Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2005
09/01/2005US20050191906 Electrical contact
09/01/2005US20050191862 Air gap interconnect structure and method of manufacture
09/01/2005US20050191847 Method for manufacturing semiconductor device
09/01/2005US20050191845 Semiconductor device having a guard ring
09/01/2005US20050191844 Low capacitance wiring layout and method for making same
09/01/2005US20050191841 Semiconductor device and wiring forming method in semiconductor device
09/01/2005US20050191815 Metal-oxide-semiconductor device including a buried lightly-doped drain region
09/01/2005US20050191805 Semiconductor fabrication using a collar
09/01/2005US20050191803 Method of forming a metal film for electrode
09/01/2005US20050191793 Semiconductor packaging techniques for use with non-ceramic packages
09/01/2005US20050191792 Component for fabricating an electronic device and method of fabricating an electronic device
09/01/2005US20050191787 Methods of fabrication of package assemblies for optically interactive electronic devices
09/01/2005US20050191785 Via structure of packages for high frequency semiconductor devices
09/01/2005US20050191772 Manufacturing method of semiconductor device
09/01/2005US20050191770 Flip chip semiconductor die internal signal access system and method
09/01/2005US20050191763 Superconducting integrated circuit and method for fabrication thereof
09/01/2005US20050191476 Epoxy resin composition excellent in weather resistance and fiber-reinforced composite materials
09/01/2005US20050191411 forming apertures in dielectric layers formed on an electrocondutive layer, to expose segments of the electroconductive layer, then doping, filling with conductors and annealing; semiconductor interconnects having electromigration resistance
09/01/2005US20050191057 Optical transceiver module
09/01/2005US20050190628 Semiconductor integrated circuit device
09/01/2005US20050190614 Novel radio frequency (RF) circuit board topology
09/01/2005US20050190538 Heat-dissipating module and structure thereof
09/01/2005US20050190528 Electronic component, method of manufacturing the electronic component, and electronic apparatus
09/01/2005US20050190035 Compact inductor with stacked via magnetic cores for integrated circuits
09/01/2005US20050190021 Waveguide coupler
09/01/2005US20050190020 Reducing line to line capacitance using oriented dielectric films
09/01/2005US20050189956 Electronic components with plurality of contoured microelectronic spring contacts
09/01/2005US20050189659 Semiconductor package free of substrate and fabrication method thereof
09/01/2005US20050189658 Semiconductor device assembly process
09/01/2005US20050189656 Micro-vias for electronic packaging
09/01/2005US20050189655 Integrated circuit chip utilizing carbon nanotube composite interconnection vias
09/01/2005US20050189654 Semiconductor device and method of fabricating the same
09/01/2005US20050189653 Dual damascene intermediate structure and method of fabricating same
09/01/2005US20050189651 Contact formation method and semiconductor device
09/01/2005US20050189650 Low fabrication cost, high performance, high reliability chip scale package
09/01/2005US20050189649 LSI package, LSI element testing method, and semiconductor device manufacturing method
09/01/2005US20050189648 Semiconductor device
09/01/2005US20050189647 Carbonaceous composite heat spreader and associated methods
09/01/2005US20050189646 Packaged die on PCB with heat sink encapsulant and methods
09/01/2005US20050189644 Low coefficient of thermal expansion build-up layer packaging and method thereof
09/01/2005US20050189643 Semiconductor package with crossing conductor assembly and method of manufacture
09/01/2005US20050189642 Apparatus for encapsulating a multi-chip substrate array
09/01/2005US20050189641 Semiconductor package
09/01/2005US20050189640 Interconnect system without through-holes
09/01/2005US20050189639 Semiconductor device
09/01/2005US20050189637 Semiconductor device and manufacturing method thereof
09/01/2005US20050189636 Packaging substrates for integrated circuits and soldering methods
09/01/2005US20050189635 Packaged acoustic and electromagnetic transducer chips
09/01/2005US20050189634 Semiconductor module and method of manufacturing thereof
09/01/2005US20050189633 Chip package structure
09/01/2005US20050189632 Sealed three dimensional metal bonded integrated circuits
09/01/2005US20050189630 Bonding arrangement and method for LTCC circuitry
09/01/2005US20050189629 Method of manufacturing a semiconductor device
09/01/2005US20050189627 Method of surface mounting a semiconductor device
09/01/2005US20050189626 Semiconductor device support structures
09/01/2005US20050189625 Lead-frame for electonic devices with extruded pads
09/01/2005US20050189624 Chip on photosensitive device package structure and electrical connection thereof
09/01/2005US20050189623 Multiple die package
09/01/2005US20050189622 Packaged acoustic and electromagnetic transducer chips
09/01/2005US20050189620 Manufacturing method for semiconductor device, and system to which semiconductor is applied
09/01/2005US20050189618 Redundant interconnect high current bipolar device and method of forming the device
09/01/2005US20050189614 Configurable integrated circuit capacitor array using via mask layers
09/01/2005US20050189613 Semiconductor device as electrically programmable fuse element and method of programming the same
09/01/2005US20050189612 Method for forming copper fuse links
09/01/2005US20050189611 High frequency passive element
09/01/2005US20050189607 Upper-layer metal power standard cell
09/01/2005US20050189603 Semiconductor device
09/01/2005US20050189602 Semiconductor device
09/01/2005US20050189597 Semiconductor device featuring multi-layered electrode structure
09/01/2005US20050189588 Semiconductor structure
09/01/2005US20050189587 LDMOS transistor
09/01/2005US20050189569 Configurable gate array cell with extended poly gate terminal
09/01/2005US20050189568 Apparatus and methods for cooling semiconductor integrated circuit package structures
09/01/2005US20050189540 Module inspection fixture
09/01/2005US20050189517 includes phosphors having a small particle size, narrow particle size distribution, spherical morphology and good crystallinity; utilized in cathode ray tube (CRT) screens for televisions and similar devices
09/01/2005US20050189502 Alignment systems and methods for lithographic systems
09/01/2005US20050189466 Seat for a heat radiator
09/01/2005US20050189342 Miniature fluid-cooled heat sink with integral heater
09/01/2005US20050189332 Chip package sealing method
09/01/2005US20050189140 Chip package structure
09/01/2005US20050189136 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
09/01/2005US20050189096 Compact radiator for an electronic device
09/01/2005US20050189093 Apparatus for transferring heat and method of manufacturing the same
09/01/2005US20050189091 Brazed wick for a heat transfer device and method of making same
09/01/2005US20050189089 Fluidic apparatus and method for cooling a non-uniformly heated power device
09/01/2005US20050189088 Circulation structure of heat dissipation device
09/01/2005US20050188788 Silver powder and method for producing same
09/01/2005DE202005009081U1 Effective cooling for computer electronics is in form of carrier having fan and heat sink and sits on mother board
09/01/2005DE19920445B4 Stapelbaustein aus Halbleiterbausteinen mit integrierter Schaltung ultrahoher Dichte sowie Verfahren zum Herstellen desselben Stack of the same block of semiconductor integrated circuit chips, as well as ultra-high density method for producing
09/01/2005DE19904279B4 Halbleitervorrichtung Semiconductor device
09/01/2005DE10356981B3 Mounting semiconductor chip on substrate, especially circuit board, involves arranging solder filling with solder bead, underfill materials on chip, applying to chip with adhesive band, mounting on substrate, melting by heat treatment
09/01/2005DE10297756T5 Konfektionierung einer Mikrochip-Vorrichtung Packaging a microchip device
09/01/2005DE10297755T5 Konfektionierung einer Mikrochip-Vorrichtung Packaging a microchip device
09/01/2005DE102005004615A1 Oberflächenmontierbare Leuchtdiode und Verfahren zu deren Herstellung A surface-mountable luminescent diode and methods for their preparation
09/01/2005DE102004028410A1 Vorrichtung zum Ableiten von Wärme A device for dissipating heat
09/01/2005DE102004007972B3 Halbleiterstruktur zum Schutz von integrierten Schaltungen vor ESD-Pulsen Semiconductor structure to protect integrated circuits from ESD pulses
09/01/2005DE102004007241A1 Protection circuit for semiconductor integrated circuit e.g. for automobile technology, uses control circuit for driving protection circuit
09/01/2005DE102004007219A1 Method for constructing cooling module has stacked cooling plates with upper and lower coaxial holes to take the cooling pipes and with a small area support block for a thermal mounting
09/01/2005DE102004005666A1 High frequency arrangement for data medium e.g. chip card, has semiconductor body with charge storage made using trench technology and two contact points that are connected to respective pins of another body having integrated circuit
09/01/2005DE102004005664A1 Passivating material, for ceramic electrical components, is a matrix with embedded filling particles which is solid at room temperatures and softens when heated
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