Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2005
09/15/2005WO2005086234A1 Multiple stacked die window csp package and method of manufacture
09/15/2005WO2005086233A2 Component with encapsulation suitable for wlp and production method
09/15/2005WO2005086232A1 Microelectronic interconnect device comprising localised conductive pins
09/15/2005WO2005086231A1 Semiconductor structure
09/15/2005WO2005086230A1 Semiconductor device with improved thermal characteristics
09/15/2005WO2005086229A1 Light transmitting window member, semiconductor package provided with light transmitting window member and method for manufacturing light transmitting window member
09/15/2005WO2005086223A2 Multi-layer overlay measurement and correction technique for ic manufacturing
09/15/2005WO2005086220A1 Highly reliable, cost effective and thermally enhanced ausn die-attach technology
09/15/2005WO2005086217A1 Matrix-type semiconductor package with heat spreader
09/15/2005WO2005086216A1 Semiconductor element and semiconductor element manufacturing method
09/15/2005WO2005086189A1 Housing for high performance components
09/15/2005WO2005085876A1 Vibration piezoelectric acceleration sensor
09/15/2005WO2005085316A1 Encapsulation epoxy resin material and electronic component
09/15/2005WO2005084313A2 Non-uniformly heated power device with fluidic cooling
09/15/2005WO2005062384A3 Method of forming bridging lateral nanowires and device manufactured thereby
09/15/2005WO2005013363A3 Circuit arrangement placed on a substrate and method for producing the same
09/15/2005WO2004102619A3 Chemical vapor deposition epitaxial growth
09/15/2005WO2004100473A3 Signal isolators using micro-transformers
09/15/2005WO2004090944A3 Pcm/aligned fiber composite thermal interface
09/15/2005WO2004082022A3 Method for producing an electronic component or module and a corresponding component or module
09/15/2005US20050204314 Placement and routing method to reduce Joule heating
09/15/2005US20050202725 Apparatus for providing controlled impedance in an electrical contact
09/15/2005US20050202672 Method for manufacturing tungsten/polysilicon word line structure in vertical dram and device manufactured thereby
09/15/2005US20050202646 Method for edge sealing barrier films
09/15/2005US20050202641 Radiation-hardened transistor fabricated by modified CMOS process
09/15/2005US20050202599 Method of forming metal pattern having low resistivity
09/15/2005US20050202598 Process for producing optical semiconductor device
09/15/2005US20050202595 Thin-film semiconductor device and method of manufacturing the same
09/15/2005US20050202593 Flip chip packaging process and structure thereof
09/15/2005US20050202591 System and methods for hermetic sealing of post media-filled MEMS package
09/15/2005US20050202577 Manufacturing and testing of electrostatic discharge protection circuits
09/15/2005US20050202338 Preparation of crosslinked particles from polymers having activatible crosslinking groups
09/15/2005US20050202284 Protection of the SiC surface by a GaN layer
09/15/2005US20050202221 Semiconductor chip capable of implementing wire bonding over active circuits
09/15/2005US20050202219 Semiconductor device and fabrication process thereof
09/15/2005US20050201175 Radio frequency arrangement, method for producing a radio frequency arrangement and use of the radio frequency arrangement
09/15/2005US20050201131 Method for generating an electrical contact with buried track conductors
09/15/2005US20050201065 Preferential ground and via exit structures for printed circuit boards
09/15/2005US20050201064 Locking device for heat dissipating device
09/15/2005US20050201063 Semiconductor module with heat sink and method thereof
09/15/2005US20050201060 Heat sink with built-in heat pipes for semiconductor packages
09/15/2005US20050201055 Simple constant temperature device for electronic device and method for controlling the constant temperature device
09/15/2005US20050201031 Protection circuit in semiconductor circuit device comprising a plurality of chips
09/15/2005US20050200429 Electronic component
09/15/2005US20050200413 Flexible substrate and electronic equipment
09/15/2005US20050200396 Power-rail esd clamp circuit for mixed-voltage i/o buffer
09/15/2005US20050200383 Semiconductor integrated circuit
09/15/2005US20050200338 Fully integrated DC-to-DC regulator utilizing on-chip inductors with high frequency magnetic materials
09/15/2005US20050200029 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
09/15/2005US20050200028 Encapsulated semiconductor component having thinned die with conductive vias
09/15/2005US20050200027 Conductive through wafer vias
09/15/2005US20050200026 Contact structure for nanometer characteristic dimensions
09/15/2005US20050200024 Method to generate porous organic dielectric
09/15/2005US20050200023 Top layers of metal for high performance IC's
09/15/2005US20050200022 Semiconductor device
09/15/2005US20050200021 Semiconductor device
09/15/2005US20050200019 Semiconductor device and manufacturing method thereof
09/15/2005US20050200018 Semiconductor device with increased number of external connection electrodes
09/15/2005US20050200017 Integrated circuit bond pad structures and methods of making
09/15/2005US20050200016 Ball grid array socket having improved housing
09/15/2005US20050200015 Semiconductor device and method for manufacturing the same
09/15/2005US20050200014 Bump and fabricating process thereof
09/15/2005US20050200013 Package structure with two solder arrays
09/15/2005US20050200012 Chip size image sensor camera module
09/15/2005US20050200010 Circuit board
09/15/2005US20050200009 Method and apparatus for bonding a wire
09/15/2005US20050200007 Semiconductor package
09/15/2005US20050200006 Semiconductor package and fabrication method thereof
09/15/2005US20050200005 Semiconductor device, semiconductor package, and method for testing semiconductor device
09/15/2005US20050200004 Semiconductor chip and fabrication method thereof
09/15/2005US20050200003 Multi-chip package
09/15/2005US20050200001 Method and apparatus for a layered thermal management arrangement
09/15/2005US20050199999 Semiconductor device
09/15/2005US20050199998 Semiconductor package with heat sink and method for fabricating the same and stiffener
09/15/2005US20050199997 Semiconductor device, manufacturing method thereof, circuit board, and electronic appliance
09/15/2005US20050199996 Two solder array structure with two high melting solder joints
09/15/2005US20050199995 Semiconductor element and wafer level chip size package therefor
09/15/2005US20050199994 Semiconductor apparatus and method for manufacturing semiconductor apparatus
09/15/2005US20050199993 Semiconductor package having heat spreader and package stack using the same
09/15/2005US20050199992 Prevents air gaps; integrated circuit (IC) chip; plurality of solder balls formed on the bottom face of circuit substrate; thermoconductive layer
09/15/2005US20050199991 Multi-chip package structure
09/15/2005US20050199990 Protection of plastic detector's packages against shortwave light destruction
09/15/2005US20050199989 Semiconductor device and manufacturing method thereof
09/15/2005US20050199988 Sensor device
09/15/2005US20050199987 High frequency power module and radio frequency communication device; signal processing integrated circuits including low noise amplifiers which amplify an extremely weak signal; sealing body made of insulation resin; purality of connectors; mobile phones
09/15/2005US20050199986 Leadframe with die pad
09/15/2005US20050199985 Semiconductor device with interlocking clip
09/15/2005US20050199979 Semiconductor device and method for fabricating the same
09/15/2005US20050199977 Structure and method for forming a dielectric chamber and electronic device including the dielectric chamber
09/15/2005US20050199975 Circuit device
09/15/2005US20050199974 Support frame for semiconductor packages
09/15/2005US20050199966 Dual work function semiconductor structure with borderless contact and method of fabricating the same
09/15/2005US20050199955 Semiconductor device and method of manufacturing the same
09/15/2005US20050199934 Electronic component having an integrated passive electronic component and associated production method
09/15/2005US20050199929 Capacitor device and semiconductor device having the same, and capacitor device manufacturing method
09/15/2005US20050199891 Nitride-based semiconductor light-emitting device
09/15/2005US20050199875 Inspection pattern, inspection method, and inspection system for detection of latent defect of multi-layer wiring structure
09/15/2005US20050199684 Method of semiconductor device assembly including fatigue-resistant ternary solder alloy
09/15/2005US20050199494 Analyte monitoring device and methods of use
09/15/2005US20050199420 Circuit board and method for manufacturing the same
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