Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2005
08/18/2005US20050180113 Heat transfer mechanism, heat dissipation system, and communication apparatus
08/18/2005US20050180111 Low thermal stress composite heat sink assembly
08/18/2005US20050180110 Heat dissipation structure
08/18/2005US20050180108 Electronic apparatus
08/18/2005US20050180107 Electronic apparatus having liquid cooling system therein
08/18/2005US20050180106 Liquid cooling system and electronic apparatus having the same therein
08/18/2005US20050180105 Redundant liquid cooling system and electronic apparatus having the same therein
08/18/2005US20050180104 Cooling unit and flow distributing element for use in such unit
08/18/2005US20050180103 Electrical apparatus and heat sink device thereof
08/18/2005US20050180076 Electrostatic discharge protection circuit
08/18/2005US20050179477 Integrated circuit and method for generating a ready signal
08/18/2005US20050179213 Non-repeated and non-uniform width seal ring structure
08/18/2005US20050179143 Semiconductor component having stiffener, circuit decal and terminal contacts
08/18/2005US20050179140 Formation of interconnect structures by removing sacrificial material with supercritical carbon dioxide
08/18/2005US20050179137 Semiconductor device having copper damascene interconnection and fabricating method thereof
08/18/2005US20050179136 Multi-layer substrate module and wireless terminal device
08/18/2005US20050179135 Semiconductor device having porous structure
08/18/2005US20050179134 Semiconductor device having multilayer structure and method for manufacturing thereof
08/18/2005US20050179133 Semiconductor device
08/18/2005US20050179131 Semiconductor device and manufacturing method thereof
08/18/2005US20050179130 Semiconductor device
08/18/2005US20050179129 High-frequency wiring structure and method for producing the same
08/18/2005US20050179128 Semiconductor device with capacitor
08/18/2005US20050179127 Stack MCP and manufacturing method thereof
08/18/2005US20050179126 Diamond-silicon hybrid integrated heat spreader
08/18/2005US20050179125 Thermally enhanced metal capped BGA package
08/18/2005US20050179124 Method for fabricating semiconductor component with stiffener and circuit decal
08/18/2005US20050179123 Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness
08/18/2005US20050179122 IC card
08/18/2005US20050179120 Process for producing semiconductor device, semiconductor device, circuit board and electronic equipment
08/18/2005US20050179119 Miniaturized chip scale package structure
08/18/2005US20050179118 Method of forming a semiconductor package and leadframe therefor
08/18/2005US20050179117 Composition of dielectric for plasma display panel
08/18/2005US20050179116 Semiconductor device and a method of manufacture therefor
08/18/2005US20050179115 Semiconductor device and a method of manufacture therefor
08/18/2005US20050179114 Semiconductor device and method of manufacturing the same
08/18/2005US20050179110 Semiconductor integrated circuit device
08/18/2005US20050179093 Buried guard ring and radiation hardened isolation structures and fabrication methods
08/18/2005US20050179088 ESD protective apparatus for a semiconductor circuit having an ESD protective circuit which makes contact with a substrate or guard ring contact
08/18/2005US20050179087 LDMOS transistor with improved ESD protection
08/18/2005US20050179069 Semiconductor device and method of manufacturing same
08/18/2005US20050179068 Integrated semiconductor circuit having a logic and power metallization without intermetal dielectric
08/18/2005US20050179062 Semiconductor device and method of manufacturing the same
08/18/2005US20050179058 Semiconductor memory device and defect remedying method thereof
08/18/2005US20050179057 System semiconductor device and method of manufacturing the same
08/18/2005US20050179055 ESD protection structure with lower maximum voltage
08/18/2005US20050179035 Apparatus and method to access a plurality of pn-junctions with a limited number of pins
08/18/2005US20050178820 Microsystem enclosure and method of hermetic sealing
08/18/2005US20050178815 Method for preparing integrated circuit modules for attachment to printed circuit substrates
08/18/2005US20050178657 Systems and methods of plating via interconnects
08/18/2005US20050178581 Underfilling efficiency by modifying the substrate design of flip chips
08/18/2005US20050178574 Electronic part mounting substrate, electronic part, and semiconductor device
08/18/2005US20050178533 Liquid cooling system and an electronic apparatus having the same therein
08/18/2005US20050178532 Structure for expanding thermal conducting performance of heat sink
08/18/2005US20050178531 Fluid passage arrangement of a heat absorber for use in a liquid-cooling type cooling apparatus
08/18/2005US20050178530 Heat absorber and its fabrication
08/18/2005US20050178529 Cooling system or electronic apparatus, and electronic apparatus using the same
08/18/2005US20050178528 Electronic apparatus having cooling system, radiator thereof, and method for manufacturing thereof
08/18/2005US20050178527 Heat dissipation device for electronic device
08/18/2005US20050178526 Liquid cooling system, and electronic apparatus having the same therein
08/18/2005US20050178498 Method for sealing electroluminescence display devices
08/18/2005US20050178423 Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same
08/18/2005US20050178004 Heat absorber and its fabrication
08/18/2005US20050178001 Semiconductor package assembly and method for electrically isolating modules
08/18/2005DE20221237U1 Cooling of an electronic processor module uses a finned heat sink held in contact with a heat distributing plate.
08/18/2005DE19835453B4 Verfahren zum Messen der Temperatur eines Leistungshalbleiters und Bauelement A method for measuring the temperature of a power semiconductor component and
08/18/2005DE10393164T5 Nicht vergossenes Gehäuse auf einer Substratbasis Not casted housing on a substrate base
08/18/2005DE10356119B3 Elektronisches Bauelement mit elektrische Kontaktflächen aufweisenden nachgiebigen Erhebungen und Verfahren zu dessen Herstellung Electronic component having electrical contact areas having resilient projections and process for its preparation
08/18/2005DE10329329B4 Hochfrequenz-Gehäuse und Verfahren zu seiner Herstellung High-frequency package and process for its preparation
08/18/2005DE10317182B4 Befestigungseinrichtung für mindestens ein elektronisches Bauelement an einem Kühlkörper Fastening means for at least one electronic component to a heat sink
08/18/2005DE102005003477A1 Verfahren zur Herstellung einer Halbleitervorrichtung mit Elektroden an Haupt- und Rückseiten eines Halbleiterchips A process for producing a semiconductor device with electrodes at the main and back sides of a semiconductor chip
08/18/2005DE102005002767A1 Halbleiteranordnung Semiconductor device
08/18/2005DE102004061930A1 Optischer Koppler und damit ausgerüstete elektronische Einrichtung An optical coupler and thus equipped electronic device
08/18/2005DE102004039906A1 Electronic component with a number of integrated members, is formed by producing members with a surface that contains a circuit, and connecting components using bond wires
08/18/2005DE102004005255A1 Verfahren zum Anordnen einer Leitungsstruktur auf einem Substrat und Substrat mit der Leitungsstruktur A method of disposing a line structure on a substrate and substrate with the conduit structure
08/18/2005DE102004005129A1 Bauelement mit empfindlichen Bauelementstrukturen und Verfahren zur Herstellung Component having sensitive device structures and processes for making
08/18/2005DE102004004221A1 Apparatus for transporting heat in laterally built semiconductors controlled by electric effects having heat conductors over or under the semiconductor material
08/18/2005DE102004003863A1 Technik zur Herstellung eingebetteter Metallleitungen mit einer erhöhten Widerstandsfähigkeit gegen durch Belastung hervorgerufenen Materialtransport Technology for the production of embedded metal lines with increased resistance caused by load material handling
08/18/2005DE102004003853A1 Konzept zur Kompensation von Piezo-Einflüssen auf eine integrierte Schaltunganordnung Concept for compensation of piezo influences on an integrated circuit arrangement
08/18/2005DE102004003342A1 High frequency arrangement having high frequency terminals on an antenna carrier and on an integrated circuit coupled to each ohter
08/18/2005DE10009733B4 Halbleitervorrichtung und Verfahren zum Herstellen derselben A semiconductor device and method of manufacturing the same
08/18/2005CA2554793A1 Three dimensional packaging and cooling of mixed signal, mixed power density electronic modules
08/17/2005EP1564839A2 Semiconductor chip with coil antenna and communication system with such a semiconductor chip
08/17/2005EP1564811A2 Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness
08/17/2005EP1564810A1 Semiconductor device and manufacturing method thereof
08/17/2005EP1564809A1 Liquid cooling system and electronic apparatus comprising that system
08/17/2005EP1564808A1 Electronic apparatus having liquid cooling system therein
08/17/2005EP1564807A2 Semiconductor device and manufacturing method of the same
08/17/2005EP1564806A1 Semiconductor device and manufacturing method of the same
08/17/2005EP1564803A1 Submount and semiconductor device
08/17/2005EP1564626A1 A liquid cooling system and an electronic apparatus having the same therein
08/17/2005EP1564314A1 Metal plating structure and method for production thereof
08/17/2005EP1564269A1 Composition for porous film formation, porous film, process for producing the same, interlayer insulation film and semiconductor device
08/17/2005EP1563570A1 Integrated circuit package including miniature antenna
08/17/2005EP1563540A2 Folded-flex bondwire-less multichip power package
08/17/2005EP1563539A1 Forming a cap above a metal layer
08/17/2005EP1563538A1 Device comprising circuit elements connected by bonding bump structure
08/17/2005EP1563537A1 Integrated circuit with at least one bump
08/17/2005EP1563536A1 System and method for mounting a heat sink
08/17/2005EP1563451A1 Data carrier with a module with a reinforcement strip
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