Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2005
09/15/2005US20050199373 Heat sink for an electronic power component
09/15/2005US20050199372 Cold plate and method of making the same
09/15/2005US20050199367 Method for heat dissipation in mobile radio devices, and a corresponding mobile radio device
09/15/2005US20050199331 Method of fabricating multilayer ceramic substrate
09/15/2005DE10345186A1 Verfahren zur Herstellung eines Metall-Oxid-Halbleiter Feldeffekttransistors und Metall-Oxid-Halbleiter Feldeffekttransistor A method for producing a metal-oxide-semiconductor field-effect transistor and metal oxide semiconductor field effect transistor
09/15/2005DE102005009292A1 Multilayer circuit board for personal computer, has insulating layer placed between power conductive and signal routing layers having different thickness
09/15/2005DE102004059986A1 Zusammengesetzte Wärmesenkenanordnung mit niedriger thermischer Belastung The composite heat sink assembly low thermal load
09/15/2005DE102004014214B3 Gluing system for fastening transponder chip to substrate uses thick layer of electrically conducting glue with matrix loaded with conducting particles forming bridges between electrodes
09/15/2005DE102004009284A1 Leuchtdioden-Anordnung für eine Hochleistungs-Leuchtdiode und Verfahren zur Herstellung einer Leuchtdioden-Anordnung Light emitting diode assembly for a high-power light emitting diode and method of manufacturing a light emitting diode assembly
09/15/2005DE102004007991A1 Switching device e.g. for motor in motor vehicle, comprises diode for reverse polarity protection integrated as additional pn-junction or Schottky contact in semiconductor switch
09/15/2005CA2562291A1 Housing for high-power components
09/14/2005EP1575091A2 Semiconductor integrated circuit
09/14/2005EP1575089A1 Highly reliable, cost effective and thermally enhanced AuSn die-attach technology
09/14/2005EP1575088A1 Magnetic memory device
09/14/2005EP1575086A2 Semiconductor device and manufacturing method of the same, including a dicing step
09/14/2005EP1575084A2 Method for depositing a solder material on a substrate
09/14/2005EP1575054A2 Magnetic shield member, magnetic shield structure, and magnetic memory device
09/14/2005EP1574800A2 Modular capillary pumped loop cooling system
09/14/2005EP1573893A2 Flexible inverter power module for motor drives
09/14/2005EP1573825A2 Optical component mounting and interconnect apparatus
09/14/2005EP1573815A1 Integrated circuit assembly
09/14/2005EP1573814A1 High density package interconnect wire bond strip line and method therefor
09/14/2005EP1573813A2 Rf power transistor with internal bias feed
09/14/2005EP1573812A1 High density package interconnect power and ground strap and method therefor
09/14/2005EP1573811A1 Testable electrostatic discharge protection circuits
09/14/2005EP1573810A2 Method for forming patterns aligned on either side of a thin film
09/14/2005EP1573809A1 Surface-mounted microwave package and corresponding mounting with multilayer circuit
09/14/2005EP1573808A1 Ic tiling pattern method, ic so formed and analysis method
09/14/2005EP1573807A1 Electro-osmotic pumps and micro-channels
09/14/2005EP1573805A2 Method for re-routing lithography-free microelectronic devices
09/14/2005EP1573800A2 Flexible semiconductor device and method of manufacturing the same
09/14/2005EP1573799A1 Three-dimensional device fabrication method
09/14/2005EP1573754A1 A planar inductive component and an integrated circuit comprising a planar inductive component
09/14/2005EP1573602A1 Nested design approach
09/14/2005EP1573256A2 Compact, high-efficiency thermoelectric systems
09/14/2005EP1572824A1 Flexible heat sink
09/14/2005CN2726130Y Light emitting dipolar body supporter
09/14/2005CN2726116Y Structure for improving adhesivity between etching stop layer and metal layer
09/14/2005CN2726115Y Fluid medium heat radiator
09/14/2005CN2726114Y Improved structure for ring shaped heat radiator
09/14/2005CN2726113Y Liquid cooled heat radiation water tank structure with heat conductor
09/14/2005CN2726112Y Honeycomb imitation structure micro pipeline network heat exchanger
09/14/2005CN2726111Y Packaging assembly for stacked integrated circuit
09/14/2005CN2726109Y Calibration wafer and calibration apparatus
09/14/2005CN2726108Y Multi-layer semiconductor wafer structure
09/14/2005CN1669376A Method for heat dissipation in mobile radio devices and a corresponding mobile radio device
09/14/2005CN1669374A Composite multi-layer substrate and module using the substrate
09/14/2005CN1669362A Hygroscopic molding
09/14/2005CN1669176A 传送线路和半导体集成电路装置 Transmission line and the semiconductor integrated circuit device
09/14/2005CN1669142A Surface mount solder method and apparatus for decoupling capacitance and process of making
09/14/2005CN1669140A Stacked microelectronic packages
09/14/2005CN1669139A Semiconductor devices with wire bond inductor and method
09/14/2005CN1669138A 半导体器件 Semiconductor devices
09/14/2005CN1669134A Selective connection in ic packaging
09/14/2005CN1669132A Self-healing polymer compositions
09/14/2005CN1668928A Fiducial alignment mark on microelectronic spring contact
09/14/2005CN1668886A Vapor augmented heatsink with multi-wick structure
09/14/2005CN1668716A Photocurable adhesive compositions, reaction products of which have low halide ion content
09/14/2005CN1668461A Laminated glazing panel
09/14/2005CN1667847A Nitride-based semiconductor light-emitting device
09/14/2005CN1667845A Process for producing optical semiconductor device
09/14/2005CN1667827A Protection device of semiconductor circuit with electrostatic discharge protecting circuit
09/14/2005CN1667826A Input/output cell with robust electrostatic discharge protection
09/14/2005CN1667825A Plain conductor structure and process thereof
09/14/2005CN1667824A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
09/14/2005CN1667823A Chip packaging member and method of manufacture
09/14/2005CN1667822A Heat radiator
09/14/2005CN1667821A Thermal interfacial material and method of manufacture
09/14/2005CN1667820A Semiconductor device and method for manufacturing the same
09/14/2005CN1667819A Circuit board and method for manufacturing the same
09/14/2005CN1667817A Method for manufacturing tungsten/polysilicon word line structure in vertical DRAM and device manufactured thereby
09/14/2005CN1667815A 半导体集成电路 The semiconductor integrated circuit
09/14/2005CN1667813A Semiconductor device
09/14/2005CN1667812A Semiconductor device and method of fabricating the same
09/14/2005CN1667811A Method of forming wiring structure and semiconductor device
09/14/2005CN1667809A Semiconductor storage device, semiconductor device, and manufacturing method therefor
09/14/2005CN1667801A Semiconductor device and manufacturing method for same
09/14/2005CN1667421A Sensor device
09/14/2005CN1219326C 半导体集成装置及其制造方法 The semiconductor integrated device and manufacturing method thereof
09/14/2005CN1219323C Interconnection structure and method for making same
09/14/2005CN1219322C Resin sealed semiconductor device and its producing method
09/14/2005CN1219321C Lead frame and manufacturing method of resin sealed semiconductor device using same
09/14/2005CN1219320C Semiconductor device
09/14/2005CN1219319C Single pulse broken UV laser system and method for IC fuses
09/14/2005CN1219318C Breakdown barrier and oxygen barrier for dielectric integrated circuit with low dielectric constant
09/13/2005US6944567 Method in an integrated circuit (IC) manufacturing process for identifying and redirecting ICs mis-processed during their manufacture
09/13/2005US6944026 Heat sink mounting assembly
09/13/2005US6944025 EMI shielding apparatus
09/13/2005US6944023 System and method for mounting a heat sink
09/13/2005US6943658 Integrated transformer
09/13/2005US6943614 Fractional biasing of semiconductors
09/13/2005US6943458 Semiconductor device and manufacturing method thereof, and registration accuracy measurement enhancement method
09/13/2005US6943457 a die, an attached lead frame, and an encapsulating bow resistant plastic body
09/13/2005US6943456 Plastic molded type semiconductor device and fabrication process thereof
09/13/2005US6943455 Packaging system for power supplies
09/13/2005US6943454 Memory module
09/13/2005US6943453 Superconductor device and method of manufacturing the same
09/13/2005US6943452 Coaxial wiring within SOI semiconductor, PCB to system for high speed operation and signal quality
09/13/2005US6943451 Semiconductor devices containing a discontinuous cap layer and methods for forming same
09/13/2005US6943450 Packaged microelectronic devices and methods of forming same
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