Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2005
09/22/2005US20050205297 Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus
09/22/2005US20050205293 Substrate
09/22/2005US20050205243 Brazed wick for a heat transfer device and method of making same
09/22/2005US20050205242 Phase-changed heat dissipating device and method for manufacturing it
09/22/2005US20050205241 Closed-loop microchannel cooling system
09/22/2005US20050205240 Finned heat sink
09/22/2005US20050205239 Ebullition cooling device for heat generating component
09/22/2005US20050205196 Screen printing a predetermined thick film pattern onto a fused silica glass substrate to form constraint layers, boring holes and filling with a conductive paste, hydrostatic pressing, firing to obtain a low temperature co-firable ceramic; high density packaging for high frequency and microwave circuits
09/22/2005US20050205195 Method of forming one or more base structures on an LTCC cofired module
09/22/2005US20050205110 Removing native oxides from a substrate surface (semiconductor) in a vacuum chamber by generating reactive species from a gas mixture(NH3 + NF3), cooling surface and reacting with gas to form a film (ammonium hexafluorosilicate), and annealing to vaporize film; dry etching
09/22/2005US20050204823 Pressure sensor and related method
09/22/2005DE4324210B4 Kühlanordnung für elektronische Leistungsbauelemente Cooling arrangement for electronic power devices
09/22/2005DE202005007230U1 Schälrippen-Ring-Kühlkörper Spare ribs Ring heatsink
09/22/2005DE202005006261U1 Protective cover for a heat-conducting material of a heat sink comprises a plate having an opening for closing a heat-conducting material, a first connecting part arranged on two sides of the opening and a second connecting part
09/22/2005DE19900313B4 Halbleitervorrichtung und Herstellungsverfahren einer Halbleitervorrichtung A semiconductor device and manufacturing method of a semiconductor device
09/22/2005DE19813741B4 Halbleitervorrichtung mit einer oberen und einer unteren Leitungsschicht A semiconductor device having an upper and a lower conductive layer
09/22/2005DE10331570B4 Halbleiterchip Semiconductor chip
09/22/2005DE10251247B4 Halbleiterbaugruppe mit Halbleiterchip, gebildet unter Verwendung eines Halbleiters mit breitem Bandabstand als Basismaterial A semiconductor package with semiconductor chip formed using a semiconductor with a wide band gap as a base material
09/22/2005DE102005011300A1 Vorspannungsschaltung, Festkörper-Abbildungssystem und zugehöriges Herstellungsverfahren Bias, solid-state imaging system and manufacturing method thereof
09/22/2005DE102004063702A1 Fabrication of semiconductor device involves forming via hole in protective insulating layer to expose portion of copper line, forming hafnium-containing layer in via hole to cover exposed portion, and forming conductive layer
09/22/2005DE102004063523A1 Halbleitervorrichtung Semiconductor device
09/22/2005DE102004062860A1 Fabrication of copper interconnect of semiconductor device, by depositing barrier layer along bottom and sidewalls of trench and via hole, and depositing tantalum/tantalum nitride layer over substrate including copper interconnect
09/22/2005DE102004032014A1 Circuit module, has passive component with contact areas, and elastic mechanical connection provided between component and one of semiconductor chips, where one contact area is electrically connected with contact areas of chips
09/22/2005DE102004010712A1 Gehäuse für Hochleistungsbauteile Housing for high power devices
09/22/2005DE102004010703A1 Bauelement mit WLP-fähiger Verkapselung und Herstellverfahren Component with WLP-efficient encapsulation and manufacturing
09/22/2005DE102004010169A1 Schaltungsanordnung und Verfahren zur Reduzierung von Übersprechen Circuit arrangement and method for reducing crosstalk
09/22/2005DE102004009981A1 ESD-Schutzschaltkreis mit Kollektorstrom-gesteuerter Zündung für eine monolithisch integrierte Schaltung ESD protection circuit with collector current-controlled ignition of a monolithic integrated circuit
09/22/2005DE102004009296A1 Anordnung eines elektrischen Bauelements und einer elektrischen Verbindungsleitung des Bauelements sowie Verfahren zum Herstellen der Anordnung Arrangement of an electrical component and an electrical connection line of the device and method of manufacturing the arrangement
09/22/2005DE102004009056A1 Halbleiterbauteil mit einem Umverdrahtungssubstrat und Verfahren zur Herstellung desselben Of the same semiconductor device with a rewiring substrate and methods for preparing
09/22/2005DE10103390B4 Verfahren und System zum Herstellen einer im Wesentlichen ringförmigen Lotverbindung A method and system for producing a substantially annular solder joint
09/21/2005EP1577963A2 Flat panel display device
09/21/2005EP1577948A1 Stacked microelectric module with vertical interconnect vias
09/21/2005EP1577947A1 Semiconductor device comprising an encapsulating material that attenuates electromagnetic interference
09/21/2005EP1577946A2 Method to make markers for doublegate SOI processing
09/21/2005EP1577945A2 Module power distribution network
09/21/2005EP1577944A1 Semiconductor device and method for production thereof
09/21/2005EP1577942A2 Device with through-hole interconnection and method for manufacturing the same
09/21/2005EP1577938A1 Semiconductor device, dram integrated circuit device, and its manufacturing method
09/21/2005EP1577936A1 Semiconductor sensor and plating method for semiconductor device
09/21/2005EP1577935A2 Compositions for preparing low dielectric materials containing solvents
09/21/2005EP1577931A2 Heat resistant ohmic electrode and method of manufacturing the same
09/21/2005EP1577739A2 Cooling system for electronic apparatus, and electronic apparatus using the same
09/21/2005EP1576853A2 Microprocessor controlled heater/cooler system
09/21/2005EP1576667A1 Poly-silicon stringer fuse
09/21/2005EP1576653A2 Semiconductor substrate having copper/diamond composite material and method of making same
09/21/2005EP1576652A2 Chip package sealing method
09/21/2005EP1576649A2 Stackable layers containing encapsulated integrated circuit chips with one or more overlying interconnect layers and a method of making the same
09/21/2005EP1576614A2 Tamper-resistant packaging and approach
09/21/2005EP1576320A2 Electroosmotic microchannel cooling system
09/21/2005EP1454333A4 Mems device having a trilayered beam and related methods
09/21/2005EP1169491B1 Low dielectric nano-porous material obtainable from polymer decomposition
09/21/2005CN2727972Y Thermoelectric generator
09/21/2005CN2727969Y Image pickup element, image pickup device, and image reading element
09/21/2005CN2727968Y Laminated wafer structure
09/21/2005CN2727967Y Novel heat pipe type water-cooling radiating set
09/21/2005CN2727966Y Outboard diversion integrated heat pipe radiator
09/21/2005CN2727965Y A radiator with refrigeration wafer
09/21/2005CN2727964Y Radiator
09/21/2005CN2727963Y Thermoelectric and micro-channel circulating heat exchange system
09/21/2005CN2727962Y General fixing piece for radiator
09/21/2005CN2727961Y Radiator
09/21/2005CN2727960Y Fastener for radiator
09/21/2005CN2727959Y 散热器 Heat sink
09/21/2005CN2727958Y 散热器 Heat sink
09/21/2005CN2727957Y Radiator for combined type large power semiconductor device
09/21/2005CN2727956Y Fastener for radiator
09/21/2005CN2727833Y Finned radiator structure having protecting wire net function
09/21/2005CN2727831Y Heat sink for internal memory
09/21/2005CN2727829Y Gravity type high efficiency two-phase flow evaporator
09/21/2005CN1672473A Method for manufacturing board with built-in device and board with built-in device, and method for manufacturing printed wiring board and printed wiring board
09/21/2005CN1672288A Integrated circuit and manufacturing method thereof
09/21/2005CN1672266A Semiconductor structure for imaging detectors
09/21/2005CN1672260A Surface-mountable semiconductor component and method for producing it
09/21/2005CN1672259A Method and apparatus for electronically aligning capacitively coupled chip pads
09/21/2005CN1672258A Flat plate heat transferring apparatus and manufacturing method thereof
09/21/2005CN1672250A Bilayer HDP CVD/PE CVD cap in advanced beol interconnect structures and method thereof
09/21/2005CN1671804A Electrodepositable dielectric coating compositions to coat a substrate and methods to form dielectric coating
09/21/2005CN1671273A Device with through-hole interconnection and method for manufacturing the same
09/21/2005CN1671269A Circuit module
09/21/2005CN1671009A Spiral contactor, contact sheet and connecting device
09/21/2005CN1670978A Method for manufacturing electronic device
09/21/2005CN1670967A A packaging structure with a chip above a photosensitive element and electric packaging structure thereof
09/21/2005CN1670957A System and method of heat dissipation in semiconductor devices
09/21/2005CN1670955A 半导体器件 Semiconductor devices
09/21/2005CN1670954A Semiconductor device and method for manufacturing the same
09/21/2005CN1670953A 半导体装置 Semiconductor device
09/21/2005CN1670952A Wafer-level semiconductor package having lamination structure and making method thereof
09/21/2005CN1670951A Semiconductor device
09/21/2005CN1670950A Integrated heat-pipe radiator with outside diversion
09/21/2005CN1670949A Substrate
09/21/2005CN1670948A System and method for attenuating electromagnetic interference
09/21/2005CN1670947A Integrated radiating base plate and making method thereof
09/21/2005CN1670945A Method of manufacturing high performance copper inductors
09/21/2005CN1670941A Method for fabricating a self-aligned nanocolumnar airbridge and structure produced thereby
09/21/2005CN1670936A Semiconductor device
09/21/2005CN1670935A Wire bonding method and semiconductor device
09/21/2005CN1670933A Method of manufacturing optical semiconductor device, package molding jig, method of manufacturing package molding jig and manufacturing apparatus for package molding jig
09/21/2005CN1670932A Method for forming crystal grain packaging protective layer
09/21/2005CN1670911A Manufacturing method for semiconductor device and determination method for position of semiconductor element
09/21/2005CN1670910A Circuit device and manufacturing method thereof
1 ... 1313 1314 1315 1316 1317 1318 1319 1320 1321 1322 1323 1324 1325 1326 1327 1328 1329 1330 1331 1332 1333 ... 2262