Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2005
09/28/2005CN2729903Y Heat sink device
09/28/2005CN2729902Y Heat sink device
09/28/2005CN1675968A Method for forming bump on electrode pad with use of double-layered film
09/28/2005CN1675967A An electronic product, a body and a method of manufacturing
09/28/2005CN1675768A Integrated circuit and method of manufacturing same
09/28/2005CN1675767A Buried digit line stack and process for making same
09/28/2005CN1675766A Method for the production of an electrically-conducting frame, method for production of a surface mounting semiconductor component and conductor frame strips
09/28/2005CN1675764A Functional coating of an SCFM preform
09/28/2005CN1675763A Increasing thermal conductivity of thermal interface using carbon nanotubes and CVD
09/28/2005CN1675762A Heat radiating member and connection structure
09/28/2005CN1675761A Semiconductor component having a chip scale package (CSP) housing
09/28/2005CN1675760A 多层印刷线路板 Multilayer printed circuit boards
09/28/2005CN1675757A Anisotropic conductive connector, conductive paste composition, probe member, wafer inspection device and wafer inspection method
09/28/2005CN1675756A Anisotropic conductivity connector, conductive paste composition, probe member, wafer inspecting device, and wafer inspecting method
09/28/2005CN1675755A Anisotropically conductive connector, probe material member, wafer inspection apparatus, and wafer inspection method
09/28/2005CN1675754A Method of microelectrode connection and connected structure of use thereof
09/28/2005CN1675143A Aluminum nitride sintered compact, metallized substrate, heater, jig and method for producing aluminum nitride sintered compact
09/28/2005CN1675041A Method and apparatus for manufacturing a packaged semiconductor device, packaged semiconductor device obtained with such a method and metal carrier suitable for use in such a method
09/28/2005CN1674775A Semiconductor device for optical communication and manufacturing method therefor
09/28/2005CN1674774A Apparatus for reducing electromagnetic wave noise of digital chip
09/28/2005CN1674764A Printed circuit substrate integrated overload protector
09/28/2005CN1674763A Circuit assembly and method of manufacturing the circuit assembly
09/28/2005CN1674762A Wiring substrate and producing method thereof
09/28/2005CN1674758A 电路装置及其制造方法 Circuit device and manufacturing method thereof
09/28/2005CN1674730A Mask, method of manufacturing the same, method of forming thin film pattern, method of manufacturing electro-optical device
09/28/2005CN1674294A Packaging structure of optical sensing chip and producing method thereof
09/28/2005CN1674282A Manufacturing method for semiconductor device, semiconductor device and semiconductor chip
09/28/2005CN1674281A Hybrid integrated circuit device
09/28/2005CN1674280A Stacked electronic part
09/28/2005CN1674278A 电路装置 Circuit means
09/28/2005CN1674277A 电路装置 Circuit means
09/28/2005CN1674276A Multilayer substrate stack packaging structure
09/28/2005CN1674275A Semiconductor device having electrostatic destruction protection circuit using thyristor as protection element
09/28/2005CN1674274A Semiconductor device and process for producing the same
09/28/2005CN1674273A Low power fuse structure and method for making the same
09/28/2005CN1674272A Electronic fuse wire and producing method for forming the same electronic fuse wire
09/28/2005CN1674271A Lead on chip semiconductor package and producing method and equipment thereof
09/28/2005CN1674270A Semiconductor device, magnetic sensor, and magnetic sensor unit
09/28/2005CN1674269A Interlayer member used for producing multi-layer wiring board and method of producing the same
09/28/2005CN1674268A 半导体器件 Semiconductor devices
09/28/2005CN1674267A Method for producing radiating device
09/28/2005CN1674266A Heat releasing structure for semiconductor chip
09/28/2005CN1674265A Resin-sealed semiconductor device and method of manufacturing the same
09/28/2005CN1674264A Wiring substrate, solid-state imaging apparatus using the same, and manufacturing method thereof
09/28/2005CN1674263A 半导体器件 Semiconductor devices
09/28/2005CN1674254A Special semiconductor circuit and resource configuration method for semiconductor circuit driver
09/28/2005CN1674251A Method of fabricating semiconductor device and semiconductor device fabricated thereby
09/28/2005CN1674242A Semiconductor chip, semiconductor device, method for producing semiconductor device, and electronic equipment
09/28/2005CN1674241A Semiconductor device and manufacturing method thereof, and liquid crystal module and semiconductor module having the same
09/28/2005CN1674237A Semiconductor device and apparatus for fabricating the same
09/28/2005CN1674223A Semiconductor device and method of manufacturing the same
09/28/2005CN1674221A Semiconductor package and method for manufacturing the same
09/28/2005CN1674219A Semiconductor device and multi-layer substrate used for the same semiconductor device
09/28/2005CN1674218A 半导体器件 Semiconductor devices
09/28/2005CN1674216A Optical coupler and electronic equipment using same
09/28/2005CN1673274A Resin composition for radiating material and radiating material
09/28/2005CN1673187A Multi-layer ceramic substrate and manufacturing method thereof
09/28/2005CN1673139A Lead-free electroplated silver slurry for outer electrode of multilayer chip element
09/28/2005CN1673045A Structure for containing desiccant
09/28/2005CN1672956A Method of laser marking, laser marking apparatus and method and apparatus for detecting a mark
09/28/2005CN1672804A Deck stain applicator
09/28/2005CN1221156C Light emitting device and producing method thereof
09/28/2005CN1221039C Direct cooling type luminous diode
09/28/2005CN1221031C Chip integrated circuit latch up protective circuit
09/28/2005CN1221030C Integrated heat dissipation device
09/28/2005CN1221029C High frequency semiconductor device
09/28/2005CN1221028C Semiconductor devices and their method of production, and mounting method thereof
09/28/2005CN1221027C Semiconductor package with heat sink structure
09/28/2005CN1221026C Flip-chip semiconductor device with stress absorption layer made of resin and its manufacture method
09/28/2005CN1221021C Method for connecting integrated circuit to substrate and relative circuit wiring
09/28/2005CN1221020C Seal device, metal mold and method for producing semiconductor device
09/28/2005CN1221017C Improved flourine deped silicon dioxide film
09/28/2005CN1220990C Method for producing nano composite magnet by spray method
09/28/2005CN1220887C Discrete light filter structure of ultralong lines range infrared focal plane detector
09/28/2005CN1220731C Silicon composition, low dielectric film, semiconductor device and method for producing low dielectric constant films
09/28/2005CN1220729C Epoxy resin composition and method of producing the same
09/28/2005CN1220621C Post-package technology for microelectromechinical system
09/27/2005US6950784 Semiconductor structures and manufacturing methods
09/27/2005US6950549 Visual inspection method and visual inspection apparatus
09/27/2005US6950315 High frequency module mounting structure in which solder is prevented from peeling
09/27/2005US6950310 System and method for self-leveling heat sink for multiple height devices
09/27/2005US6950307 Fastening structure for a heat sink
09/27/2005US6950306 Connection frame for fan
09/27/2005US6950305 Overmolded device with contoured surface
09/27/2005US6950293 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
09/27/2005US6950165 In-plane switching mode liquid crystal display device
09/27/2005US6949969 Semiconductor device having relief circuit for relieving defective portion
09/27/2005US6949839 Aligned buried structures formed by surface transformation of empty spaces in solid state materials
09/27/2005US6949838 Integrated circuit device
09/27/2005US6949837 Bonding pad arrangement method for semiconductor devices
09/27/2005US6949836 Printed circuit board multi-layer structure with embedded device
09/27/2005US6949834 Stacked semiconductor package with circuit side polymer layer
09/27/2005US6949832 Semiconductor device including dissimilar element-diffused metal layer and manufacturing method thereof
09/27/2005US6949831 In-plane on-chip decoupling capacitors and method for making same
09/27/2005US6949830 Silicon oxycarbide, growth method of silicon oxycarbide layer, semiconductor device and manufacture method for semiconductor device
09/27/2005US6949829 Semiconductor device and fabrication method therefor
09/27/2005US6949828 Wiring structure having integral wiring portion and plug portion and method of forming the same
09/27/2005US6949825 Laminates for encapsulating devices
09/27/2005US6949824 Internal package heat dissipator
09/27/2005US6949823 Method and apparatus for high electrical and thermal performance ball grid array package
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