| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/24/2005 | CN2720630Y Radiating and heat-collecting device for fin-heat-tube in pipe |
| 08/24/2005 | CN2720629Y Improved structure of radiator fin |
| 08/24/2005 | CN2720628Y Radiator fin combination structure |
| 08/24/2005 | CN2720627Y 散热器 Heat sink |
| 08/24/2005 | CN2720626Y 散热器 Heat sink |
| 08/24/2005 | CN2720625Y Paddle array package |
| 08/24/2005 | CN1659942A Board-level EMI shield with enhanced thermal dissipation |
| 08/24/2005 | CN1659810A Direct-connect signaling system |
| 08/24/2005 | CN1659720A Hermetic encapsulation of organic electro-optical elements |
| 08/24/2005 | CN1659716A Semiconductor device, semiconductor circuit and method for producing semiconductor device |
| 08/24/2005 | CN1659702A Electrical contacts for flexible displays |
| 08/24/2005 | CN1659701A Voltage variable material for direct application and devices employing same |
| 08/24/2005 | CN1659700A Electronic assemblies with high capacity heat sinks and manufacturing method thereof |
| 08/24/2005 | CN1659699A Heat spreader with down set leg attachment feature |
| 08/24/2005 | CN1659698A Quad flat non-leaded package comprising a semiconductor device |
| 08/24/2005 | CN1659695A Wafer pre-alignment apparatus and method |
| 08/24/2005 | CN1659694A Alignment method and mounting method using the alignment method |
| 08/24/2005 | CN1659685A An ultralow dielectric constant material as an intralevel or interlevel dielectric in a semiconductor device |
| 08/24/2005 | CN1659684A Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| 08/24/2005 | CN1658745A Heat radiating apparatus |
| 08/24/2005 | CN1658744A Liquid cooling system and an electronic apparatus |
| 08/24/2005 | CN1658736A 电路装置 Circuit means |
| 08/24/2005 | CN1658394A Image sensor module and camera module package including the same |
| 08/24/2005 | CN1658392A Integrated circuit capable of avoiding bolt-lock effect |
| 08/24/2005 | CN1658388A Electrostatic discharge protection circuit |
| 08/24/2005 | CN1658387A Semiconductor device and manufacturing method thereof |
| 08/24/2005 | CN1658386A Heat sink of integrated circuit chip |
| 08/24/2005 | CN1658385A Semiconductor device and manufacturing method of the same |
| 08/24/2005 | CN1658384A High-frequency wiring structure and method for producing the same |
| 08/24/2005 | CN1658377A Method and apparatus for filling vias |
| 08/24/2005 | CN1658372A Semiconductor device and manufacturing method of the same |
| 08/24/2005 | CN1658124A Electronic apparatus having liquid cooling system therein |
| 08/24/2005 | CN1658123A Liquid cooling system and electronic apparatus having the same therein |
| 08/24/2005 | CN1658122A Cooling system for electronic apparatus, and electronic apparatus using the same |
| 08/24/2005 | CN1658121A Electronic apparatus having cooling system, radiator thereof, and method for manufacturing thereof |
| 08/24/2005 | CN1658120A Redundant liquid cooling system and electronic apparatus having the same therein |
| 08/24/2005 | CN1658119A Liquid cooling system, and electronic apparatus having the same therein |
| 08/24/2005 | CN1658071A Overlay mark for measuring and correcting alignment errors |
| 08/24/2005 | CN1216514C Multi-layer circuit module with multi-layer ceramic substrate and embedded passive element |
| 08/24/2005 | CN1216505C Photoelectric device and electronic apparatus |
| 08/24/2005 | CN1216443C 连接器 Connector |
| 08/24/2005 | CN1216424C Lead-frame land resin sealing member with same, and photoelectronic device |
| 08/24/2005 | CN1216423C Semiconductor device and its production method |
| 08/24/2005 | CN1216422C Manufacturing method and structure of electroplated nickel/gold for electric contact pad of chip package substrate |
| 08/24/2005 | CN1216421C Radiating structure for semiconductor device |
| 08/24/2005 | CN1216420C Chip support capable of setting passive element |
| 08/24/2005 | CN1216419C Wiring baseboard, semiconductor device with wiring baseboard, and mfg. and installing method thereof |
| 08/24/2005 | CN1216418C Substrate for setting passive module |
| 08/24/2005 | CN1216115C Resin composition, film with adhesive for semiconductor device laminated film with metal foil and semiconductor device using same |
| 08/24/2005 | CN1216100C 环氧树脂组合物及半导体装置 Epoxy resin composition and a semiconductor device |
| 08/23/2005 | US6934919 Semiconductor device having embedded array |
| 08/23/2005 | US6934206 Test structure for detecting bridging of DRAM capacitors |
| 08/23/2005 | US6934160 Printed circuit board arrangement |
| 08/23/2005 | US6934157 Universal heat sink retention module frame |
| 08/23/2005 | US6934155 Apparatus and method for a cooling solution fastening assembly |
| 08/23/2005 | US6934154 Micro-channel heat exchangers and spreaders |
| 08/23/2005 | US6934153 Heat sink assembly with fixing mechanism |
| 08/23/2005 | US6934143 Metal-insulator-metal capacitor structure |
| 08/23/2005 | US6934065 Microelectronic devices and methods for packaging microelectronic devices |
| 08/23/2005 | US6933958 Member to be recognized for alignment; head unit and electronic device provided therewith; method of manufacturing lcd, organic el device, electron emission device, pdp device, electrophoretic display device, color filter, and organic el; method of forming spacer, metallic wire, lens, resist, and light diffusion member, each of said methods using said head unit |
| 08/23/2005 | US6933813 Interconnection structure with etch stop |
| 08/23/2005 | US6933739 Ring oscillator system |
| 08/23/2005 | US6933731 Method and system for determining transistor degradation mechanisms |
| 08/23/2005 | US6933619 Electronic package and method of forming |
| 08/23/2005 | US6933618 A tablet for producing a semiconductor device with substantially no bowing, comprising an epoxy resin composition comprising an epoxy resin and a curing agent, wherein the tablet has the characteristic of an amount reduced by heating |
| 08/23/2005 | US6933617 Wafer interposer assembly |
| 08/23/2005 | US6933616 has outward extension portions of under bump metallurgies (UBM) for satisfying the bonding area requirement during wire bonding operation |
| 08/23/2005 | US6933614 Integrated circuit die having a copper contact and method therefor |
| 08/23/2005 | US6933613 Flip chip ball grid array package |
| 08/23/2005 | US6933612 Semiconductor device with improved heatsink structure |
| 08/23/2005 | US6933610 Method of bonding a semiconductor die without an ESD circuit and a separate ESD circuit to an external lead, and a semiconductor device made thereby |
| 08/23/2005 | US6933607 Semiconductor device with bumps on electrode pads oriented in given direction |
| 08/23/2005 | US6933606 Semiconductor device whose semiconductor chip has chamfered backside surface edges and method of manufacturing the same |
| 08/23/2005 | US6933605 Semiconductor package |
| 08/23/2005 | US6933604 Semiconductor device, semiconductor module and hard disk |
| 08/23/2005 | US6933603 Multi-substrate layer semiconductor packages and method for making same |
| 08/23/2005 | US6933602 Semiconductor package having a thermally and electrically connected heatspreader |
| 08/23/2005 | US6933601 Semiconductor connection substrate |
| 08/23/2005 | US6933600 Substrate for semiconductor package |
| 08/23/2005 | US6933599 Electromagnetic noise shielding in semiconductor packages using caged interconnect structures |
| 08/23/2005 | US6933597 Spacer with passive components for use in multi-chip modules |
| 08/23/2005 | US6933596 Ultra wideband BGA |
| 08/23/2005 | US6933595 Electronic device and leadframe and methods for producing the electronic device and the leadframe |
| 08/23/2005 | US6933594 Leadless plastic chip carrier with etch back pad singulation |
| 08/23/2005 | US6933593 Power module having a heat sink |
| 08/23/2005 | US6933592 Substrate structure capable of reducing package singular stress |
| 08/23/2005 | US6933591 Electrically-programmable integrated circuit fuses and sensing circuits |
| 08/23/2005 | US6933590 Semiconductor device comprising plurality of semiconductor areas having the same top surface and different film thicknesses and manufacturing method for the same |
| 08/23/2005 | US6933586 Porous low-k dielectric interconnects with improved adhesion produced by partial burnout of surface porogens |
| 08/23/2005 | US6933584 Solid state imaging device, method of making the same and imaging unit including the same |
| 08/23/2005 | US6933571 Thin film transistors, liquid crystal display device and electronic apparatus using the same |
| 08/23/2005 | US6933570 Semiconductor device equipped with fuel cell and method for producing the same |
| 08/23/2005 | US6933567 Substrate pump ESD protection for silicon-on-insulator technologies |
| 08/23/2005 | US6933565 Semiconductor device and method of manufacturing the same |
| 08/23/2005 | US6933562 Power transistor structure with non-uniform metal widths |
| 08/23/2005 | US6933560 Power devices and methods for manufacturing the same |
| 08/23/2005 | US6933547 Memory cell for modification of default register values in an integrated circuit chip |
| 08/23/2005 | US6933545 Hetero-bipolar transistor having the base interconnection provided on the normal mesa surface of the collector mesa |
| 08/23/2005 | US6933541 Emitter turn-off thyristors (ETO) |
| 08/23/2005 | US6933537 Sealing for OLED devices |