis of TSV (Through Silicon Via) process and manufacturing method thereof
04/02/2014CN103700642A Flip-chip packaging structure
04/02/2014CN103700641A Steel strip for lead frame and production method thereof
04/02/2014CN103700640A High-density lead frame for packaging discrete semiconductor device
04/02/2014CN103700639A Packaging assembly and manufacturing method thereof
04/02/2014CN103700638A Phase change material thermal buffering device and method for dissipating heat of high-power device
04/02/2014CN103700637A Heat exchanger with insulation device
04/02/2014CN103700636A Heat radiating plate and method for producing same
04/02/2014CN103700635A Chip packaging structure with cavity and packaging method thereof
04/02/2014CN103700634A Camera module, and encapsulating structure and encapsulating method thereof
04/02/2014CN103700633A 半导体封装件 Semiconductor package
04/02/2014CN103700616A System and method of novel MX to MX-2
04/02/2014CN103699191A Semiconductor water-cooling central processing unit (CPU) radiator
04/02/2014CN103697039A Combined screw
04/02/2014CN103692105A Device and method of solder cataplasm and semiconductor
04/02/2014CN102646629B Array substrate and manufacturing method thereof
04/02/2014CN102543776B Method for forming redistribution of welding pad
04/02/2014CN102484096B Selective nanotube growth inside vias using an ion beam
04/02/2014CN102456667B Pad structure having contact bars extending into substrate and wafer having the pad structure
04/02/2014CN102449020B Resin composition for semiconductor encapsulation, and semiconductor device
04/02/2014CN102446894B High-performance metal-oxide-metal capacitor and manufacturing method thereof
04/02/2014CN102412228B Coaxial through-silicon via interconnected structure and fabrication method thereof
04/02/2014CN102365737B Method of producing substrate for semiconductor element, and semiconductor device
04/02/2014CN102356109B Inclusion complex, curing agent, cure accelerator, epoxy resin composition, and epoxy resin composition for encapsulation of semiconductor
04/02/2014CN102299053B Semiconductor device and manufacturing method thereof
04/02/2014CN102295895B Thermosetting double-sided adhesive film having excellent adhesive property and heat resistant property
04/02/2014CN102290425B Method of fabricating semiconductor device having three-dimensional stacked structure
04/02/2014CN102265394B Structure for multi-row leadframe and semiconductor package thereof and manufacture method thereof
04/02/2014CN102224588B Shielding for integrated capacitors
04/02/2014CN102047398B Bonded structure and bonding method for bonded structure
04/02/2014CN101945560B Heat abstractor
04/02/2014CN101752326B Power quad flat no-lead semiconductor die packages with isolated heat sink for high-voltage, high-power applications, systems using the same, and methods of making the same
04/02/2014CN101651107B Substrate joining method and 3-d semiconductor device
04/02/2014CN101567381B Organic electroluminescent device and electronic apparatus
04/01/2014US8687378 High-frequency module
04/01/2014US8687357 Electric power converter
04/01/2014US8686574 Semiconductor device
04/01/2014US8686573 Semiconductor device
04/01/2014US8686572 Apparatus for stacking integrated circuits
04/01/2014US8686571 Bonding layer structure and method for wafer to wafer bonding
04/01/2014US8686570 Multi-dimensional integrated circuit structures and methods of forming the same
04/01/2014US8686569 Die arrangement and method of forming a die arrangement
04/01/2014US8686568 Semiconductor package substrates having layered circuit segments, and related methods
04/01/2014US8686567 Semiconductor device having plural wiring layers
04/01/2014US8686566 In situ-built pin-grid arrays for coreless substrates, and methods of making same
04/01/2014US8686565 Stacked chip assembly having vertical vias
04/01/2014US8686564 Semiconductor device
04/01/2014US8686563 Methods of forming fine patterns in the fabrication of semiconductor devices
04/01/2014US8686560 Wafer-level chip-scale package device having bump assemblies configured to mitigate failures due to stress
04/01/2014US8686559 Semiconductor chip stacking for redundancy and yield improvement
04/01/2014US8686558 Thermally and electrically enhanced ball grid array package
04/01/2014US8686557 Illumination device comprising a light-emitting diode
04/01/2014US8686555 Integrated heater on MEMS cap for wafer scale packaged MEMS sensors
04/01/2014US8686554 Vertically mountable semiconductor device package
04/01/2014US8686553 Semiconductor device and a method of manufacturing the same
04/01/2014US8686552 Multilevel IC package using interconnect springs
04/01/2014US8686551 Substrate for a microelectronic package and method of fabricating thereof
04/01/2014US8686550 Method and apparatus for high pressure sensor device
04/01/2014US8686549 Reconfigurable elements
04/01/2014US8686548 Wiring substrate, method for manufacturing wiring substrate, and semiconductor package including wiring substrate
04/01/2014US8686547 Stack die structure for stress reduction and facilitation of electromagnetic shielding
04/01/2014US8686546 Combined packaged power semiconductor device
04/01/2014US8686545 Semiconductor device and method for manufacturing the same
04/01/2014US8686544 Semiconductor device
04/01/2014US8686543 3D chip package with shielded structures
04/01/2014US8686538 Semiconductor device with a fuse formed by a damascene technique and a method of manufacturing the same
04/01/2014US8686536 Electrical fuse structure and method of formation
04/01/2014US8686509 Semiconductor structure and method for manufacturing the same
04/01/2014US8686508 Structures, methods and applications for electrical pulse anneal processes
04/01/2014US8686507 System and method for I/O ESD protection with floating and/or biased polysilicon regions
04/01/2014US8686486 Memory device
04/01/2014US8686476 Resistance-switching memory cells adapted for use at low voltage
04/01/2014US8685851 MOS device with memory function and manufacturing method thereof
04/01/2014US8685795 Flank wettable semiconductor device
04/01/2014US8685793 Chip assembly having via interconnects joined by plating
04/01/2014US8685792 Integrated circuit package system with interposer
04/01/2014US8685791 Ribbon bonding in an electronic package
04/01/2014US8685789 Ribbon bonding in an electronic package
03/2014
03/27/2014WO2014047338A1 System and method of improved micro channel performance
03/27/2014WO2014047154A1 New advanced multi-purpose multistage evaporative cold water/cold air generating and supply system
03/27/2014WO2014046772A1 Heat sinking and electromagnetic shielding structures
03/27/2014WO2014046323A1 Package module and manufacturing method thereof
03/27/2014WO2014046308A1 Highly refractive surface treatment agent, and fine member and optical material surface-treated using the same
03/27/2014WO2014046307A1 Surface treatment agent for optical material, and optical material
03/27/2014WO2014046150A1 Photocurable composition and method of manufacturing film using the composition
03/27/2014WO2014046133A1 Package for accommodating electronic part, and electronic device
03/27/2014WO2014046130A1 Bonding structure for aluminum member and copper member
03/27/2014WO2014046095A1 Epoxy and alkoxy silyl group-containing silsesquioxane and composition thereof
03/27/2014WO2014046088A1 Anisotropic conductive adhesive and connection structure
03/27/2014WO2014046058A1 Power module semiconductor device and inverter device, power module semiconductor device producing method, and mold
03/27/2014WO2014046052A1 Chip support substrate, method for supporting chip, three-dimensional integrated circuit, assembly device, and method for manufacturing three-dimensional integrated circuit
03/27/2014WO2014046004A1 Electronic control apparatus
03/27/2014WO2014045766A1 Semiconductor device and semiconductor device manufacturing method
03/27/2014WO2014045758A1 Power semiconductor module
03/27/2014WO2014045714A1 Cooling device, heat reception unit and boiling unit used therein, and method for manufacturing same
03/27/2014WO2014045711A1 Semiconductor module
03/27/2014WO2014045701A1 Production method for semiconductor device
03/27/2014WO2014045671A1 Electronic device
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