| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/07/2005 | EP1570510A2 Fast localization of electrical failures on an integrated circuit system and method |
| 09/07/2005 | EP1570280A1 Self-marking device for an integrated circuit, and associated housed integrated circuit |
| 09/07/2005 | EP1570029A2 Gas layer formation materials |
| 09/07/2005 | EP1569757A2 Apparatus for microdeposition of multiple fluid materials |
| 09/07/2005 | EP1472588B1 Device and method for disabling electronic devices |
| 09/07/2005 | EP1412979B1 Heatsink assembly and method of manufacturing the same |
| 09/07/2005 | EP1198965B1 Mobile station supervision of the forward dedicated control channel when in the discontinuous transmission mode |
| 09/07/2005 | EP1107307B1 Semiconductor package, semiconductor device, electronic device, and method of manufacturing semiconductor package |
| 09/07/2005 | EP1069618B1 Semiconductor device and manufacture thereof |
| 09/07/2005 | EP0925509B1 Probe structure having a plurality of discrete insulated probe tips |
| 09/07/2005 | CN2724202Y Heat pipe type radiator |
| 09/07/2005 | CN2724201Y Heat radiator structure |
| 09/07/2005 | CN2724200Y Composite heat radiator |
| 09/07/2005 | CN2723833Y Water cooling light emitting diode heat radiator |
| 09/07/2005 | CN2723812Y Heat radiating lighting decoration lamp |
| 09/07/2005 | CN1666585A Magnetic shielding for electronic circuits which include magnetic materials |
| 09/07/2005 | CN1666348A Method for fixing a semiconductor chip in a plastic housing body, optoelectronic semiconductor component |
| 09/07/2005 | CN1666342A Semiconductor device |
| 09/07/2005 | CN1666340A Design of an insulated cavity |
| 09/07/2005 | CN1666339A High-power land grid array package and socket |
| 09/07/2005 | CN1666338A Semiconductor device and its manufacturing method |
| 09/07/2005 | CN1666337A Forming contact array on substrate |
| 09/07/2005 | CN1666336A Semiconductor structure integrated under a pad |
| 09/07/2005 | CN1666335A Method and apparatus using nanotubes for cooling and grounding die |
| 09/07/2005 | CN1666334A Reactive solder material |
| 09/07/2005 | CN1666333A 可穿戴的硅芯片 Silicon wearable |
| 09/07/2005 | CN1666332A Forming defect prevention trenches in dicing streets |
| 09/07/2005 | CN1666327A Flexible wiring base material and process for producing the same |
| 09/07/2005 | CN1666326A Semiconductor package and method of preparing same |
| 09/07/2005 | CN1666164A Method and apparatus for cooling a circuit component |
| 09/07/2005 | CN1666079A Composite heat sink with metal base and graphite fins |
| 09/07/2005 | CN1665966A Method of forming polymide coating containing dielectric filler on surface of metallic material process for producing copper clad laminate for formation of capacitor layer for printed wiring board and |
| 09/07/2005 | CN1665377A Method for producing ceramic multilayer substrate |
| 09/07/2005 | CN1665375A Anisotropic conductive sheet and manufacture thereof |
| 09/07/2005 | CN1665372A Method for manufacturing heat conductive substrate |
| 09/07/2005 | CN1665136A Solid state relay |
| 09/07/2005 | CN1665033A Biasing circuits, solid state imaging devices, and methods of manufacturing the same |
| 09/07/2005 | CN1665028A Semiconductor device |
| 09/07/2005 | CN1665027A 半导体器件 Semiconductor devices |
| 09/07/2005 | CN1665026A Esd protection circuit with collector current control triggering of single crystal integrated circuit |
| 09/07/2005 | CN1665025A Semiconductor package capable of avoiding electromagnetic interference and making method thereof |
| 09/07/2005 | CN1665024A Semiconductor device featuring multi-layered electrode structure |
| 09/07/2005 | CN1665023A Resin-encapsulated semiconductor device and lead frame, and method for manufacturing the same |
| 09/07/2005 | CN1665022A Semiconductor wafer package and its packaging method |
| 09/07/2005 | CN1665021A Heat sink and method for making same |
| 09/07/2005 | CN1665020A Multipurpose load plate |
| 09/07/2005 | CN1665017A Semiconductor device and method for manufacturing the same |
| 09/07/2005 | CN1665009A Semiconductor wafer device having multilayer wiring structure and packaging method thereof |
| 09/07/2005 | CN1665008A Method for forming metal bump on semiconductor wafer and semiconductor wafer device having the same |
| 09/07/2005 | CN1665007A Wafer-level packaging method and semiconductor wafer package packaged by the same method |
| 09/07/2005 | CN1665005A Semiconductor wafer package and its packaging method |
| 09/07/2005 | CN1664997A Semiconductor device with multilayer interconnection structure |
| 09/07/2005 | CN1664991A Semiconductor device and manufacturing method of the same |
| 09/07/2005 | CN1664841A Product management method, program for executing products management and recorded program medium |
| 09/07/2005 | CN1664686A Thin film transistor arraying bread board and its manufacture method |
| 09/07/2005 | CN1664683A 电子电路 Electronic circuit |
| 09/07/2005 | CN1664522A Temperature detection method of semiconductor device and power conversion apparatus |
| 09/07/2005 | CN1218395C Improved integrated oscillators and tuning circuits |
| 09/07/2005 | CN1218394C Multichip installation structure, electrooptical device and electronic machine |
| 09/07/2005 | CN1218393C Metal inner linking cable arrangement with local slot and process for making it |
| 09/07/2005 | CN1218392C 半导体器件 Semiconductor devices |
| 09/07/2005 | CN1218391C Combination of side blowing type heat radiation fins for electronic components |
| 09/07/2005 | CN1218390C 半导体装置和半导体模块 Semiconductor device and semiconductor module |
| 09/07/2005 | CN1218388C Method of packaging spherical grid array for base on chip |
| 09/07/2005 | CN1218387C IC package capable of improving signal quality |
| 09/07/2005 | CN1218386C Chip size plug-in piece, printed circuit board and method for designing printed circuit board |
| 09/07/2005 | CN1218377C Integrated circuit packaging device with heat dissipation wiring design |
| 09/07/2005 | CN1218376C Reinforced heat radiation type chip down embedded ball type array carrying board structure and making method thereof |
| 09/07/2005 | CN1218219C Photosensitive resin composition |
| 09/07/2005 | CN1217972C Epoxy resin composition for semi-conductor packaging and semi-conductor device using the composition |
| 09/07/2005 | CN1217880C Composite material and production and application thereof |
| 09/07/2005 | CN1217775C Encapsulation using microcellular foamed materials |
| 09/06/2005 | USRE38789 Semiconductor wafer having a bottom surface protective coating |
| 09/06/2005 | US6941537 Standoff devices and methods of using same |
| 09/06/2005 | US6941536 Method for identifying semiconductor integrated circuit device, method for manufacturing semiconductor integrated circuit device, semiconductor integrated circuit device and semiconductor chip |
| 09/06/2005 | US6940729 Integrated circuit stacking system and method |
| 09/06/2005 | US6940724 DC-DC converter implemented in a land grid array package |
| 09/06/2005 | US6940722 Heat-dissipating member, manufacturing method and installation method |
| 09/06/2005 | US6940721 Thermal interface structure for placement between a microelectronic component package and heat sink |
| 09/06/2005 | US6940719 Fan device |
| 09/06/2005 | US6940718 Heat dissipation apparatus and method |
| 09/06/2005 | US6940717 CPU cooling using a heat pipe assembly |
| 09/06/2005 | US6940716 Method and apparatus for dissipating heat from an electronic device |
| 09/06/2005 | US6940712 Electronic device substrate assembly with multilayer impermeable barrier and method of making |
| 09/06/2005 | US6940579 Liquid crystal display device and defect repairing method for the same |
| 09/06/2005 | US6940184 protected by a protector which does not cause lens effect |
| 09/06/2005 | US6940183 integrated circuit; provides a solid substrate so that encapsulation material overflow is eliminated |
| 09/06/2005 | US6940182 used to improve reliability and yield of good packages, avoids increased shrinkage, warping of substrate, and/or change in coefficient of thermal expansion that occurs at edges of underfill; integrated circuits |
| 09/06/2005 | US6940181 for eliminating or minimizing breakage, cracking and warping; comprises layer of tenacious reinforcement material disposed over back side of the wafer while in a rough state from backgrinding without prior conventional polishing or plasma etching |
| 09/06/2005 | US6940179 Innovative solder ball pad structure to ease design rule, methods of fabricating same and substrates, electronic device assemblies and systems employing same |
| 09/06/2005 | US6940178 Self-coplanarity bumping shape for flip chip |
| 09/06/2005 | US6940177 comprising wafer having an active surface comprising at least one integrated circuit, wherein each has a plurality of bond pads; for calculators, telephones, televisions, mainframe and personal computers |
| 09/06/2005 | US6940176 Solder pads for improving reliability of a package |
| 09/06/2005 | US6940174 Metallic photonic box and its fabrication techniques |
| 09/06/2005 | US6940173 Interconnect structures incorporating low-k dielectric barrier films |
| 09/06/2005 | US6940169 Torch bump |
| 09/06/2005 | US6940166 Semiconductor device and method for designing the same |
| 09/06/2005 | US6940165 Impedance matched electrical interconnect using dielectric compounds |
| 09/06/2005 | US6940164 Power module |
| 09/06/2005 | US6940163 On die voltage regulator |