| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/13/2005 | US6943448 Multi-metal layer MEMS structure and process for making the same |
| 09/13/2005 | US6943446 Via construction for structural support |
| 09/13/2005 | US6943445 Semiconductor device having bridge-connected wiring structure |
| 09/13/2005 | US6943444 Cooling of surface temperature of a device |
| 09/13/2005 | US6943443 Electronic circuit device including metallic member having installation members |
| 09/13/2005 | US6943442 Electronic parts packaging structure having mutually connected electronic parts that are buried in a insulating film |
| 09/13/2005 | US6943441 Semiconductor device |
| 09/13/2005 | US6943440 Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow |
| 09/13/2005 | US6943439 Substrate and fabrication method of the same |
| 09/13/2005 | US6943438 loop height of the bonding wire is secured by adhesive spacers; multiple memory chips can be stacked; molded body without a separate lid; data storage media |
| 09/13/2005 | US6943436 EMI heatspreader/lid for integrated circuit packages |
| 09/13/2005 | US6943435 Lead pin with Au-Ge based brazing material |
| 09/13/2005 | US6943434 Method for maintaining solder thickness in flipchip attach packaging processes |
| 09/13/2005 | US6943433 Semiconductor device and manufacturing method for same |
| 09/13/2005 | US6943431 Semiconductor device using low-k material as interlayer insulating film and including a surface modifying layer |
| 09/13/2005 | US6943430 Semiconductor wafer having electrically connected passive device chips, passive devices and semiconductor package using the same |
| 09/13/2005 | US6943429 Wafer having alignment marks extending from a first to a second surface of the wafer |
| 09/13/2005 | US6943427 Semiconductor device for charge-up damage evaluation and charge-up damage evaluation method |
| 09/13/2005 | US6943424 Electronic package having a patterned layer on backside of its substrate, and the fabrication thereof |
| 09/13/2005 | US6943423 Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof |
| 09/13/2005 | US6943418 Insulating element |
| 09/13/2005 | US6943416 Method and structure for reducing resistance of a semiconductor device feature |
| 09/13/2005 | US6943415 Architecture for mask programmable devices |
| 09/13/2005 | US6943412 Semiconductor integrated circuit |
| 09/13/2005 | US6943411 Semiconductor device including a low resistance wiring layer |
| 09/13/2005 | US6943396 Electro-static discharge protection circuit and method for making the same |
| 09/13/2005 | US6943382 Pressed-contact type semiconductor device |
| 09/13/2005 | US6943367 Thin film transistor array panel |
| 09/13/2005 | US6943294 Integrating passive components on spacer in stacked dies |
| 09/13/2005 | US6943293 High power electronic package with enhanced cooling characteristics |
| 09/13/2005 | US6943216 Curable compositions and electric/electronic parts |
| 09/13/2005 | US6943129 Interconnection structure and method for designing the same |
| 09/13/2005 | US6943115 Semiconductor device and method of manufacture thereof |
| 09/13/2005 | US6943108 Interposer capacitor built on silicon wafer and joined to a ceramic substrate |
| 09/13/2005 | US6943106 Methods of fabricating interconnects for semiconductor components including plating solder-wetting material and solder filling |
| 09/13/2005 | US6943104 Method of etching insulating film and method of forming interconnection layer |
| 09/13/2005 | US6943103 Methods for reducing flip chip stress |
| 09/13/2005 | US6943100 Method of fabricating a wiring board utilizing a conductive member having a reduced thickness |
| 09/13/2005 | US6943090 Aluminum-beryllium alloys for air bridges |
| 09/13/2005 | US6943067 Three-dimensional integrated semiconductor devices |
| 09/13/2005 | US6943065 Scalable high performance antifuse structure and process |
| 09/13/2005 | US6943064 Method of manufacturing a semiconductor package with elevated tub |
| 09/13/2005 | US6943063 RF seal ring structure |
| 09/13/2005 | US6943060 Method for fabricating integrated circuit package with solder bumps |
| 09/13/2005 | US6943059 Flip chip mounting method of forming a solder bump on a chip pad that is exposed through an opening formed in a polyimide film that includes utilizing underfill to bond the chip to a substrate |
| 09/13/2005 | US6943058 No-flow underfill process and material therefor |
| 09/13/2005 | US6943056 Semiconductor device manufacturing method and electronic equipment using same |
| 09/13/2005 | US6943047 Device transferring method, device arraying method, and image display fabrication method using the same |
| 09/13/2005 | US6942833 Ceramic multilayer substrate manufacturing method and unfired composite multilayer body |
| 09/13/2005 | US6942506 Card connector having a heat radiation member without inhibiting insertion and removal of a card |
| 09/13/2005 | US6942478 Packaging mold with electrostatic discharge protection |
| 09/13/2005 | US6942026 Fin assembly of heat sink |
| 09/13/2005 | US6942025 Uniform heat dissipating and cooling heat sink |
| 09/13/2005 | US6942021 Heat transport device and electronic device |
| 09/13/2005 | US6942020 Heat dissipation device |
| 09/13/2005 | US6942019 Apparatus and method for circuit board liquid cooling |
| 09/13/2005 | US6942018 Electroosmotic microchannel cooling system |
| 09/13/2005 | US6941957 Method and apparatus for pretreating a substrate prior to electroplating |
| 09/09/2005 | WO2005084089A1 A radio frequency circuit board topology |
| 09/09/2005 | WO2005083807A1 A pcb-mounted radiator and an led package using the pcb, and the manufacturing method thereof |
| 09/09/2005 | WO2005083803A2 Light-emitting diode arrangement for a high-power light-emitting diode, and method for producing a light-emitting diode arrangement |
| 09/09/2005 | WO2005083787A1 Configurable integrated circuit capacitor array with via layers |
| 09/09/2005 | WO2005083786A1 Optimized power delivery to high speed, high pin-count devices |
| 09/09/2005 | WO2005083785A1 System comprising an electrical component and an electrical connecting lead for said component, and method for the production of said system |
| 09/09/2005 | WO2005083784A2 Cooling apparatus |
| 09/09/2005 | WO2005083783A1 Heat dissipating sheet |
| 09/09/2005 | WO2005083778A1 Methods of fabricating interconnects for semiconductor components |
| 09/09/2005 | WO2005083776A1 Integrated circuit chips utilizing carbon nanotube composite interconnection vias |
| 09/09/2005 | WO2005083771A1 Assembly of a semiconductor die attached to substrate with oxazoline derivative bearing an electron donor or acceptor functionality |
| 09/09/2005 | WO2005083767A1 Semiconductor device |
| 09/09/2005 | WO2005081947A2 Miniature fluid-cooled heat sink with integral heater |
| 09/09/2005 | WO2005081812A2 Hotspot spray cooling |
| 09/09/2005 | WO2005081757A2 A novel thin laminate as embedded capacitance material in printed circuit boards |
| 09/09/2005 | WO2005081618A2 Method for improving heat dissipation in encapsulated electronic components |
| 09/09/2005 | WO2005065336A3 High-frequency chip packages |
| 09/09/2005 | WO2005064245A3 Heat exchanger |
| 09/09/2005 | WO2005059968A3 Integrated circuit fuse and method of fabrication |
| 09/09/2005 | WO2005059465B1 Heat conduction device |
| 09/09/2005 | WO2005055319A3 A cooling system with a bubble pump |
| 09/09/2005 | WO2005045926A3 Semiconductor component comprising synthetic housing material, semiconductor chip and circuit support, and method for producing the same |
| 09/09/2005 | WO2005041273A3 Method for reducing parasitic couplings in circuits |
| 09/09/2005 | WO2005024611A3 Cooling system for electronic devices, especially computers |
| 09/09/2005 | WO2004111659A3 Methods and apparatus for packaging integrated circuit devices |
| 09/09/2005 | WO2004110931A3 Method for producing particulate alumina and composition containing particulate alumina |
| 09/09/2005 | WO2004064152A3 Modular construction component with encapsulation |
| 09/09/2005 | CA2556666A1 Hotspot spray cooling |
| 09/08/2005 | US20050197799 Temperature detection method of semiconductor device and power conversion apparatus |
| 09/08/2005 | US20050196981 Integrated circuit chip, electronic device and method of manufacturing the same, and electronic instrument |
| 09/08/2005 | US20050196975 Method of manufacturing a compound semiconductor by heating a layered structure including rare earth transition metal |
| 09/08/2005 | US20050196974 Compositions for preparing low dielectric materials containing solvents |
| 09/08/2005 | US20050196964 Dummy fill for integrated circuits |
| 09/08/2005 | US20050196959 Semiconductor device and manufacturing process therefor as well as plating solution |
| 09/08/2005 | US20050196954 Method for manufacturing semiconductor integrated circuit device |
| 09/08/2005 | US20050196916 Semiconductor device and manufacturing process therefor |
| 09/08/2005 | US20050196911 Method for fabricating active-matrix display device |
| 09/08/2005 | US20050196907 Underfill system for die-over-die arrangements |
| 09/08/2005 | US20050196906 Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material |
| 09/08/2005 | US20050196904 Aerodynamic memory module cover |
| 09/08/2005 | US20050196903 Semiconductor device and method of manufacturing the same |
| 09/08/2005 | US20050196902 Method of fabricating film carrier |