Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2005
08/16/2005US6930031 Bumping process
08/16/2005US6930017 Wafer Cleaning method and resulting wafer
08/16/2005US6930010 Method of forming a conductive structure in a semiconductor material
08/16/2005US6929982 Patterning layers comprised of spin-on ceramic films
08/16/2005US6929981 Package design and method of manufacture for chip grid array
08/16/2005US6929979 Method for packaging semiconductor device
08/16/2005US6929978 Method of fabricating an integrated circuit package utilizing a conductive structure for improving the bond strength between an IC package and a printed circuit board
08/16/2005US6929974 Feedthrough design and method for a hermetically sealed microdevice
08/16/2005US6929971 Semiconductor device and its manufacturing method
08/16/2005US6929965 Early response to plasma/charging damage by special pattern design of active region
08/16/2005US6929963 Semiconductor component and method of manufacture and monitoring
08/16/2005US6929961 Dual function array feature for CMP process control and inspection
08/16/2005US6929900 for detection of intrusion by mechanical means for the purpose of reading the data stored in a memory; method making involves steps of screen printing and photolithography
08/16/2005US6929848 Sheet material especially useful for circuit boards
08/16/2005US6929726 Sputtering target, Al interconnection film, and electronic component
08/16/2005US6929485 Lead frame with interdigitated pins
08/16/2005US6929058 Cold plate with vortex generator
08/16/2005US6928850 Method and tooling for z-axis offset of lead frames
08/16/2005US6928719 Method for fabricating surface acoustic wave filter package
08/16/2005US6928718 hermetic sealing; flip chips; dies
08/16/2005CA2376907C Hermetically sealing package for optical semiconductor and optical semiconductor module
08/16/2005CA2350747C Improved transfer molding of integrated circuit packages
08/11/2005WO2005074346A1 Mounting system for high-mass heatsinks
08/11/2005WO2005074340A1 Multilayer printed wiring board and method for manufacturing same
08/11/2005WO2005074339A1 Partially etched dielectric film with conductive features
08/11/2005WO2005074029A1 Module and mounting structure using the same
08/11/2005WO2005074028A1 Component comprising sensitive structures, and method for the production thereof
08/11/2005WO2005074027A2 Integrated circuit chip with electrostatic discharge protection device
08/11/2005WO2005074026A2 Tin-based coating of electronic component
08/11/2005WO2005074013A2 Silicon carbide on diamond substrates and related devices and methods
08/11/2005WO2005073741A1 Method and apparatus for testing integrated circuits for susceptibility to latch-up
08/11/2005WO2005072248A2 Area array packages with overmolded pin-fin heat sinks
08/11/2005WO2005072095A2 Method of treating microelectronic substrates
08/11/2005WO2005050257A8 High temperature imaging device
08/11/2005WO2005048347A3 Power module
08/11/2005WO2005045931A3 Semiconductor chip having flip-chip contacts and method for producing the same
08/11/2005WO2005043602A3 Three-dimensional inductive micro components
08/11/2005WO2005013330A3 Crack stop for low k dielectrics
08/11/2005WO2005008774A3 Semiconductor chip comprising terminal contact areas grouped together in a confined zone
08/11/2005WO2005008772A3 Electronic component and flat conductor frame comprising a structured metal layer which is non-wettable by a solder material for the production of the component
08/11/2005WO2004107829A3 A novel packaging method for microstructure and semiconductor devices
08/11/2005WO2004095897A3 Electrical contact
08/11/2005WO2004064158A3 Component with ultra-high frequency connections in a substrate
08/11/2005US20050176835 Thermally conductive thermoplastic resin compositions
08/11/2005US20050176273 Integrated circuit redistribution package
08/11/2005US20050176255 Electronic package repair process
08/11/2005US20050176235 Manufacturing method of semiconductor device
08/11/2005US20050176233 Wafer-level chip scale package and method for fabricating and using the same
08/11/2005US20050176232 Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles
08/11/2005US20050176195 Decoupling capacitor
08/11/2005US20050176184 Semiconductor device fabrication method
08/11/2005US20050176181 Method for edge sealing barrier films
08/11/2005US20050176178 Method for manufacturing semiconductor device
08/11/2005US20050176175 Method of manufacturing hybrid integrated circuit device
08/11/2005US20050176174 Methodof making an integrated circuit
08/11/2005US20050176173 Chip-on-board module, and method of manufacturing the same
08/11/2005US20050176171 Semiconductor device and its manufacturing method
08/11/2005US20050176168 Package structure of optical device and method for manufacturing the same
08/11/2005US20050175984 Molecular device, molecule array, rectifier device, rectifying method, sensor device, switching device, circuit device, logical circuit device, operational device and information processing device
08/11/2005US20050175938 hybrid microelectronic device; commercially fabricate a viable integrated capacitor in the thin film industry, using conventional thin film technologies; efficiency, accuracy, low production cost
08/11/2005US20050175846 Electron beam evaporation deposition of glass; hermetic sealing; simple; accurately structured on substrates having varied dimensions
08/11/2005US20050175838 Thermal interface material
08/11/2005US20050175773 Metal/ceramic bonding member and method for producing same
08/11/2005US20050175385 Method of producing printed circuit board with embedded resistor
08/11/2005US20050174874 High-frequency power amplifier module
08/11/2005US20050174740 Heat radiation structure of semiconductor element and heat sink
08/11/2005US20050174739 Heat sink mounting device
08/11/2005US20050174738 Method and structure for heat sink attachment in semiconductor device packaging
08/11/2005US20050174707 ESD protection circuit
08/11/2005US20050174553 Mask-making member and its production method, mask and its making method, exposure process, and fabrication method of semiconductor device
08/11/2005US20050174522 Liquid crystal display device, method for fabricating the same, and portable telephone using the same
08/11/2005US20050174520 Active matrix type liquid crystal display and manufacture method therefor
08/11/2005US20050174503 Thin film transistor array panel and liquid crystal display including the panel
08/11/2005US20050174500 Display device and method for fabricating the same
08/11/2005US20050174469 Wiring substrate, solid-state imaging apparatus using the same, and manufacturing method thereof
08/11/2005US20050174193 FBAR based duplexer device and manufacturing method thereof
08/11/2005US20050173813 Electronic component and fabricating method
08/11/2005US20050173812 Microsystem enclosure and method of hermetic sealing
08/11/2005US20050173811 Optically interactive device package array
08/11/2005US20050173810 Sensor device
08/11/2005US20050173809 Wafer-level package and method for production thereof
08/11/2005US20050173808 Electronic component and fabricating method
08/11/2005US20050173807 High density vertically stacked semiconductor device
08/11/2005US20050173806 Semiconductor device having bonding pad above low-k dielectric film and manufacturing method therefor
08/11/2005US20050173805 Micro pin grid array with pin motion isolation
08/11/2005US20050173804 Interlayer dielectric film, and method for forming the same and interconnection
08/11/2005US20050173802 Semiconductor device having a dummy pattern
08/11/2005US20050173801 Semiconductor device
08/11/2005US20050173800 Process for making fine pitch connections between devices and structure made by the process
08/11/2005US20050173799 Interconnect structure and method for its fabricating
08/11/2005US20050173798 Semiconductor device and method of manufacturing the same
08/11/2005US20050173797 Electronic component and fabricating method
08/11/2005US20050173796 Microelectronic assembly having array including passive elements and interconnects
08/11/2005US20050173795 Socket grid array
08/11/2005US20050173794 High density direct connect LOC assembly
08/11/2005US20050173793 Quad flat non-leaded package comprising a semiconductor device
08/11/2005US20050173792 Structure for isolating thermal interface material
08/11/2005US20050173791 Wire-bonding method and semiconductor package using the same
08/11/2005US20050173789 Ultra-thin wafer level stack packaging method and structure thereof
08/11/2005US20050173788 Semiconductor package having wire bonded die and multi layer metal bumps
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