Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2005
09/22/2005US20050208734 Thin flip-chip method
09/22/2005US20050208728 Semiconductor component having an integrated capactiance structure and method for producing the same
09/22/2005US20050208707 Method for fabricating window ball grid array semiconductor package
09/22/2005US20050208706 Method of creating multi-layered monolithic circuit structure containing integral buried and trimmed components
09/22/2005US20050208705 Semiconductor device package and method of production and semiconductor device of same
09/22/2005US20050208703 Method of producing an electronic component with flexible bonding pads
09/22/2005US20050208702 Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof
09/22/2005US20050208701 Semiconductor chip packaging method with individually placed film adhesive pieces
09/22/2005US20050208690 Method of manufacturing optical semiconductor device, package molding jig, method of manufacturing package molding jig and manufacturing apparatus for package molding jig
09/22/2005US20050208685 Periodic patterns and technique to control misalignment
09/22/2005US20050208684 Manufacturing method of semiconductor device
09/22/2005US20050208683 [method of correcting lithographic process and method of forming overlay mark]
09/22/2005US20050208307 Phenolic resins; polysiloxanes; improved solder heat resistance productivity; lightweight
09/22/2005US20050208280 Microelectronic device interconnects
09/22/2005US20050207459 Photoelectric conversion module with cooling function
09/22/2005US20050207256 Semiconductor devices, capacitor antifuses, dynamic random access memories, and cell plate bias connection methods
09/22/2005US20050207238 Clock distribution networks and conductive lines in semiconductor integrated circuits
09/22/2005US20050207131 Delivery regions for power, ground and I/O signal paths in an IC package
09/22/2005US20050207127 Tamper-proof enclosure for a circuit card
09/22/2005US20050207123 Retaining heat sinks on printed circuit boards
09/22/2005US20050207122 Heat dissipating device having an arcuate outer surface
09/22/2005US20050207119 Heat dissipation module of an interface card
09/22/2005US20050207118 Heat dissipation device
09/22/2005US20050207115 Heat dissipating arrangement
09/22/2005US20050207113 Cooling device capable of reducing thickness of electronic apparatus
09/22/2005US20050207092 Electronic component housing package and electronic apparatus
09/22/2005US20050207091 Intermediate substrate
09/22/2005US20050206899 Manufacturing method for semiconductor device and determination method for position of semiconductor element
09/22/2005US20050206798 Liquid crystal display device
09/22/2005US20050206600 Structure of semiconductor chip and display device using the same
09/22/2005US20050206481 Filter
09/22/2005US20050206469 Interdigitated capacitor and method for fabrication therof
09/22/2005US20050206403 System and method for testing devices utilizing capacitively coupled signaling
09/22/2005US20050206394 Measurement of integrated circuit interconnect process parameters
09/22/2005US20050206304 Flat panel display device
09/22/2005US20050206017 Marking on underfill
09/22/2005US20050206016 electronic elements connected to wiring patterns on film substrates and sealed with multilayer, thermoconductive and curable resins; high strength and packaging reliability
09/22/2005US20050206015 System and method for attenuating electromagnetic interference
09/22/2005US20050206014 circuits comprising electroconductive patterns separated by isolation grooves, filled with thermosetting resin layers to cover the surfaces of the patterns, electronics and an insulating resin covering the electronics to support the pattern bonded to the thermosetting resin layer
09/22/2005US20050206013 Chip module
09/22/2005US20050206012 Stress and force management techniques for a semiconductor die
09/22/2005US20050206011 Circuit module
09/22/2005US20050206010 Multi-flip chip on lead frame on over molded IC package and method of assembly
09/22/2005US20050206009 Method for manufacturing wiring board and semiconductor device
09/22/2005US20050206008 Electronic device and method for manufacturing the same
09/22/2005US20050206007 patterned electroconductive barrier layer positioned on copper metallization and protected by an overcoat layer; electronic and semiconductors
09/22/2005US20050206005 Composition and a method for defect reduction
09/22/2005US20050206004 Interconnect structures incorporating low-k dielectric barrier films
09/22/2005US20050206002 Semiconductor device having a wiring layer of damascene structure and method for manufacturing the same
09/22/2005US20050206001 Electrical device and method for manufacturing the same
09/22/2005US20050206000 Barrier for copper integrated circuits
09/22/2005US20050205999 Method for pattern metalization of substrates
09/22/2005US20050205998 Multilayer film-coated substrate and process for its production
09/22/2005US20050205997 Device with through-hole interconnection and method for manufacturing the same
09/22/2005US20050205996 Semiconductor apparatus
09/22/2005US20050205995 Wire bonding method and semiconductor device
09/22/2005US20050205994 Signal transmitting device with vias and solder balls
09/22/2005US20050205993 Semiconductor device
09/22/2005US20050205992 Method of manufacturing substrate joint body, substrate joint body and electrooptical device
09/22/2005US20050205991 System and method of heat dissipation in semiconductor devices
09/22/2005US20050205990 Integrated circuit carrier with conductive rings and semiconductor device integrated with the carrier
09/22/2005US20050205989 Heat dissipation assembly and method for producing the same
09/22/2005US20050205988 Die package with higher useable die contact pad area
09/22/2005US20050205987 Package design and method of manufacture for chip grid array
09/22/2005US20050205986 Module with integrated active substrate and passive substrate
09/22/2005US20050205985 Microelectronic assembly formation with releasable leads
09/22/2005US20050205984 Package structure with a retarding structure and method of making same
09/22/2005US20050205982 Semiconductor device
09/22/2005US20050205981 Stacked electronic part
09/22/2005US20050205980 Method of sensor packaging
09/22/2005US20050205979 Semiconductor package and method for fabricating the same
09/22/2005US20050205978 Semiconductor package and fabrication method thereof
09/22/2005US20050205977 Methods and apparatus for packaging integrated circuit devices
09/22/2005US20050205976 Circuit device and manufacturing method thereof
09/22/2005US20050205975 Semiconductor package having step type die and method for manufacturing the same
09/22/2005US20050205974 Optoelectronic semiconductor component
09/22/2005US20050205973 Board-on-chip packages
09/22/2005US20050205972 COF flexible printed wiring board and semiconductor device
09/22/2005US20050205971 Holiday Light String Devices
09/22/2005US20050205970 [package with stacked substrates]
09/22/2005US20050205969 Charge trap non-volatile memory structure for 2 bits per transistor
09/22/2005US20050205968 Multi-chip package (MCP) with a conductive bar and method for manufacturing the same
09/22/2005US20050205965 Semiconductor device having a fuse including an aluminum layer
09/22/2005US20050205961 Model-based insertion of irregular dummy features
09/22/2005US20050205957 Integrated VCSELs on traditional VLSI packaging
09/22/2005US20050205955 Image sensor and method for fabricating the same
09/22/2005US20050205953 Semiconductor device
09/22/2005US20050205951 Flip chip bonded micro-electromechanical system (MEMS) device
09/22/2005US20050205941 Heat resistant ohmic electrode and method of manufacturing the same
09/22/2005US20050205937 Esd protection device with high voltage and negative voltage tolerance
09/22/2005US20050205935 Manufacturing method for SOI semiconductor device, and SOI semiconductor device
09/22/2005US20050205928 Circuits and methods for electrostatic discharge protection in integrated circuits
09/22/2005US20050205918 Semiconductor device and method for manufacturing the same
09/22/2005US20050205895 Molecular device, molecule array, rectifier device, rectifying method, sensor device, switching device, circuit device, logical circuit device, operational device and information processing device
09/22/2005US20050205888 Semiconductor chip and display device using the same
09/22/2005US20050205870 Semiconductor device and manufacturing method thereof
09/22/2005US20050205865 IC testing apparatus and methods
09/22/2005US20050205850 Organic species that facilitate charge transfer to or from nanostructures
09/22/2005US20050205849 Addition polymer modified with amine, mercaptan, phosphorus compound or acid compound
09/22/2005US20050205516 Wiring board and process for producing the same
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