| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 09/06/2005 | US6940162 Semiconductor module and mounting method for same |
| 09/06/2005 | US6940161 Semiconductor device and process for producing the same |
| 09/06/2005 | US6940160 Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument |
| 09/06/2005 | US6940158 Assemblies having stacked semiconductor chips and methods of making same |
| 09/06/2005 | US6940157 High frequency semiconductor module, high frequency semiconductor device and manufacturing method for the same |
| 09/06/2005 | US6940156 Electronic module with a semiconductor chip which has flexible chip contacts, and method for producing the electronic module |
| 09/06/2005 | US6940155 IC package, optical transmitter, and optical receiver |
| 09/06/2005 | US6940154 Integrated circuit package and method of manufacturing the integrated circuit package |
| 09/06/2005 | US6940153 Magnetic shielding for magnetic random access memory card |
| 09/06/2005 | US6940150 Semiconductor wafer device having separated conductive patterns in peripheral area and its manufacture method |
| 09/06/2005 | US6940148 Semiconductor device capable of adjusting input resistance without changing input terminal capacitance |
| 09/06/2005 | US6940147 Integrated inductor having magnetic layer |
| 09/06/2005 | US6940144 Semiconductor equipment |
| 09/06/2005 | US6940142 Low data line capacitance image sensor array using air-gap metal crossover |
| 09/06/2005 | US6940141 Flip-chip image sensor packages and methods of fabrication |
| 09/06/2005 | US6940140 Package structure of solid-state image sensor |
| 09/06/2005 | US6940134 Semiconductor with contact contacting diffusion adjacent gate electrode |
| 09/06/2005 | US6940128 Semiconductor device for power MOS transistor module |
| 09/06/2005 | US6940114 Integrated circuit devices including a MIM capacitor |
| 09/06/2005 | US6940111 Radiation protection in integrated circuits |
| 09/06/2005 | US6940108 Slot design for metal interconnects |
| 09/06/2005 | US6940107 Fuse structures, methods of making and using the same, and integrated circuits including the same |
| 09/06/2005 | US6940094 used to overcome the problem of heat resistance and difficulty in forming contact holes of aluminum wiring; prevents hillock or whisker from generating; liquid crystal display device |
| 09/06/2005 | US6940093 Special contact points for accessing internal circuitry of an integrated circuit |
| 09/06/2005 | US6940053 Chip bonding heater with differential heat transfer |
| 09/06/2005 | US6940022 Protective coating for an electronic device |
| 09/06/2005 | US6940014 Modular electronic equipment enclosure comprising sealed cable interface module |
| 09/06/2005 | US6939812 Method of forming an etch stop layer in a semiconductor device |
| 09/06/2005 | US6939803 Method for forming conductor reservoir volume for integrated circuit interconnects |
| 09/06/2005 | US6939800 Dielectric barrier films for use as copper barrier layers in semiconductor trench and via structures |
| 09/06/2005 | US6939799 Method of forming a field effect transistor and methods of forming integrated circuitry |
| 09/06/2005 | US6939797 Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof |
| 09/06/2005 | US6939793 Dual damascene integration scheme for preventing copper contamination of dielectric layer |
| 09/06/2005 | US6939792 Low-k dielectric layer with overlying adhesion layer |
| 09/06/2005 | US6939790 Wafer bumping process with solder balls bonded to under bump metallurgy layer formed over active surface by forming flux on solder ball surfaces and reflowing the solder |
| 09/06/2005 | US6939789 Method of wafer level chip scale packaging |
| 09/06/2005 | US6939788 Semiconductor device with inductive component and method of making |
| 09/06/2005 | US6939786 Method of manufacturing a semiconductor device having self-aligned contacts |
| 09/06/2005 | US6939784 Wafer scale package and method of assembly |
| 09/06/2005 | US6939777 Method for manufacturing semiconductor device |
| 09/06/2005 | US6939758 Gate length control for semiconductor chip design |
| 09/06/2005 | US6939752 Apparatus and methods for integrated circuit with devices with body contact and devices with electrostatic discharge protection |
| 09/06/2005 | US6939747 Multiple selectable function integrated circuit module |
| 09/06/2005 | US6939746 Method for assembling semiconductor die packages with standard ball grid array footprint |
| 09/06/2005 | US6939745 Method of producing tab tape carrier |
| 09/06/2005 | US6939744 Use of palladium in IC manufacturing with conductive polymer bump |
| 09/06/2005 | US6939743 Split-gate power module and method for suppressing oscillation therein |
| 09/06/2005 | US6939742 Thermal gap control |
| 09/06/2005 | US6939740 Method of fabricating an encapsulated semiconductor device with partly exposed leads |
| 09/06/2005 | US6939739 Integrated circuit packages, ball-grid array integrated circuit packages and methods of packaging an integrated circuit |
| 09/06/2005 | US6939738 Component built-in module and method for producing the same |
| 09/06/2005 | US6939735 Microelectronic assembly formation with releasable leads |
| 09/06/2005 | US6939727 Method for performing statistical post processing in semiconductor manufacturing using ID cells |
| 09/06/2005 | US6939726 Via array monitor and method of monitoring induced electrical charging |
| 09/06/2005 | US6939725 Method of fabricating semiconductor device with capacitor covered by a TEOS-03 film |
| 09/06/2005 | US6939505 Methods for forming articles having very small channels therethrough, and such articles, and methods of using such articles |
| 09/06/2005 | US6939501 Methods for labeling semiconductor device components |
| 09/06/2005 | US6939474 Method for forming microelectronic spring structures on a substrate |
| 09/06/2005 | US6939431 A curable blends comprising epoxy resin, acid anhydride, phenolic resin curing agent, and fine particles for use in liquid crystal displays, electroluminescence displays, plasma displays, charge coupled devices and semiconductors |
| 09/06/2005 | US6939143 Flexible compliant interconnect assembly |
| 09/06/2005 | US6939054 Holding structures for optical elements of an optical connector |
| 09/06/2005 | US6938815 reinforced bonding composite; reinforcers are uniformily distributed in a matrix |
| 09/06/2005 | US6938682 Heat dissipation device |
| 09/06/2005 | US6938681 Heat pipe type heat dissipation device |
| 09/06/2005 | US6938680 Tower heat sink with sintered grooved wick |
| 09/06/2005 | US6938338 Method of making an electronic contact |
| 09/06/2005 | US6938333 Method of manufacturing a metal-ceramic circuit board |
| 09/06/2005 | US6938332 Method for manufacturing multilayer ceramic substrates |
| 09/01/2005 | WO2005081609A1 Electromagnetic wave noise suppressor, structural body with electromagnetic wave noise suppressing function, and process for producing them |
| 09/01/2005 | WO2005081607A1 Rack enclosure |
| 09/01/2005 | WO2005081604A1 Housing arrangement |
| 09/01/2005 | WO2005081600A1 Printed circuit board and process for producing the same |
| 09/01/2005 | WO2005081595A2 Preferential assymmetrical via positioning for printed circuit boards |
| 09/01/2005 | WO2005081316A2 Semiconductor component comprising an interposer substrate and method for the production thereof |
| 09/01/2005 | WO2005081314A2 Optimisation of the number of power outputs for an integrated circuit |
| 09/01/2005 | WO2005081313A2 A microelectronic assembly having thermoelectric elements to cool a die and a method of making the same |
| 09/01/2005 | WO2005081312A1 Substrate for mounting semiconductor |
| 09/01/2005 | WO2005081311A1 Circuit device and manufacturing method thereof |
| 09/01/2005 | WO2005081310A1 Ic module, circuit board including ic module, and method of producing circuit board including ic module |
| 09/01/2005 | WO2005081309A2 Cooling system for devices comprising power semi-conductors and method for cooling said type of device |
| 09/01/2005 | WO2005081308A2 Protective diode for protecting semiconductor switching circuits from electrostatic discharges |
| 09/01/2005 | WO2005081307A1 Manufacturing method of semiconductor device, and ic card, ic tag, rfid, transponder, bill, securities, passport, electronic apparatus, bag, and garment |
| 09/01/2005 | WO2005081003A1 Dual feedback control system for maintaining the temperature of an ic-chip near a set-point |
| 09/01/2005 | WO2005080902A1 Liquid-cooling type cooling plate |
| 09/01/2005 | WO2005080793A1 Piezoelectric pump driving circuit, and cooling system using the same |
| 09/01/2005 | WO2005080505A1 Polyimidesiloxane solution composition |
| 09/01/2005 | WO2005080502A1 Liquid epoxy resin composition for underfill and semiconductor device encapsulated with the composition |
| 09/01/2005 | WO2005079400A2 Buried guard ring and radiation hardened isolation structures and fabrication methods |
| 09/01/2005 | WO2005071765B1 Monolithic thin-film thermoelectric device including complementary thermoelectric materials |
| 09/01/2005 | WO2005065273A3 System and method for self-leveling heat sink for multiple height devices |
| 09/01/2005 | WO2005064673A3 Integrating passive components on spacer in stacked dies |
| 09/01/2005 | WO2005062371A3 Plastic lead frames utilizing reel-to-reel processing |
| 09/01/2005 | WO2005041248A3 Integrated circuit with additional mini-pads connected by an under-bump metallisation and method for production therof |
| 09/01/2005 | WO2005008728A3 Surface mount multichip devices |
| 09/01/2005 | WO2004064120A3 Semiconductor package having non-ceramic based window frame |
| 09/01/2005 | WO2003065630A3 Apparatus and method for preventing digital media piracy |
| 09/01/2005 | US20050193362 Multi-layer overlay measurement and correction technique for IC manufacturing |
| 09/01/2005 | US20050193354 Method of extraction of wire capacitances in LSI device having diagonal wires and extraction program for same |
| 09/01/2005 | US20050192453 pyrotechnical propellant, wherein, upon triggering, at least one combustible or at least one oxidant of the propellant releases metals, in particular, precious or semi-precious metals having good conducting properties which deposit on the electronic parts; destroying hard drives |
| 09/01/2005 | US20050192068 Radio frequency arrangement and production method and also use |