Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2005
09/01/2005DE102004002908A1 Halbleiterbauelement sowie mikromechanische Struktur Semiconductor device and micro-mechanical structure
08/2005
08/31/2005EP1569503A1 Method for supplying solder
08/31/2005EP1569273A2 Conductive lines embedded in isolation regions
08/31/2005EP1569272A2 Apparatus and method for die attachement
08/31/2005EP1569270A2 Manufacturing method of semiconductor device
08/31/2005EP1568978A1 Temperature sensor
08/31/2005EP1568799A1 Metal material for electric electronic component
08/31/2005EP1568797A2 In-situ dry clean chamber for front end of line fabrication
08/31/2005EP1568744A1 Composition for porous film formation, porous film, process for producing the same, interlayer insulation film and semiconductor device
08/31/2005EP1568733A1 Porous inorganic filler particles having an organopolysiloxane coating for use in curable casting compositions
08/31/2005EP1568260A1 Cooling of electric appliance unit
08/31/2005EP1568129A1 Acoustic resonator support, acoustic resonator and corresponding integrated circuit
08/31/2005EP1568079A1 Metal core substrate packaging
08/31/2005EP1568078A1 Forming a copper diffusion barrier
08/31/2005EP1568070A2 Method and structures for enhanced temperature control of high power components on multilayer ltcc and ltcc-m boards
08/31/2005EP1568054A2 Thermal switch, methods of use and manufacturing methods for same
08/31/2005EP1514301A4 Optical fiber arrays with precise hole sizing
08/31/2005EP1430568B1 Metallic surface of a body, method for producing a structured metallic surface of a body and the use thereof
08/31/2005EP1282913B1 Wireless radio frequency testing method of integrated circuits and wafers
08/31/2005EP0952545B1 Ic card
08/31/2005CN2722433Y Coiled pipe water cooled radiator with silicon device
08/31/2005CN2722432Y Supporter in integrated hot-pipe radiator chamber
08/31/2005CN2722431Y Stabilizing stand of radiator
08/31/2005CN1663331A Method for producing an electrical circuit
08/31/2005CN1663330A Socketless package to circuit board assemblies and methods of using same
08/31/2005CN1663327A Ball grid array package
08/31/2005CN1663120A Electronic component comprising a multilayer substrate and corresponding method of production
08/31/2005CN1663048A Interlayer dielectric and pre-applied die attach adhesive materials
08/31/2005CN1663044A Lamp and method of producing a lamp
08/31/2005CN1663042A Member for semiconductor device
08/31/2005CN1663041A Method for the production of an NROM memory cell arrangement
08/31/2005CN1663040A Layer arrangement and process for producing a layer arrangement
08/31/2005CN1663037A COF film carrier tape and its manufacturing method
08/31/2005CN1663036A Electropolishing metal layers on wafers having trenches or vias with dummy structures
08/31/2005CN1662927A Non-contact communication system information carrier
08/31/2005CN1662676A Method for forming ultra low k films using electron beam
08/31/2005CN1662624A Heat curable adhesive composition, article, semiconductor apparatus and method
08/31/2005CN1662620A Method for sealing porous materials during chip production and compounds therefor
08/31/2005CN1662578A Organic silicate polymer and insulation film comprising the same
08/31/2005CN1662122A Multi-layer circuit board with thermal diffusion and method of fabricating the same
08/31/2005CN1662113A Protective circuit of electrostatic discharge suitable to integrated circuit in radio frequency
08/31/2005CN1661815A 光收发器模块 Optical transceiver module
08/31/2005CN1661805A Structure and method for encapsulatig image sensor
08/31/2005CN1661800A Device and method for providing shielding in radio frequency integrated circuits to reduce noise coupling
08/31/2005CN1661799A Semiconductor device
08/31/2005CN1661798A Heat elimination module and preparation method
08/31/2005CN1661797A Constructed configuration of heat sink capable of embedding semiconductor of electronic module
08/31/2005CN1661796A Heat elimination module with high heat radiating efficiency
08/31/2005CN1661795A Encapsulation body of semiconductor chip and encapsulation method
08/31/2005CN1661789A Apparatus and method for wafer attachment
08/31/2005CN1661788A Integrated circuit package provided with cooperatively arranged illumination and sensing capabilities
08/31/2005CN1661787A Lead frame and method for manufacturing semiconductor package with the same
08/31/2005CN1661786A Lead frame for semiconductor package and method of fabricating semiconductor package
08/31/2005CN1660679A Method of mfg. semiconductor device
08/31/2005CN1660560A Film splicer and film carrier tape for mounting electronic components
08/31/2005CN1660529A Silver powder and its mfg.process
08/31/2005CN1660528A Apparatus for transferring heat and method of manufacturing the same
08/31/2005CN1217411C Integrated circuit chip made secure against the action of electromagnetic radiation
08/31/2005CN1217410C Integrated circuit package formed at wafer level
08/31/2005CN1217409C Insulating grid bipolar transistor modular block capable of preventing short circuit
08/31/2005CN1217408C Radiator assembly and radiator assembly fixing device
08/31/2005CN1217407C Packaging substrate
08/31/2005CN1217406C Sheet material for forming chip protection film and method for making semiconductor chip
08/31/2005CN1217403C Multilayer wire distribution device and method thereof, wire distribution characteristic analysing and predicting method
08/31/2005CN1217391C Method for preparing semiconductor device
08/31/2005CN1217355C Coil and coil system to be integrated in microelectronic circuit, and microelectronic circuit
08/31/2005CN1216933C Epoxy-resin system, which are resistant to ageing, moulding materials and components produced therefrom and use thereof
08/30/2005US6937958 Controller for monitoring temperature
08/30/2005US6937477 Structure of gold fingers
08/30/2005US6937474 Chipset cooling device of video graphic adapter card
08/30/2005US6937473 Heatsink device and method
08/30/2005US6937471 Method and apparatus for removing heat from a circuit
08/30/2005US6937458 Selectable decoupling capacitors for integrated circuit and methods of use
08/30/2005US6937457 Decoupling capacitor
08/30/2005US6937118 High-frequency circuit device, resonator, filter, duplexer, and high-frequency circuit apparatus
08/30/2005US6937038 Contactor having conductive particles in a hole as a contact electrode
08/30/2005US6937037 Probe card assembly for contacting a device with raised contact elements
08/30/2005US6936931 For use in semiconductor device
08/30/2005US6936930 Thermal enhance MCM package
08/30/2005US6936929 Multichip packages with exposed dice
08/30/2005US6936928 Semiconductor component and method for its production
08/30/2005US6936927 Circuit device having a multi-layer conductive path
08/30/2005US6936926 Wiring structure in a semiconductor device
08/30/2005US6936924 Semiconductor device with tapered contact hole and wire groove
08/30/2005US6936922 Semiconductor package structure reducing warpage and manufacturing method thereof
08/30/2005US6936921 High-frequency package
08/30/2005US6936920 Voltage contrast monitor for integrated circuit defects
08/30/2005US6936919 Heatsink-substrate-spacer structure for an integrated-circuit package
08/30/2005US6936917 Power delivery connector for integrated circuits utilizing integrated capacitors
08/30/2005US6936916 Microelectronic assemblies and electronic devices including connection structures with multiple elongated members
08/30/2005US6936915 Lead frame having chip mounting part and leads of different thicknesses
08/30/2005US6936914 Integrated circuit chip module
08/30/2005US6936913 High performance vias for vertical IC packaging
08/30/2005US6936912 Active matrix substrate with height control member
08/30/2005US6936911 Semiconductor integrated circuit device
08/30/2005US6936909 Gate dielectric antifuse circuit to protect a high-voltage transistor
08/30/2005US6936906 atomic layer deposition barrier chamber for depositing a barrier layer comprising tantalum nitride;
08/30/2005US6936895 ESD protection device
08/30/2005US6936862 Light emitting diode package
08/30/2005US6936843 Fixture used to prepare semiconductor specimens for film adhesion testing
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