Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2005
09/27/2005US6949822 Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance
09/27/2005US6949821 Semiconductor package
09/27/2005US6949820 Substrate-based chip package
09/27/2005US6949818 Semiconductor package and structure thereof
09/27/2005US6949817 Stackable test apparatus for protecting integrated circuit packages during testing
09/27/2005US6949816 Semiconductor component having first surface area for electrically coupling to a semiconductor chip and second surface area for electrically coupling to a substrate, and method of manufacturing same
09/27/2005US6949815 Semiconductor device with decoupling capacitors mounted on conductors
09/27/2005US6949814 Mounting material, semiconductor device and method of manufacturing semiconductor device
09/27/2005US6949813 Lead-over-chip lead frames
09/27/2005US6949810 Active phase cancellation for power delivery
09/27/2005US6949807 Signal routing in a hermetically sealed MEMS device
09/27/2005US6949806 Electrostatic discharge protection structure for deep sub-micron gate oxide
09/27/2005US6949802 ESD protection structure
09/27/2005US6949800 Versatile system for electrostatic discharge protection utilizing silicon controlled rectifier
09/27/2005US6949799 Semiconductor structure comprising an electrostatic discharge (ESD) protection device
09/27/2005US6949781 Metal-over-metal devices and the method for manufacturing same
09/27/2005US6949775 Semiconductor device having a guard ring
09/27/2005US6949773 GaN LED for flip-chip bonding and method of fabricating the same
09/27/2005US6949765 Padless structure design for easy identification of bridging defects in lines by passive voltage contrast
09/27/2005US6949707 Periodic interleaved star with vias electromagnetic bandgap structure for microstrip and flip chip on board applications
09/27/2005US6949592 Aqueous blends comprising epoxy resin binders, curing catalyst for hardening, boron trifluoride complex, use as varnish for electrical coiling item protective coatings, including tertiary amines, imidazoles for corrosion resist
09/27/2005US6949476 Method of creating shielded structures to protect semiconductor devices
09/27/2005US6949475 Methods to reduce stress on a metal interconnect
09/27/2005US6949470 Method for manufacturing circuit devices
09/27/2005US6949466 CMP apparatus and method for polishing multiple semiconductor wafers on a single polishing pad using multiple slurry delivery lines
09/27/2005US6949465 Preparation process for semiconductor device
09/27/2005US6949458 Self-aligned contact areas for sidewall image transfer formed conductors
09/27/2005US6949457 Barrier enhancement
09/27/2005US6949456 Method for manufacturing semiconductor device having porous structure with air-gaps
09/27/2005US6949444 High-frequency line
09/27/2005US6949435 Asymmetric-area memory cell
09/27/2005US6949423 MOSFET-fused nonvolatile read-only memory cell (MOFROM)
09/27/2005US6949416 Method of manufacturing a semiconductor integrated circuit device
09/27/2005US6949415 Module with adhesively attached heat sink
09/27/2005US6949414 Method of fabricating a thin and fine ball-grid array package with embedded heat spreader
09/27/2005US6949413 Method of fabricating a thin and fine ball-grid array package with embedded heat spreader
09/27/2005US6949412 Clad plate for forming interposer for semiconductor device, interposer for semiconductor device, and method of manufacturing them
09/27/2005US6949410 Flip chip in leaded molded package and method of manufacture thereof
09/27/2005US6949408 Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps
09/27/2005US6949407 Castellation wafer level packaging of integrated circuit chips
09/27/2005US6949406 Method and apparatus for optically aligning integrated circuit devices
09/27/2005US6949405 Method for producing channels and cavities in semiconductor housings, and an electronic component having such channels and cavities
09/27/2005US6949404 Flip chip package with warpage control
09/27/2005US6949398 Low cost fabrication and assembly of lid for semiconductor devices
09/27/2005US6949217 Use of infrared radiation in molding of protective caps
09/27/2005US6949206 Organic species that facilitate charge transfer to or from nanostructures
09/27/2005US6949156 monlithic; comprises refractory; wet slurry deposition; for production of electronic circuit or hydraulic module
09/27/2005US6948944 Wiring board with built-in electronic component and method for producing the same
09/27/2005US6948940 Helical microelectronic contact and method for fabricating same
09/27/2005US6948556 Hybrid loop cooling of high powered devices
09/27/2005US6948555 Heat dissipating system and method
09/27/2005US6948554 Heat dissipation assembly with resilient fastener
09/27/2005US6948239 Method for fabricating semiconductor apparatus using board frame
09/22/2005WO2005088789A1 Semiconductor laser equipment
09/22/2005WO2005088788A1 Semiconductor laser equipment
09/22/2005WO2005088716A2 Treatment method and device of the working layer of a multilayer structure
09/22/2005WO2005088715A1 System and method pertaining to semiconductor dies
09/22/2005WO2005088714A1 Cold plate and method of making the same
09/22/2005WO2005088713A1 Cooling device
09/22/2005WO2005088712A2 Temperature control system which sprays liquid coolant droplets against an ic-module and directs radiation against the ic-module
09/22/2005WO2005088711A1 Driver module structure
09/22/2005WO2005088710A1 Device comprising a semiconductor chip and a microfluidic system, and method for the production thereof
09/22/2005WO2005088709A1 Housing for an electronic circuit and method for sealing the housing
09/22/2005WO2005088708A2 Improved flip chip mmic on board performance using periodic electromagnetic bandgap structures
09/22/2005WO2005088707A1 Electronic device with stress relief element
09/22/2005WO2005088706A1 Semiconductor package with perforated substrate
09/22/2005WO2005088702A1 Semiconductor device
09/22/2005WO2005088699A1 Method of manufacturing an electronic device and a resulting device
09/22/2005WO2005088696A1 Semiconductor package with contact support layer and method to produce the package
09/22/2005WO2005088429A2 Cooling system for electronic devices and device with such a cooling system
09/22/2005WO2005088222A1 A fluid cooling system
09/22/2005WO2005087980A2 Semiconductor device, method for manufacturing the same and a wiring substrate
09/22/2005WO2005087834A1 Epoxy resin composition and semiconductor device
09/22/2005WO2005087833A1 Epoxy resin composition and semiconductor device
09/22/2005WO2005087430A1 Method of semi-conductor device assembly including fatigue-resistant ternary solder alloy
09/22/2005WO2005067398A3 Driver chip and display apparatus
09/22/2005WO2005057627A3 Manufacturing system and apparatus for balanced product flow with application to low-stress underfiling of flip-chip electronic devices
09/22/2005WO2005057626A3 System and method to reduce metal series resistance of bumped chip
09/22/2005WO2005027198A3 Doped alloys for electrical interconnects, methods of production and uses thereof
09/22/2005WO2004068665A3 Wafer scale packaging technique for sealed optical elements and sealed packages produced thereby
09/22/2005WO2003073805A3 Improved patching methods and apparatus for fabricating memory modules
09/22/2005US20050209737 Method and apparatus for controlling the strategy of compounding pharmaceutical admixtures
09/22/2005US20050208914 High frequency circuit block unit, method for producing same, high frequency module device and method for producing same
09/22/2005US20050208811 Substrate
09/22/2005US20050208796 Spiral contactor, contact sheet having spiral contactor, and connecting device having contact sheet
09/22/2005US20050208791 System and apparatus for socket and package power/ground bar to increase current carrying capacity for higher IC power delivery
09/22/2005US20050208789 Printed wiring board, method of manufacturing the printed wiring board, lead frame package, and optical module
09/22/2005US20050208781 Crackstop with release layer for crack control in semiconductors
09/22/2005US20050208760 Interconnects with a dielectric sealant layer
09/22/2005US20050208758 Dielectric barrier films for use as copper barrier layers in semiconductor trench and via structures
09/22/2005US20050208757 Top layers of metal for high performance IC's
09/22/2005US20050208753 Dual-damascene interconnects without an etch stop layer by alternating ILDs
09/22/2005US20050208752 Method for fabricating a self-aligned nanocolumnar airbridge and structure produced thereby
09/22/2005US20050208751 Solder bump structure and method for forming a solder bump
09/22/2005US20050208750 Method of making cascaded die mountings with springs-loaded contact-bond options
09/22/2005US20050208749 Methods for forming electrical connections and resulting devices
09/22/2005US20050208748 Method for forming robust solder interconnect structures by reducing effects of seed layer underetching
09/22/2005US20050208747 Method of routing an electrical connection on a semiconductor device and structure therefor
09/22/2005US20050208738 Semiconductor device and method of manufacturing the same
09/22/2005US20050208735 Semiconductor device and manufacturing method of the same
1 ... 1311 1312 1313 1314 1315 1316 1317 1318 1319 1320 1321 1322 1323 1324 1325 1326 1327 1328 1329 1330 1331 ... 2262