Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2014
04/03/2014US20140091474 Localized high density substrate routing
04/03/2014US20140091473 Novel three dimensional integrated circuits stacking approach
04/03/2014US20140091472 Semiconductor device and manufacturing method of the same
04/03/2014US20140091471 Apparatus and Method for a Component Package
04/03/2014US20140091470 Die warpage control for thin die assembly
04/03/2014US20140091469 Methods of providing dielectric to conductor adhesion in package structures
04/03/2014US20140091468 Semiconductor device and manufacturing method thereof
04/03/2014US20140091467 Forming barrier walls, capping, or alloys /compounds within metal lines
04/03/2014US20140091466 Pitch quartering to create pitch halved trenches and pitch halved air gaps
04/03/2014US20140091465 Leadframe having sloped metal terminals for wirebonding
04/03/2014US20140091464 Semiconductor device
04/03/2014US20140091463 Semiconductor package apparatus
04/03/2014US20140091462 Semiconductor package and fabrication method thereof
04/03/2014US20140091461 Die cap for use with flip chip package
04/03/2014US20140091459 Chip-size, double side connection package and method for manufacturing the same
04/03/2014US20140091458 Encapsulated wafer-level chip scale (wlscp) pedestal packaging
04/03/2014US20140091457 Controlled solder height packages and assembly processes
04/03/2014US20140091456 Using collapse limiter structures between elements to reduce solder bump bridging
04/03/2014US20140091455 Semiconductor Device and Method of Using a Standardized Carrier in Semiconductor Packaging
04/03/2014US20140091454 Semiconductor Device and Method of Forming Supporting Layer Over Semiconductor Die in Thin Fan-Out Wafer Level Chip Scale Package
04/03/2014US20140091453 Cooling device and semiconductor device
04/03/2014US20140091452 Semiconductor module with cooling mechanism and production method thereof
04/03/2014US20140091451 Semiconductor device comprising a crack stop structure
04/03/2014US20140091450 Semiconductor Housing for Smart Cards
04/03/2014US20140091449 Power Quad Flat No-Lead (PQFN) Semiconductor Package with Leadframe Islands for Multi-Phase Power Inverter
04/03/2014US20140091448 Semiconductor Package with Corner Pins
04/03/2014US20140091447 Semiconductor device and production method thereof
04/03/2014US20140091446 Semiconductor device employing aluminum alloy lead-frame with anodized aluminum
04/03/2014US20140091445 Bumpless build-up layer package including an integrated heat spreader
04/03/2014US20140091444 Semiconductor unit and method for manufacturing the same
04/03/2014US20140091443 Surface mount package for a semiconductor integrated device, related assembly and manufacturing process
04/03/2014US20140091442 High density second level interconnection for bumpless build up layer (bbul) packaging technology
04/03/2014US20140091441 Ic wafer having electromagnetic shielding effects and method for making the same
04/03/2014US20140091440 System in package with embedded rf die in coreless substrate
04/03/2014US20140091438 Multiple metal layer semiconductor device and low temperature stacking method of fabricating the same
04/03/2014US20140091437 Chip package and method of manufacturing the same
04/03/2014US20140091427 Electrical fuse and method of fabricating the same
04/03/2014US20140091425 Semiconductor integrated circuit device
04/03/2014US20140091401 Power semiconductor housing with redundant functionality
04/03/2014US20140091370 Transistor formation using cold welding
04/03/2014US20140090794 Method of fabricating packaging substrate
04/03/2014US20140090234 Apparatus and methods for multi-scale alignment and fastening
04/03/2014DE19964481B4 MOS-Halbleiteranordnung mit Schutzeinrichtung unter Verwendung von Zenerdioden MOS semiconductor device with protection device using Zener diodes
04/03/2014DE112012002603T5 Halbleitervorrichtung und Verfahren zum Herstellen einer Halbleitervorrichtung A semiconductor device and method of manufacturing a semiconductor device
04/03/2014DE102013219654A1 Elektronische Schaltung mit einem rückwärtsleitenden Transistorbauelement Electronic circuit with a reverse conducting transistor device
04/03/2014DE102013219388A1 Kühlungsvorrichtung Cooling device
04/03/2014DE102012217932A1 Optoelectronic component has LEDs whose contact surfaces are electrically contacted with the contact surfaces of Zener diodes that are electrically connected in series, such that the LEDs are electrically connected in series
04/03/2014DE102012217790A1 Biegewandlermodul, Kühlvorrichtung und Elektronikmodul Bending actuator module, cooler and electronics module
04/03/2014DE102012217749A1 Kühlvorrichtung zum Kühlen eines elektronischen Bauteils und Elektronikmodul Cooling apparatus for cooling an electronic component and the electronic module
04/03/2014DE102012217698A1 Device for heating e.g. power electronics components of motor, has thermal spacer structure provided with fibers, metallic particles and/or fabric, where thermal lead structure is made of graphite and heat conducting inorganic compound
04/03/2014DE102012216148A1 Electronic circuit device for use in electronic commutated electromotor, has electrical conductive connection unit extending between electrical bonding surfaces and electrically connected with one another
04/03/2014DE102012019391A1 Leitungshalbleitergehäuse mit redundanter Funktionalität Line semiconductor package with redundant functionality
04/03/2014DE102008051443B4 Halbleitermodul und Herstellungsverfahren hierfür Semiconductor module, and manufacturing method thereof
04/03/2014DE102008034467B4 Anordnung mit einem Leistungshalbleitermodul und mit einer Verbindungseinrichtung Arrangement with a power semiconductor module and with a connecting device
04/03/2014DE102008014113B4 Leistungshalbleitermodul in Druckkontaktausführung Power semiconductor module in pressure contact design
04/02/2014EP2713395A2 Integrated circuit including alignment mark and display device including said integrated circuit
04/02/2014EP2713394A1 3 level power converter half bridge
04/02/2014EP2713393A2 Dielectrophoretic cooling solution for electronics
04/02/2014EP2713392A2 Dielectrophoretic restriction to prevent vapor backflow
04/02/2014EP2713391A2 Heat radiating plate and method for producing same
04/02/2014EP2713390A2 System and method of encapsulated multi metal branch foot structures for advanced back-end-of-line metallization
04/02/2014CN203521480U Package structure of flexible organic photoelectric device
04/02/2014CN203521407U Power semiconductor module with at least one stress-reducing adaptation element
04/02/2014CN203521406U Multi-chip overlapping and packing structure
04/02/2014CN203521405U Embedded integrated circuit device
04/02/2014CN203521404U Semiconductor device
04/02/2014CN203521403U Semiconductor device and semiconductor equipment
04/02/2014CN203521402U Concave-convex mutual-matching structure of jumper wire and support
04/02/2014CN203521401U High-density lead frame for packaging discrete semiconductor devices
04/02/2014CN203521400U Plaster-packaged power diode with low pressure drop
04/02/2014CN203521399U Semiconductor chip packaging structure
04/02/2014CN203521398U Low-profile sensor and bonding enhancement layer
04/02/2014CN203521397U PGA/BGA three-dimensional structure used for component assembling
04/02/2014CN203521396U Copper-free flat packaging piece of AAQFN frame product
04/02/2014CN203521395U Circuit arrangement structure capable of reducing temperature rising of transistor
04/02/2014CN203521394U Chip packaging structure
04/02/2014CN203521393U Simple rectifier bridge constructed based on plug-in diodes
04/02/2014CN203521392U Passive component packaging structure
04/02/2014CN203521391U Flexible substrate prefabricated assembly
04/02/2014CN203521364U Novel thermionic device
04/02/2014CN203520395U Circuit with pad structure
04/02/2014CN203519980U Array substrate and display device
04/02/2014CN103703874A Wiring board incorporating electronic component, and method for manufacturing wiring board incorporating electronic component
04/02/2014CN103703610A Wireless module
04/02/2014CN103703562A 功率半导体装置 Power semiconductor device
04/02/2014CN103703561A Liquid displacer in led bulbs
04/02/2014CN103703560A Semiconductor device and method for producing same
04/02/2014CN103703559A Wiring board and package, and electronic device
04/02/2014CN103703558A Growth of bulk group-Ill nitride crystals
04/02/2014CN103703335A Cooling apparatus, electronic apparatus provided with same, and electric vehicle
04/02/2014CN103703087A A one-component, dual-cure adhesive for use on electronics
04/02/2014CN103702541A Electronic device and radiator thereof
04/02/2014CN103700696A Uniformly radiating GaN tube core adopting tube series connection structure
04/02/2014CN103700682A Light-emitting diode structure and method for manufacturing the same
04/02/2014CN103700657A Array substrate as well as manufacturing method and display device thereof
04/02/2014CN103700650A Semiconductor component and method for producing a semiconductor component
04/02/2014CN103700649A Photoetching mark applying epitaxial technology and method thereof
04/02/2014CN103700648A Metal interconnecting structure for high-temperature circuit and preparing method of metal interconnecting structure
04/02/2014CN103700647A Package substrate and integrated circuit comprising same
04/02/2014CN103700646A System and method of encapsulated multi-metal branch foot structures for advanced back-end-of-line metallization
1 ... 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 ... 2262