| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/21/2005 | CN1670907A Method of manufacturing substrate joint body, substrate joint body and electrooptical device |
| 09/21/2005 | CN1670624A 蚀刻组合物 Etching composition |
| 09/21/2005 | CN1670596A Structure of semiconductor chip and display device using the same |
| 09/21/2005 | CN1670584A Tension resistant structure |
| 09/21/2005 | CN1670580A Semiconductor chip and display device using the same |
| 09/21/2005 | CN1670460A 沸腾冷却装置 Boiling cooling device |
| 09/21/2005 | CN1669905A Minisize circulating flow passage device made by lead frame |
| 09/21/2005 | CN1669715A Soldering tin forming device, method and continuous plating device |
| 09/21/2005 | CN1220263C Semiconductor chip, semiconductor IC and method for selecting semiconductor chip |
| 09/21/2005 | CN1220261C 电子元件 Electronic component |
| 09/21/2005 | CN1220260C Semiconductor device and making method, and printing mask |
| 09/21/2005 | CN1220254C Method for manufacturing semiconductor device and equipment for manufacturing semiconductor device |
| 09/21/2005 | CN1220253C Method for generating mask data, mask and method for manufacturing semiconductor device |
| 09/21/2005 | CN1220250C Method for manufacturing semiconductor device |
| 09/21/2005 | CN1220124C Pump-free liquid radiating method and apparatus for microelectronic device |
| 09/20/2005 | US6947306 Backside of chip implementation of redundancy fuses and contact pads |
| 09/20/2005 | US6947295 Ball grid array package with an electromagnetic shield connected directly to a printed circuit board |
| 09/20/2005 | US6947293 Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management |
| 09/20/2005 | US6947291 Photolithographically-patterned out-of-plane coil structures and method of making |
| 09/20/2005 | US6947286 Stack up assembly |
| 09/20/2005 | US6947285 Thermal interface material |
| 09/20/2005 | US6947284 Heat sink assembly with retaining device |
| 09/20/2005 | US6947283 Heat sink and retaining clip assembly |
| 09/20/2005 | US6947282 Electronic device, liquid cooling system and tank |
| 09/20/2005 | US6947281 Cooling units |
| 09/20/2005 | US6946948 Crosspoint switch with switch matrix module |
| 09/20/2005 | US6946934 Transmission line and semiconductor integrated circuit device |
| 09/20/2005 | US6946856 Thermal testing method for integrated circuit chips and packages |
| 09/20/2005 | US6946802 Electronic module, methods of manufacturing and driving the same, and electronic instrument |
| 09/20/2005 | US6946747 Semiconductor device and its manufacturing method |
| 09/20/2005 | US6946746 Method to reduce number of wire-bond loop heights versus the total quantity of power and signal rings |
| 09/20/2005 | US6946744 System and method of reducing die attach stress and strain |
| 09/20/2005 | US6946743 Flexibility enhanced integrated circuit carrier |
| 09/20/2005 | US6946741 Semiconductor device and manufacturing method thereof |
| 09/20/2005 | US6946739 Layered semiconductor devices with conductive vias |
| 09/20/2005 | US6946738 Semiconductor packaging substrate and method of producing the same |
| 09/20/2005 | US6946737 Robust interlocking via |
| 09/20/2005 | US6946734 Integrated passive components and package with posts |
| 09/20/2005 | US6946732 Stabilizers for flip-chip type semiconductor devices and semiconductor device components and assemblies including the same |
| 09/20/2005 | US6946731 Layout structure for providing stable power source to a main bridge chip substrate and a motherboard |
| 09/20/2005 | US6946730 Semiconductor device having heat conducting plate |
| 09/20/2005 | US6946729 Wafer level package structure with a heat slug |
| 09/20/2005 | US6946728 System and methods for hermetic sealing of post media-filled MEMS package |
| 09/20/2005 | US6946727 Vertical routing structure |
| 09/20/2005 | US6946726 Chip carrier substrate with a land grid array and external bond terminals |
| 09/20/2005 | US6946725 Electronic device having microscopically small contact areas and methods for producing the electronic device |
| 09/20/2005 | US6946724 By forming constricted parts at the separation grooves, the adhesion of the conductive patterns with the insulating resin that fills the separation grooves can be improved |
| 09/20/2005 | US6946723 Semiconductor device and manufacturing method thereof |
| 09/20/2005 | US6946722 Multi-part lead frame with dissimilar materials |
| 09/20/2005 | US6946721 Leadframe of a conductive material and component with a leadframe of a conductive material |
| 09/20/2005 | US6946719 Semiconductor device including junction diode contacting contact-antifuse unit comprising silicide |
| 09/20/2005 | US6946717 High voltage semiconductor device |
| 09/20/2005 | US6946708 Semiconductor apparatus with improved ESD withstanding voltage |
| 09/20/2005 | US6946699 Semiconductor device and its manufacturing method |
| 09/20/2005 | US6946692 Interconnection utilizing diagonal routing |
| 09/20/2005 | US6946681 Molybdenum or molybdenum-tungsten alloy layer is used for a wiring of a display or a semiconductor display along with other metal or alloy layers; low resistivity |
| 09/20/2005 | US6946678 Test key for validating the position of a word line overlaying a trench capacitor in DRAMs |
| 09/20/2005 | US6946661 Methods and apparatus for X-ray image detector assemblies |
| 09/20/2005 | US6946601 Electronic package with passive components |
| 09/20/2005 | US6946513 Polymer composition containing clean filler incorporated therein |
| 09/20/2005 | US6946421 Latent catalyst |
| 09/20/2005 | US6946415 Mixture of magnesium aluminate and glass powder |
| 09/20/2005 | US6946409 Method of manufacturing semiconductor device having nitride film with improved insulating properties |
| 09/20/2005 | US6946401 Plasma treatment for copper oxide reduction |
| 09/20/2005 | US6946389 Method of forming buried conductors |
| 09/20/2005 | US6946382 Process for making air gap containing semiconducting devices and resulting semiconducting device |
| 09/20/2005 | US6946380 Method for forming bump, semiconductor element having bumps and method of manufacturing the same, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment |
| 09/20/2005 | US6946379 Insulative cap for laser fusing |
| 09/20/2005 | US6946376 Symmetric device with contacts self aligned to gate |
| 09/20/2005 | US6946372 Method of manufacturing gallium nitride based semiconductor light emitting device |
| 09/20/2005 | US6946363 Method for bonding substrates |
| 09/20/2005 | US6946331 Apparatus and method for manufacturing semiconductor device incorporating fuse elements |
| 09/20/2005 | US6946329 Methods of making and using a floating interposer |
| 09/20/2005 | US6946327 Semiconductor device and manufacturing method of that |
| 09/20/2005 | US6946325 Methods for packaging microelectronic devices |
| 09/20/2005 | US6946324 Process for fabricating a leadless plastic chip carrier |
| 09/20/2005 | US6946321 Method of forming the integrated circuit having a die with high Q inductors and capacitors attached to a die with a circuit as a flip chip |
| 09/20/2005 | US6946320 FBAR based duplexer device and manufacturing method thereof |
| 09/20/2005 | US6946316 Method of fabricating and using an image sensor package |
| 09/20/2005 | US6946306 Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device |
| 09/20/2005 | US6946305 Apparatus for evaluating amount of charge, method for fabricating the same, and method for evaluating amount of charge |
| 09/20/2005 | US6946198 A semiconductor device is bonded to a wiring board, using a liquid binder containing epoxy resins and a hydrolyzed silantriol coupling agents, a curing agent, and conductive metallic powder; low viscosity |
| 09/20/2005 | US6946190 Thermal management materials |
| 09/20/2005 | US6946113 Method for processing fluid flows in a micro component reformer system |
| 09/20/2005 | US6945791 Integrated circuit redistribution package |
| 09/20/2005 | US6945707 Three-dimensional mounted assembly and optical transmission device |
| 09/20/2005 | US6945406 Tape carrier package film |
| 09/20/2005 | US6945319 Symmetrical heat sink module with a heat pipe for spreading of heat |
| 09/20/2005 | US6945318 Heat-dissipating device |
| 09/20/2005 | US6945315 Heatsink with active liquid base |
| 09/20/2005 | US6945314 Minimal fluid forced convective heat sink for high power computers |
| 09/20/2005 | US6945313 Heat transfer apparatus and method of manufacturing an integrated circuit and heat sink assembly |
| 09/20/2005 | US6945312 tape for providing thermal contact between an energy generating device and an energy dissipating device where the tape includes a tab for facilitating the handling thereof; heat sinks |
| 09/20/2005 | US6945299 Terminal electrode forming method in chip-style electronic component and apparatus therefor |
| 09/20/2005 | US6945054 Method and apparatus for cooling microelectronic complexes including multiple discrete functional modules |
| 09/20/2005 | US6944936 Method for manufacturing an integrated lead suspension |
| 09/20/2005 | CA2160242C Three dimensional package for monolithic microwave/millimeterwave integrated circuits |
| 09/15/2005 | WO2005086532A2 Packaged acoustic and electromagnetic transducer chips |
| 09/15/2005 | WO2005086237A2 Ldmos transistor and method of making the same |
| 09/15/2005 | WO2005086235A2 Base semi-conductor component for a semi-conductor component stack and method for the production thereof |