Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2005
09/08/2005US20050196589 Element arrangement board and element arrangement method
09/08/2005US20050195891 High frequency module board device
09/08/2005US20050195585 Circuitized substrate with signal wire shielding, electrical assembly utilizing same and method of making
09/08/2005US20050195579 Apparatus and method for improving AC coupling on circuit boards
09/08/2005US20050195574 Heat sink
09/08/2005US20050195566 Heat dissipating pin structure for mitigation of LED temperature rise
09/08/2005US20050195540 ESD protective circuit with collector-current-controlled triggering for a monolithically integrated circuit
09/08/2005US20050195305 Biasing circuits, solid state imaging devices, and methods of manufacturing the same
09/08/2005US20050195303 Package of solid-state imaging device
09/08/2005US20050195130 Driver chip and display apparatus having the same
09/08/2005US20050195028 Power amplifier module for wireless communication devices
09/08/2005US20050194943 Circuit arrangement and method for reducing crosstalk
09/08/2005US20050194698 Integrated circuit package with keep-out zone overlapping undercut zone
09/08/2005US20050194697 Anisotropic conductive sheet and manufacture thereof
09/08/2005US20050194696 Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same
09/08/2005US20050194695 Method of assembling chips
09/08/2005US20050194694 Semiconductor device
09/08/2005US20050194693 Semiconductor device manufacturing method and manufacturing apparatus
09/08/2005US20050194692 Guard ring of a combination wafer or singulated die
09/08/2005US20050194691 Method of forming wiring structure and semiconductor device
09/08/2005US20050194689 Suppression of localized metal precipitate formation and corresponding metallization depletion in semiconductor processing
09/08/2005US20050194688 Semiconductor structure implementing low-k dielectric materials and supporting stubs
09/08/2005US20050194687 Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument
09/08/2005US20050194686 Semiconductor device and manufacturing method for the same
09/08/2005US20050194685 Method for mounting semiconductor chips and corresponding semiconductor chip system
09/08/2005US20050194684 Semiconductor device and manufacturing method for same
09/08/2005US20050194683 Bonding structure and fabrication thereof
09/08/2005US20050194682 Resin-molded semiconductor device having posts with bumps and method for fabricating the same
09/08/2005US20050194681 Conductive pad with high abrasion
09/08/2005US20050194679 Semiconductor device with multilayer interconnection structure
09/08/2005US20050194678 Bonding pad structure, display panel and bonding pad array structure using the same and manufacturing method thereof
09/08/2005US20050194676 Resin-encapsulated semiconductor device and lead frame, and method for manufacturing the same
09/08/2005US20050194675 Capacitor-related systems for addressing package/motherboard resonance
09/08/2005US20050194674 Integrated circuit with re-route layer and stacked die assembly
09/08/2005US20050194673 Multi-chip package, a semiconductor device used therein and manufacturing method thereof
09/08/2005US20050194672 Stacked packages and systems incorporating the same
09/08/2005US20050194671 High frequency semiconductor device
09/08/2005US20050194670 Semiconductor device and manufacturing method of the same
09/08/2005US20050194669 Integrated circuit package with chip-side signal connections
09/08/2005US20050194668 Wafer scale die handling
09/08/2005US20050194667 Semiconductor package free of substrate and fabrication method thereof
09/08/2005US20050194666 Semiconductor package free of substrate and fabrication method thereof
09/08/2005US20050194665 Semiconductor package free of substrate and fabrication method thereof
09/08/2005US20050194664 Bonding pad arrangement method for semiconductor devices
09/08/2005US20050194663 Optical semiconductor device
09/08/2005US20050194662 Semiconductor component and micromechanical structure
09/08/2005US20050194660 IGBT module
09/08/2005US20050194659 Semiconductor assemblies
09/08/2005US20050194656 Semiconductor device
09/08/2005US20050194644 Gate coupling electrostatic discharge protection circuit with redundant structures
09/08/2005US20050194643 Testable electrostatic discharge protection circuits
09/08/2005US20050194638 Semiconductor device
09/08/2005US20050194637 Semiconductor device and method for fabricating the same
09/08/2005US20050194635 Semiconductor component
09/08/2005US20050194591 Semiconductor devices and manufacturing method therefor
09/08/2005US20050194590 System and method for controlling manufacturing apparatuses
09/08/2005US20050194552 Solid state relay
09/08/2005US20050194356 Removing photoresist from a workpiece using water and ozone and a photoresist penetrating additive
09/08/2005US20050194350 Capacitor and inductor scheme with e-fuse application
09/08/2005US20050194349 Method of fabricating film carrier
09/08/2005US20050194180 Compliant contact pin assembly, card system and methods thereof
09/08/2005US20050194174 Electrical feedthrough assembly for a sealed housing
09/08/2005US20050194169 Periodic interleaved star with vias electromagnetic bandgap structure for microstrip and flip chip on board applications
09/08/2005US20050194168 Flip chip mmic on board performance using periodic electromagnetic bandgap structures
09/08/2005US20050194085 Method for producing ceramic multilayer substrate
09/08/2005US20050193559 Radiator and method of manufacturing the same
09/08/2005US20050193548 Method of manufacturing electronic device
09/08/2005DE4242843B4 Verfahren zur Herstellung von aus mehreren Keramikschichten aufgebauten Elektronikkomponenten A process for the production of ceramic layers composed of several electronic components
09/08/2005DE4030771B4 Halbleiterbauelement mit einem in einem Kunststoffgehäuse eingebetteten Halbleiterchip A semiconductor device with an embedded in a plastic housing semiconductor chip
09/08/2005DE202005008232U1 Electrical connection arrangement for electronic appliances has piezoelectric plates on a circuit board with individual anodes and a common cathode supplying the plates
09/08/2005DE202005008231U1 Connecting element for an electric connection with an electrode on a piezoelectric board (PB) acts as an element to link the PB to a printed circuit board underneath the PB
09/08/2005DE202005007879U1 Universal fitting cooling system for circuit board components has a modular design with a universal fitting plate and cooling rib modules with ventilator mountings
09/08/2005DE10393441T5 Verfahren zum Beibehalten der Lötmitteldicke bei Flip-Chip-Befestigungspackaging-Verfahren A method for maintaining the solder thickness at the flip-chip mounting packaging method
09/08/2005DE10351028B4 Halbleiter-Bauteil sowie dafür geeignetes Herstellungs-/Montageverfahren Semiconductor device and care for your manufacturing / assembly process
09/08/2005DE10297785T5 Elektronikbaugruppe mit einer dichteren Kontaktanordnung, die eine Zuleitungsführung zu den Kontakten erlaubt Electronics module with a denser contact arrangement that allows a cable guide to the contacts
09/08/2005DE102004062859A1 Copper interconnect oxidation preventing method in semiconductor device, involves etching nitride layer to expose portion of lower copper interconnect and supplying preset gas to exposed portion of lower copper interconnect
09/08/2005DE102004042798A1 IGBT-Baugruppe IGBT module
09/08/2005DE102004042366B3 Semiconductor module comprises a substrate with one or more semiconductor components, and a housing connected to the substrate with an adhesive
09/08/2005DE102004033063B3 Heat exchange system for electronic apparatus such as data processors has two cooling circuits with different and separated coolant
09/08/2005DE102004031465A1 Wiring method for forming a re-wiring lead on a surface of an integrated circuit has a bare fuse element and a wiring area that can be cut through
09/08/2005DE102004021838A1 Semiconductor component (SC) for operating a cooling device has a sliding bow and a chip carrier or semiconductor chip for making thermal contact in sections with a medium surrounding the SC
09/08/2005DE102004009055A1 Kühlsystem für Geräte mit Leistungshalbleitern und Verfahren zum Kühlen derartiger Geräte A cooling system for devices with power semiconductors and method for cooling such equipment
09/08/2005DE102004007655A1 Electrostatic discharge protection apparatus for semiconductor integrated circuit, has electrostatic discharge protection circuit connected in between doping zone and ground potential connection
09/08/2005DE102004007398A1 Konfigurierbare Gate-Array-Zelle mit erweitertem Poly-Gate-Anschluss Configurable gate array cell with expanded poly-gate terminal
09/08/2005DE102004007009A1 Verfahren zur Herstellung eines Leistungsmoduls und Leistungsmodul A process for producing a power module and the power module
09/08/2005DE102004006440A1 Fingertip sensor chip has exposed contact zone located within surrounding plastic frame
09/08/2005DE102004003538B3 Integrierte Halbleiterschaltung mit einer Logik- und Leistungs-Metallisierung ohne Intermetall-Dielektrikum und Verfahren zu ihrer Herstellung A semiconductor integrated circuit comprising a logic and power metallization without intermetal dielectric and method for their preparation
09/08/2005DE10108077B4 IC-Chip mit Anschlusskontaktflächen und ESD-Schutz IC chip having contact pads and the ESD protection
09/07/2005EP1571708A2 Integrated circuits and interconnect structure for integrated circuits
09/07/2005EP1571707A2 Semiconductor device temperature detection method and power conversion apparatus
09/07/2005EP1571706A1 Electronic device
09/07/2005EP1571704A1 Method for depositing a solder material on a substrate in the form of a predetermined pattern
09/07/2005EP1571534A2 Electronic apparatus having cooling system, radiator thereof, and method for manufacturing thereof
09/07/2005EP1571533A2 Liquid cooling system, and electronic apparatus having the same therein
09/07/2005EP1571532A2 Redundant liquid cooling system and electronic apparatus having the same therein
09/07/2005EP1570572A1 Single package multi-chip rf power amplifier
09/07/2005EP1570524A2 Package having exposed integrated circuit device
09/07/2005EP1570521A2 Method, system and apparatus for cooling high power density devices
09/07/2005EP1570519A1 Method of cutting semiconductor wafer and protective sheet used in the cutting method
09/07/2005EP1570513A2 Microelectronic packaging and components
1 ... 1318 1319 1320 1321 1322 1323 1324 1325 1326 1327 1328 1329 1330 1331 1332 1333 1334 1335 1336 1337 1338 ... 2262