Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2005
08/23/2005US6933531 Heat sink material and method of manufacturing the heat sink material
08/23/2005US6933525 Display device and manufacturing method of the same
08/23/2005US6933524 Semiconductor component having test contacts
08/23/2005US6933523 Semiconductor alignment aid
08/23/2005US6933450 High-frequency signal transmitting device
08/23/2005US6933448 Printed circuit board having permanent solder mask
08/23/2005US6933443 Method for bonding ceramic to copper, without creating a bow in the copper
08/23/2005US6933360 Causing a Grignard reaction of an organometallic silane compound to form a carbon-bridged silane oligomer, removing by-product, mixing intermediate with solvent, water and a catalyst for hydrolysis and condensation to form polysilicate
08/23/2005US6933230 Method for making interconnects and diffusion barriers in integrated circuits
08/23/2005US6933229 Method of manufacturing semiconductor device featuring formation of conductive plugs
08/23/2005US6933228 Method of manufacturing of contact plug in a contact hole on a silicon substrate
08/23/2005US6933227 Semiconductor device and method of forming the same
08/23/2005US6933224 Method of fabricating integrated circuitry
08/23/2005US6933216 Fine particle film forming apparatus and method and semiconductor device and manufacturing method for the same
08/23/2005US6933211 Semiconductor device whose semiconductor chip has chamfered backside surface edges and method of manufacturing the same
08/23/2005US6933208 Method of forming wiring, and method of arranging devices and method of manufacturing image display system by using the same
08/23/2005US6933205 Integrated circuit device and method of manufacturing the same
08/23/2005US6933204 Method for improved alignment of magnetic tunnel junction elements
08/23/2005US6933179 Method of packaging semiconductor device
08/23/2005US6933178 Method of manufacturing semiconductor packages and a clamping device for manufacturing a semiconductor package
08/23/2005US6933177 Aluminum leadframes for semiconductor devices and method of fabrication
08/23/2005US6933176 Ball grid array package and process for manufacturing same
08/23/2005US6933175 Method of fabricating a thin and fine ball-grid array package with embedded heat spreader
08/23/2005US6933174 Leadless leadframe package design that provides a greater structural integrity
08/23/2005US6933173 Method and system for flip chip packaging
08/23/2005US6933171 Large bumps for optical flip chips
08/23/2005US6933170 Packaged microelectronic component assemblies
08/23/2005US6933158 Method of monitoring anneal processes using scatterometry, and system for performing same
08/23/2005US6933156 Semiconductor capacitor with diffusion prevention layer
08/23/2005US6933050 Epoxy resin compositions containing phosphorus, flame retardant resin sheet using said epoxy resin containing phosphorus, resin clad metal foil, prepreg and laminated board, multi layer board
08/23/2005US6932522 Method and apparatus for hermetically sealing photonic devices
08/23/2005US6932077 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions and dicing apparatus
08/23/2005US6931834 Cooling systems
08/23/2005US6931726 Method of making and interconnect structure
08/23/2005US6931725 Circuit component built-in module, radio device having the same, and method for producing the same
08/23/2005US6931724 Insulated multilayered substrate having connecting leads for mounting a semiconductor element thereon
08/23/2005US6931699 Method of producing a surface wave component with a drain for pyroelectric voltage
08/18/2005WO2005076686A1 Three dimensional packaging and cooling of mixed signal, mixed power density electronic modules
08/18/2005WO2005076683A1 Multilayer printed wiring board
08/18/2005WO2005076682A1 Multilayer printed wiring board
08/18/2005WO2005076679A2 Method for disposing a conductor structure on a substrate, and substrate comprising said conductor structure
08/18/2005WO2005076677A1 Method for increasing a routing density for a circuit board and such a circuit board
08/18/2005WO2005076675A1 Method for bonding ceramic to copper, without creating a bow in the copper
08/18/2005WO2005076364A1 Isolated high-voltage ldmos transistor having a split well structure
08/18/2005WO2005076357A1 Single-poly 2-transistor based fuse element
08/18/2005WO2005076353A2 Apparatus incorporating small-feature-size and large-feature-size components and method for making same
08/18/2005WO2005076352A1 Semiconductor device and method for manufacturing semiconductor device
08/18/2005WO2005076351A1 Module with built-in part and its manufacturing method
08/18/2005WO2005076349A1 System and method for stress free conductor removal
08/18/2005WO2005076348A1 System and method for surface reduction, passivation, corrosion prevention and activation of copper surface
08/18/2005WO2005076347A1 Stress free etch processing in combination with a dynamic liquid meniscus
08/18/2005WO2005076319A2 Semiconductor component comprising a semiconductor chip stack on a wiring frame and method for producing the same
08/18/2005WO2005076202A1 Electronic device
08/18/2005WO2005074449A2 Structure comprising amorphous carbon film and method of forming thereof
08/18/2005WO2005074402A2 An integrated circuit
08/18/2005WO2005055316A3 Packaged microelectronic imagers and methods of packaging microelectronic imagers
08/18/2005WO2005045902A3 Semiconductor device and manufacturing method thereof
08/18/2005WO2005036664A3 Organic electronic devices with low thermal resistance and processes for forming and using the same
08/18/2005WO2005028549A3 Nano-composite materials for thermal management applications
08/18/2005WO2005022588A3 Semiconductor component comprising a rewiring layer, and method for the production thereof
08/18/2005WO2005004205A3 Methods for forming patterns of a filled dielectric material on substrates
08/18/2005WO2004107398A3 Semiconductor device with an air gap formed using a photosensitive material
08/18/2005WO2004095514A3 Circuit device with at least partial packaging and method for forming
08/18/2005WO2004044950A3 Semiconductor substrate having copper/diamond composite material and method of making same
08/18/2005WO2003095712A3 Method of and apparatus for forming three-dimensional structures integral with semiconductor based circuitry
08/18/2005US20050182595 Micropattern shape measuring system and method
08/18/2005US20050182172 Particulate alumina, method for producing particulate alumina and composition containing particulate alumina
08/18/2005US20050181684 Electronic component
08/18/2005US20050181680 Semiconductor device
08/18/2005US20050181655 Micro pin grid array with wiping action
08/18/2005US20050181641 Electrical contacts for flexible displays
08/18/2005US20050181628 Process for preparing low dielectric constant material
08/18/2005US20050181623 Silicon carbide deposition for use as a low dielectric constant anti-reflective coating
08/18/2005US20050181615 Integrated circuit process monitoring and metrology system
08/18/2005US20050181600 Method of forming a semiconductor device having a Ti/TiN/Ti<002>/a1<111> laminate
08/18/2005US20050181599 Methods of providing ohmic contact
08/18/2005US20050181597 Method of forming wiring
08/18/2005US20050181582 Contact structure of wiring and a method for manufacturing the same
08/18/2005US20050181575 Semiconductor structures and manufacturing methods
08/18/2005US20050181573 Thin-film capacitor device, mounting module for the same, and method for fabricating the same
08/18/2005US20050181570 Integrated circuit inductane and the fabrication method thereof
08/18/2005US20050181561 Nonvolatile semiconductor memory and manufacturing method thereof
08/18/2005US20050181545 Methods of encapsulating selected locations of a semiconductor die assembly using a thick solder mask
08/18/2005US20050181543 Semiconductor package module and manufacturing method thereof
08/18/2005US20050181542 Single mask via method and device
08/18/2005US20050181541 Method of producing a COF flexible printed wiring board
08/18/2005US20050181540 Semiconductor component and system having thinned, encapsulated dice
08/18/2005US20050181539 Semiconductor device and method of manufacturing same
08/18/2005US20050181537 Method for producing an electrical circuit
08/18/2005US20050181214 Epoxy monomer with hardening, curing and encaqpsulation to makearticles and semiconductors
08/18/2005US20050181213 Thermoconductive curable liquid polymer composition and semiconductor device produced with the use of this composition
08/18/2005US20050181209 Nanotube-containing composite bodies, and methods for making same
08/18/2005US20050181191 Protective ceramic metal hydride coatings on copper circuits for soldering without fluxing; bond wires to copper circuits; electronic package; metal hydride layer was formed by reducing with hydrogen
08/18/2005US20050180609 Method of producing a digital fingerprint sensor and the corresponding sensor
08/18/2005US20050180599 Methods and tangible objects employing textured machine readable data
08/18/2005US20050180122 Electronic circuit module
08/18/2005US20050180117 Semiconductor device and method of manufacturing the same
08/18/2005US20050180116 Heatsink
08/18/2005US20050180115 Protection structure for thermal conducting medium of heat dissipation device
08/18/2005US20050180114 Heat dissipating device incorporating clip
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