Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2005
08/30/2005US6936833 Semiconductor device package having a switcher connecting plural processing elements
08/30/2005US6936775 Selectively configurable circuit board
08/30/2005US6936769 Electronic part mounting substrate, electronic part, and semiconductor device
08/30/2005US6936764 Three dimensional dynamically shielded high-Q BEOL metallization
08/30/2005US6936763 dielectric region is on the substrate and the integrated circuit wherein the substrate and the dielectric region form an outer surface; substrate, dielectric region, and the magnetic material layer are integrated
08/30/2005US6936540 Method of polishing a semiconductor substrate, post-CMP cleaning process, and method of cleaning residue from registration alignment markings
08/30/2005US6936535 Copper interconnect structure having stuffed diffusion barrier
08/30/2005US6936532 Substrate having a plurality of bumps, method of forming the same, and method of bonding substrate to another
08/30/2005US6936531 Process of fabricating a chip structure
08/30/2005US6936527 Low voltage non-volatile memory cell
08/30/2005US6936525 Chip-like electronic components, a method of manufacturing the same, a pseudo wafer therefor and a method of manufacturing thereof
08/30/2005US6936521 Alignment mark and alignment method using the same for photolithography to eliminating process bias error
08/30/2005US6936501 Semiconductor component and method of manufacture
08/30/2005US6936500 Method for the lateral contacting of a semiconductor chip
08/30/2005US6936499 Semiconductor device and fabrication process therefor
08/30/2005US6936498 Package structure with increased capacitance and method
08/30/2005US6936497 Method of forming electronic dies wherein each die has a layer of solid diamond
08/30/2005US6936495 Method of making an optoelectronic semiconductor package device
08/30/2005US6936489 Method and system for electrically coupling a chip to chip package
08/30/2005US6936407 Thin-film electronic device module
08/30/2005US6936377 Card with embedded IC and electrochemical cell
08/30/2005US6936337 Metal/ceramic circuit board
08/30/2005US6936302 Electroless Ni-B plating liquid, electronic device and method for manufacturing the same
08/30/2005US6935420 Heat dissipation assembly
08/30/2005US6935419 Heat sink apparatus with air duct
08/30/2005US6935412 Cooler for electrical and/ or electronic components, linked to present cooling needs
08/30/2005US6935411 Normal-flow heat exchanger
08/30/2005US6935410 Heat sink assembly
08/30/2005US6935409 Cooling apparatus having low profile extrusion
08/30/2005US6935022 Advanced microelectronic heat dissipation package and method for its manufacture
08/25/2005WO2005078854A1 High-frequency module
08/25/2005WO2005078796A1 Electronic component and method for manufacturing the same
08/25/2005WO2005078794A1 Non-planar integrated circuit system
08/25/2005WO2005078793A1 Method for producing a power module and corresponding power module
08/25/2005WO2005078792A1 Electronic device cooling device and electronic device cooling method
08/25/2005WO2005078790A1 Contact portion and manufacturing method thereof, thin film transistor array panel and manufacturing method thereof
08/25/2005WO2005078789A1 Chip-sized filp-chip semiconductor package and method for making the same
08/25/2005WO2005078769A2 Manufacturing integrated circuits
08/25/2005WO2005078739A1 Aluminum alloy wiring material having high resistance to heat and target material
08/25/2005WO2005078013A1 Modifier for resin and resin composition using the same and formed article
08/25/2005WO2005077633A1 Resin sealing method for electronic part and mold used for the method
08/25/2005WO2005064646A3 An integrated circuit package substrate having a thin film capacitor structure
08/25/2005WO2005043482A3 Processor component for contactless signal transmission
08/25/2005WO2005041266A3 Semiconductor device package utilizing proud interconnect material
08/25/2005WO2005039261A3 Solder structures for out of plane connections and related methods
08/25/2005WO2005038880A3 Via density rules
08/25/2005WO2005036642A3 A microelectronic assembly having thermoelectric elements to cool a die and a method of making the same
08/25/2005WO2005011099A3 Switching device, generator-motor apparatus using switching device, drive system including generator-motor apparatus, and computer-readable recording medium on which a program for directing computer to perform control of generator-motor apparatus is recorded
08/25/2005WO2005010925A3 Integrated sensor chip unit
08/25/2005WO2005008765A3 Semiconductor power module with strip conductors which are detached from a substrate as external connections
08/25/2005WO2004083760A3 Multi-level microchannel heat exchangers
08/25/2005US20050186812 Resin substrate
08/25/2005US20050186808 Via grid array sockets for electronics applications
08/25/2005US20050186801 Method of manufacture of semiconductor integrated circuit
08/25/2005US20050186793 Manufacturing method of semiconductor device
08/25/2005US20050186790 Methods of fabricating interconnects for semiconductor components
08/25/2005US20050186786 Method for fabricating metallic interconnects on electronic components
08/25/2005US20050186782 Dual damascene interconnect structure with improved electro migration lifetimes
08/25/2005US20050186777 Methods of fabricating interconnects for semiconductor components
08/25/2005US20050186773 Methods and structures for metal interconnections in integrated circuits
08/25/2005US20050186771 Manufacturing method for semiconductor device and semiconductor device
08/25/2005US20050186770 Methods of fabricating interconnects for semiconductor components
08/25/2005US20050186769 Hexagonal array structure for ball grid array packages
08/25/2005US20050186767 Semiconductor device, apparatus and method for manufacturing the same
08/25/2005US20050186763 Transferring semiconductor crystal from a substrate to a resin
08/25/2005US20050186762 Process for producing semiconductor chips having a protective film on the back surface
08/25/2005US20050186756 Method of forming alignment marks for semiconductor device fabrication
08/25/2005US20050186754 Solid-state imaging apparatus having multiple anti-reflective layers and method for fabricating the multiple anti-reflective layers
08/25/2005US20050186753 FIB exposure of alignment marks in MIM technology
08/25/2005US20050186728 Semiconductor memory device and method for manufacturing the same
08/25/2005US20050186712 Method and apparatus for fabricating self-assembling microstructures
08/25/2005US20050186710 Integrated circuit package provided with cooperatively arranged illumination and sensing capabilities
08/25/2005US20050186708 Method of manufacturing semiconductor device
08/25/2005US20050186707 Chip scale surface mounted device and process of manufacture
08/25/2005US20050186706 Methods of forming semiconductor circuitry
08/25/2005US20050186705 Semiconductor dice having backside redistribution layer accessed using through-silicon vias, methods
08/25/2005US20050186704 Intrinsic thermal enhancement for FBGA package
08/25/2005US20050186703 Method for packaging semiconductor chips and corresponding semiconductor chip system
08/25/2005US20050186702 Semiconductor device manufacturing method and manufacturing apparatus
08/25/2005US20050186697 Fabrication method of an ion sensitive field effect transistor
08/25/2005US20050186689 Method and structure for determining thermal cycle reliability
08/25/2005US20050186437 Novel thin laminate as embedded capacitance material in printed circuit boards
08/25/2005US20050186418 Film splicer and film carrier tape for mounting electronic components
08/25/2005US20050186407 Method of manufacturing ceramic paste and ceramic multi-layer wiring substrate utilizing the same
08/25/2005US20050186123 Methods and materials for the reduction and control of moisture and oxygen in OLED devices
08/25/2005US20050186019 Apparatus and method for die attachment
08/25/2005US20050185479 Method and device for saving and setting a circuit state of a microelectronic circuit
08/25/2005US20050185384 Heat radiating apparatus of electronic component
08/25/2005US20050185382 Substrate for carrying a semiconductor chip and a manufacturing method thereof
08/25/2005US20050185379 Heat sink having compliant interface to span multiple components
08/25/2005US20050185359 Wafer Stage
08/25/2005US20050185248 Microelectromechanical device packages with integral heaters
08/25/2005US20050184742 Device monitor for RF and DC measurement
08/25/2005US20050184651 Light emitting device and fabrication method thereof
08/25/2005US20050184625 Package for electronic component and method of manufacturing piezoelectric device
08/25/2005US20050184405 Semiconductor package for lowering electromagnetic interference and method for fabricating the same
08/25/2005US20050184404 Photosensitive semiconductor package with support member and method for fabricating the same
08/25/2005US20050184403 Semiconductor integrated circuit device
08/25/2005US20050184402 Sheet to form a protective film for chips
08/25/2005US20050184401 Wiring substrate, manufacturing method thereof, and semiconductor device
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