Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2005
08/17/2005EP1451771B1 Method for making a module comprising at least an electronic component
08/17/2005EP1124882B1 PREPARATION OF CROSS-LINKED 2-DIMENSIONAL POLYMERS WITH SIDEDNESS FROM $g(a),$g(b)-LACTONES
08/17/2005EP0859686B1 Fabricating interconnects and tips using sacrificial substrates
08/17/2005CN2718788Y Packed surface adhesive luminous diode with anti-electrostatic non-conducting wire overlay transistor
08/17/2005CN2718783Y Anti-GLITCH attack circuit
08/17/2005CN2718782Y Semiconductor packaging and lead wire frame thereof
08/17/2005CN2718781Y Heat sink capable of detecting airflow state
08/17/2005CN2718780Y External hanging auxiliary radiator apparatus
08/17/2005CN2718779Y Radiation apparatus
08/17/2005CN2718778Y 半导体基材构造 A semiconductor substrate structure
08/17/2005CN2718652Y Liquid cooling device for portable electronic device
08/17/2005CN1656864A Cooling element for an electronic device
08/17/2005CN1656862A Nanoparticle filled underfill
08/17/2005CN1656861A Improved structure of stacked vias in multiple layer electronic device carriers
08/17/2005CN1656612A Glass material for use at high frequencies
08/17/2005CN1656611A Semiconductor device mounting board, method of manufacturing the same, method of inspecting the same, and semiconductor package
08/17/2005CN1656607A Methods for manufacturing compound semiconductor and compound insulator using chemical reaction and diffusion by heating, compound semiconductor and compound insulator manufactured using the method, a
08/17/2005CN1656605A Nickel silicide with reduced interface roughness
08/17/2005CN1656433A Providing in package power supplies for integrated circuits
08/17/2005CN1655666A Liquid circulation type cooling system
08/17/2005CN1655356A Integrated circuit device and fabrication method therefor
08/17/2005CN1655354A IGBT module
08/17/2005CN1655353A Stack MCP and manufacturing method thereof
08/17/2005CN1655352A Method and device for storing and presetting microelectronic circuit status
08/17/2005CN1655351A Semiconductor device and method of manufacturing the same
08/17/2005CN1655350A Semiconductor device
08/17/2005CN1655349A Semiconductor device and method of manufacturing the same
08/17/2005CN1655348A Electronic part mounting substrate, electronic part, and semiconductor device
08/17/2005CN1655346A A heat radiation needle arrangement for improving LED temperature rise
08/17/2005CN1655345A Heat abstractor and method for making same
08/17/2005CN1655344A Heating radiator and method for making same
08/17/2005CN1655343A Pre-soldering arrangement for semiconductor packaging substrate and method for making same
08/17/2005CN1655342A Device package and methods for the fabrication and testing thereof
08/17/2005CN1655334A Method for fabrication of a contact structure
08/17/2005CN1655185A Semiconductor chip with coil antenna and communication system with such a semiconductor chip
08/17/2005CN1654963A 传感器装置 The sensor device
08/17/2005CN1654690A Copper alloy material for integrated circuit lead frame and manufacturing process thereof
08/17/2005CN1654538A Epoxy resin composition and method for producing epoxy resin composition and semiconductor device obtained thereby
08/17/2005CN1215752C Electronic device
08/17/2005CN1215751C Heatsink
08/17/2005CN1215742C Welding pad for printed circuit board and forming method thereof
08/17/2005CN1215566C Photoelectronic device and making method thereof
08/17/2005CN1215557C Semiconductor device
08/17/2005CN1215542C Semiconductor device and its making method
08/17/2005CN1215541C Wafer type encapsulation and its preparing method
08/17/2005CN1215539C Compound semiconductor device manufacture
08/17/2005CN1215537C Elements with resin shell capsulation
08/17/2005CN1215532C Superposed mark structure and its measurement application
08/17/2005CN1215502C Synthetic multi-layer ceramic electronic component and mfg. method thereof
08/17/2005CN1215109C Flame retardant epoxy molding compositions
08/17/2005CN1215049C Polybenzoxazole resin and precursor thereof
08/16/2005US6930920 Low voltage non-volatile memory cell
08/16/2005US6930885 Densely packed electronic assemblage with heat removing element
08/16/2005US6930884 Land grid array assembly using a compressive liquid
08/16/2005US6930882 Processor shroud adaptor for multiple CPU locations
08/16/2005US6930879 Electronic module
08/16/2005US6930732 Array substrate for a liquid crystal display
08/16/2005US6930584 Microminiature power converter
08/16/2005US6930504 Semiconductor integrated circuit device
08/16/2005US6930501 Method for determining an ESD/latch-up strength of an integrated circuit
08/16/2005US6930499 Method of manufacturing an integrated circuit, integrated circuit obtained in accordance with said method, wafer provided with an integrated circuit obtained in accordance with the method, and system comprising an integrated circuit obtained by means of the method
08/16/2005US6930401 flat plate semiconductor and dumets connected to surface electrodes on front and back surfaces of the semiconductor and to lead wires are encapsulated in glass tube
08/16/2005US6930400 Grid array microelectronic packages with increased periphery
08/16/2005US6930398 light-sensing area includes a plurality of light sensing devices; black sealing glue coating for improving image sensing sensitivity
08/16/2005US6930397 semiconductor package includes metal can which receives in its interior space a MOSFET electrically connected to can by a layer of conductive epoxy or a solder
08/16/2005US6930394 Electronic device includes an insulating film having density or carbon concentration varying gradually in the direction of the thickness and a conductive film formed therein
08/16/2005US6930393 Composition for forming porous film, porous film and method for forming the same, interlayer insulator film, and semiconductor device
08/16/2005US6930392 Electronic parts packaging structure and method of manufacturing the same
08/16/2005US6930391 multilayer interconnection structure formed on a substrate, that includes a barrier layer, and a conductive seed layer, wherein the improvement includes an electroplated metal alloy layer including at least three elements, iron, cobalt, and nickel
08/16/2005US6930389 Under bump metallization structure of a semiconductor wafer
08/16/2005US6930388 Semiconductor device and method for manufacturing the same and semiconductor device-mounted structure
08/16/2005US6930387 Dicing tape and die ejection method
08/16/2005US6930386 Shock hardened mounting and cooling of a semiconductor device
08/16/2005US6930385 Cascaded die mountings with spring-loaded contact-bond options
08/16/2005US6930384 Tape carrier package
08/16/2005US6930383 Electronic component including a housing and a substrate
08/16/2005US6930382 Semiconductor device and method of manufacturing the same
08/16/2005US6930381 Wire bonding method and apparatus for integrated circuit
08/16/2005US6930380 Semiconductor device
08/16/2005US6930379 Power gridding scheme
08/16/2005US6930378 Stacked semiconductor die assembly having at least one support
08/16/2005US6930377 pattern layer is made of an epoxy ink or adhesive; it may be formed on the surface of the package in a variety of ways, including screening, stencil printing, or photolithography for example
08/16/2005US6930373 Circuit arrangement
08/16/2005US6930355 The reliability of the power MOSFET strap member is greatly improved by connecting a copper or aluminum strap member (Source-Strap) onto a surface source electrode by ultrasonic waves
08/16/2005US6930354 Semiconductor device
08/16/2005US6930341 Integrated circuits including insulating spacers that extend beneath a conductive line
08/16/2005US6930334 High frequency semiconductor device
08/16/2005US6930333 Semiconductor device wiring structure
08/16/2005US6930327 Solid-state imaging device and method of manufacturing the same
08/16/2005US6930324 Device architecture and process for improved vertical memory arrays
08/16/2005US6930323 Test keys structure for a control monitor wafer
08/16/2005US6930322 Combination insulator and organic semiconductor formed from self-assembling block co-polymers
08/16/2005US6930258 Multilayer printed wiring board and method of producing multilayer printed wiring board
08/16/2005US6930052 Method for producing an integrated circuit having at least one metalicized surface
08/16/2005US6930042 Method for producing a semiconductor component with at least one encapsulated chip on a substrate
08/16/2005US6930039 Method of fabricating a contact structure having a composite barrier layer between a platinum layer and a polysilicon plug
08/16/2005US6930037 Process for forming a metal interconnect
08/16/2005US6930036 Semiconductor device and method of manufacturing the same
08/16/2005US6930034 Robust ultra-low k interconnect structures using bridge-then-metallization fabrication sequence
08/16/2005US6930032 Under bump metallurgy structural design for high reliability bumped packages
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