Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2005
08/25/2005US20050184400 Method and structure for interfacing electronic devices
08/25/2005US20050184399 Packaged systems with MRAM
08/25/2005US20050184398 Daisy chaining of serial I/O interface on stacking devices
08/25/2005US20050184397 Structures and methods for intergration of ultralow-k dielectrics with improved reliability
08/25/2005US20050184396 Electrode package for semiconductor device
08/25/2005US20050184395 Electronic device, method of manufacture of the same, and sputtering target
08/25/2005US20050184394 Methods of forming a metal wiring in semiconductor devices using etch stop layers and devices so formed
08/25/2005US20050184393 Multilayer wiring board
08/25/2005US20050184392 Method for fabricating interconnect and interconnect fabricated thereby
08/25/2005US20050184391 Semiconductor device
08/25/2005US20050184390 Optimized power delivery to high speed, high pin-count devices
08/25/2005US20050184388 Seal ring design without stop layer punch through during via etch
08/25/2005US20050184387 Ceramic substrate for a light emitting diode where the substrate incorporates ESD protection
08/25/2005US20050184385 Semiconductor device with improved thermal characteristics
08/25/2005US20050184384 Electronic component and method for producing the same
08/25/2005US20050184383 Packaging of solid state devices
08/25/2005US20050184382 System and methods for hermetic sealing of post media-filled mems package
08/25/2005US20050184380 Semiconductor device and a memory system including a plurality of IC chips in a common package
08/25/2005US20050184378 Semiconductor device package of stacked semiconductor chips
08/25/2005US20050184377 Semiconductor device and method of manufacturing the same
08/25/2005US20050184376 System in package
08/25/2005US20050184375 Electronic device configured as a multichip module, leadframe and panel with leadframe positions
08/25/2005US20050184373 Semiconductor device and fabrication method for the same
08/25/2005US20050184372 Three-dimensional mounting structure and method for producing the same
08/25/2005US20050184371 Circuit carrier
08/25/2005US20050184370 Embedded heat spreader for folded stacked chip-scale package
08/25/2005US20050184369 Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film
08/25/2005US20050184368 Semiconductor package free of substrate and fabrication method thereof
08/25/2005US20050184367 Two die semiconductor assembly and system including same
08/25/2005US20050184366 Lead frame and method for manufacturing semiconductor package with the same
08/25/2005US20050184365 High density lead arrangement package structure
08/25/2005US20050184364 Lead frame for semiconductor package and method of fabricating semiconductor package
08/25/2005US20050184363 Oxygen ion conductor device, method for fabricating oxygen ion conductor device, and oxygen concentration control system
08/25/2005US20050184362 Semiconductor substrate
08/25/2005US20050184358 High performance system-on-chip using post passivation process
08/25/2005US20050184357 Semiconductor element, manufacturing method thereof, and high frequency integrated circuit using the semiconductor element
08/25/2005US20050184352 Image sensor module and camera module package including the same
08/25/2005US20050184344 ESD protection designs with parallel LC tank for Giga-Hertz RF integrated circuits
08/25/2005US20050184342 Semiconductor device and method of manufacturing the same
08/25/2005US20050184315 Semiconductor device including memory cell and anti-fuse element
08/25/2005US20050184313 Semiconductor device and method for mitigating electrostatic discharge (ESD)
08/25/2005US20050184295 Oxygen doped SiC for Cu barrier and etch stop layer in dual damascene fabrication
08/25/2005US20050184289 Device and method for detecting alignment of active areas and memory cell structures in dram devices
08/25/2005US20050184127 Bonding arm swinging type bonding apparatus
08/25/2005US20050183882 Multi-layer circuit board with thermal diffusion and method of fabricating the same
08/25/2005US20050183850 System and method for providing cooling systems with heat exchangers
08/25/2005US20050183849 Heat radiating apparatus
08/25/2005US20050183848 Coolant tray of liquid based cooling device
08/25/2005US20050183847 Microchannel flat-plate heat pipe with parallel grooves for recycling coolant
08/25/2005US20050183846 Heat dissipation interface for semiconductor chip structures
08/25/2005US20050183845 Remedies to prevent cracking in a liquid system
08/25/2005US20050183844 Hotspot spray cooling
08/25/2005US20050183843 Heat sink
08/25/2005US20050183842 Fastening device for a radiator
08/25/2005US20050183543 Silver powder made of silver particles, each to which fine silver particles adhere and process of producing the same
08/25/2005US20050183445 Remedies to prevent cracking in a liquid system
08/25/2005US20050183444 Remedies to prevent cracking in a liquid system
08/25/2005US20050183443 Remedies to prevent cracking in a liquid system
08/25/2005US20050183295 Manufacturing method and manufacturing apparatus for semiconductor device
08/25/2005US20050183282 Method and apparatus for measuring depth of holes formed on a specimen
08/25/2005US20050183265 Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit
08/25/2005DE10306643B4 Anordnung in Druckkontaktierung mit einem Leistungshalbleitermodul Arrangement in pressure contact with a power semiconductor module
08/25/2005DE102005006730A1 Lead frame for semiconductor chip package comprises leads on four sides of frame and tie bars extending from side edges and having recessed bottom surfaces
08/25/2005DE102005001851A1 Multichip package has pad of one semiconductor chip electrically connected to spacer pad which is connected to substrate bonding pad
08/25/2005DE102004063149A1 Fabrication of semiconductor device involves forming protective layer comprising hafnium oxide, on planarized copper layer which is formed by depositing copper in trench pattern on insulating layer
08/25/2005DE102004056449A1 Integrated component, especially for use in motor vehicle, has protective medium with edge- and corner-free surface; protective medium has essentially square surface with rounded edges and corners
08/25/2005DE102004033475A1 Corrosion protection for micromechanical sensor elements, e.g. for a pressure sensor, comprises a passivating agent that at least partially covers electrical components and a material layer applied to the top of the passivator
08/25/2005DE102004009500B3 Cooling unit for electronic components includes fan-like heat sink thermally- and mechanically connected to rotating body in cooling structure containing good thermal conductor
08/25/2005DE102004005022A1 Method for fabricating metallic conductor paths on electronic components, involves forming resist mask on copper seed layer by lithographic structuring
08/25/2005DE102004004808A1 Maintenance of the state of a microelectronic circuit, in which certain circuit sections can be turned off, whereby a scan chain used for circuit testing is also used to collect register contents and then shift them into memory
08/25/2005DE102004004289A1 Integrierte Schaltungsanordnung An integrated circuit device
08/25/2005DE102004003275A1 Verbindungselemente auf Halbleiterchips für Halbleiterbauteile und Verfahren zur Herstellung derselben Connecting elements on semiconductor chips for semiconductor devices and method of manufacturing the same
08/24/2005EP1566883A2 LC oscillator
08/24/2005EP1566837A2 Semiconductor device manufacturing method
08/24/2005EP1566831A2 Semiconductor device and method for manufacturing it
08/24/2005EP1566613A1 Sensor device
08/24/2005EP1566456A1 Composite material, method for producing same and member using same
08/24/2005EP1566417A1 Composition for porous film formation, porous film, process for producing the same, interlayer insulation film and semiconductor device
08/24/2005EP1565940A1 Electronic memory component with protection against light attack
08/24/2005EP1565939A1 Semiconductor device having a bond pad and method for its fabrication
08/24/2005EP1565938A1 Carbonaceous heat spreader and associated methods
08/24/2005EP1565937A1 Power semiconductor module
08/24/2005EP1565932A2 Method for producing and testing a corrosion-resistant channel in a silicon device
08/24/2005EP1565520A1 Curable epoxy compositions, methods and articles made therefrom
08/24/2005EP1470181B1 Improved interface adhesive
08/24/2005EP1421609A4 Process and apparatus for treating a workpiece such as a semiconductor wafer
08/24/2005EP1399951A4 Interchangeable microdeposition head apparatus and method
08/24/2005EP1399950A4 Formation of printed circuit board structures using piezo microdeposition
08/24/2005EP1399269A4 Waveform generator for microdeposition control system
08/24/2005EP1399268A4 Industrial microdeposition system for polymer light emitting diode displays, printed circuit boards and the like
08/24/2005EP1399267A4 Microdeposition apparatus
08/24/2005EP1392449A4 Over-clocking in a microdeposition control system to improve resolution
08/24/2005CN2720645Y Anti-electrostatic package structure for light-emitting diode
08/24/2005CN2720644Y Bent LED support and bent LED made therefrom
08/24/2005CN2720636Y 集成电路 IC
08/24/2005CN2720635Y Semiconductor chip with multiple electrode lead wire parts
08/24/2005CN2720634Y Copper-made sequential structure
08/24/2005CN2720633Y Radiating device
08/24/2005CN2720632Y Special-section heat-tube radiator
08/24/2005CN2720631Y Fin heat-tube radiator
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