Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2014
04/08/2014US8692382 Chip package
04/08/2014US8692380 Integrated circuit system with sub-geometry removal and method of manufacture thereof
04/08/2014US8692379 Integrated circuit connector access region
04/08/2014US8692378 UBM structures for wafer level chip scale packaging
04/08/2014US8692377 Integrated circuit packaging system with plated leads and method of manufacture thereof
04/08/2014US8692376 Semiconductor device and method of manufacturing the same
04/08/2014US8692375 Interconnect structure containing various capping materials for programmable electrical fuses
04/08/2014US8692374 Carbon nanotube circuit component structure
04/08/2014US8692372 Semiconductor device having impurity doped polycrystalline layer including impurity diffusion prevention layer and dynamic random memory device including the semiconductor device
04/08/2014US8692371 Semiconductor apparatus and manufacturing method thereof
04/08/2014US8692370 Semiconductor device with copper wire ball-bonded to electrode pad including buffer layer
04/08/2014US8692369 Semiconductor chip and solar system
04/08/2014US8692368 Integrated voltage regulator method with embedded passive device(s)
04/08/2014US8692367 Wafer-level packaged device having self-assembled resilient leads
04/08/2014US8692366 Apparatus and method for microelectromechanical systems device packaging
04/08/2014US8692365 Integrated circuit packaging system with thermal dispersal structures and method of manufacture thereof
04/08/2014US8692364 Semiconductor device and method for manufacturing the same
04/08/2014US8692363 Electric part package and manufacturing method thereof
04/08/2014US8692362 Semiconductor structure having conductive vias and method for manufacturing the same
04/08/2014US8692361 Electric device package comprising a laminate and method of making an electric device package comprising a laminate
04/08/2014US8692358 Image sensor chip package and method for forming the same
04/08/2014US8692357 Semiconductor wafer and processing method therefor
04/08/2014US8692342 Magnetic memory devices having a uniform perpendicular nonmagnetic metal rich anisotropy enhanced pattern
04/08/2014US8692330 Semiconductor device
04/08/2014US8692329 Electric resistance element suitable for light-emitting diode, laser diodes, or photodetectors
04/08/2014US8692300 Interposer and method for forming the same
04/08/2014US8692297 Power and ground shield mesh to remove both capacitive and inductive signal coupling effects of routing in integrated circuit device
04/08/2014US8692266 Circuit substrate structure
04/08/2014US8692263 Organic light emitting diode display and manufacturing method thereof
04/08/2014US8692248 Integrated circuit die having input and output circuit pads, test circuitry, and multiplex circuitry
04/08/2014US8692247 Integrated mechanical device for electrical switching
04/08/2014US8692246 Leakage measurement structure having through silicon vias
04/08/2014US8692245 Crack stop structure and method for forming the same
04/08/2014US8692138 Mold structure for light-emitting diode package
04/08/2014US8692127 Terminal structure, printed wiring board, module substrate, and electronic device
04/08/2014US8691687 Superfilled metal contact vias for semiconductor devices
04/08/2014US8691632 Wafer level package and fabrication method
04/08/2014US8691629 Packaging jig and process for semiconductor packaging
04/08/2014US8691626 Semiconductor chip device with underfill
04/08/2014US8691610 Semiconductor device and method for manufacturing the same
04/08/2014US8691377 Semiconductor device
04/08/2014CA2676495C Mechanical barrier element for improved thermal reliability of electronic components
04/03/2014WO2014052796A1 Systems and methods for providing intramodule radio frequency isolation
04/03/2014WO2014052742A1 Leadframe having sloped metal terminals for wirebonding
04/03/2014WO2014052146A1 Cooling technique
04/03/2014WO2014052138A1 Interposer having embedded memory controller circuitry
04/03/2014WO2014052019A1 Foamed-metal components for wireless-communication towers
04/03/2014WO2014052018A1 Low-density, metal-based components for wireless-communication towers
04/03/2014WO2014051977A1 Integrated voltage regulators with magnetically enhanced inductors
04/03/2014WO2014051894A2 Noise attenuation wall
04/03/2014WO2014051817A1 Embedded structures for package-on-package architecture
04/03/2014WO2014051816A1 System in package with embedded rf die in coreless substrate
04/03/2014WO2014051804A1 Film interposer for integrated circuit devices
04/03/2014WO2014051786A1 Stacked-die package including die in package substrate
04/03/2014WO2014051731A1 Non-planar semiconductor device having channel region with low band-gap cladding layer
04/03/2014WO2014051714A1 Bumpless build-up layer package including an integrated heat spreader
04/03/2014WO2014051604A1 Cooling assembly
04/03/2014WO2014051241A1 Thermosetting epoxy resin composition having good impact resistance
04/03/2014WO2014050995A1 Multilayer wiring board, and method for manufacturing multilayer wiring board
04/03/2014WO2014050978A1 Polycarboxylic acid resin and epoxy resin composition
04/03/2014WO2014050662A1 Method for manufacturing semiconductor device and bonding sheet
04/03/2014WO2014050590A1 Semiconductor device and method for manufacturing same
04/03/2014WO2014050420A1 Epoxy resin, curable resin composition, cured product thereof, and printed circuit board
04/03/2014WO2014050389A1 Power semiconductor module
04/03/2014WO2014050318A1 Silicone composition for sealing optical semiconductor element, and optical semiconductor device
04/03/2014WO2014050278A1 Power semiconductor module
04/03/2014WO2014050183A1 Production method for sealing material containing fluorescent body, sealing material containing fluorescent body, production method for light-emitting device, and dispenser
04/03/2014WO2014050081A1 Electronic device
04/03/2014WO2014049967A1 Layered structure and thin-film-transistor array, and method for producing same
04/03/2014WO2014049965A1 Circuit module using mounting board
04/03/2014WO2014049805A1 Cooling system and electric device using same
04/03/2014WO2014049740A1 Electric component
04/03/2014WO2014049551A1 Assembly method, of the flip-chip type, for connecting two electronic components, assembly obtained by the method
04/03/2014WO2014049009A1 Bender transducer module, cooling device and electronic module
04/03/2014WO2014049004A1 Cooling device for cooling an electronic component, and electronic module
04/03/2014WO2014048987A1 Optoelectronic component and method for producing an optoelectronic component
04/03/2014WO2014048835A1 Leadframe assembly, housing assembly, module assembly and method for determining at least one measurement value of a measurement variable of an electronic module
04/03/2014WO2014048680A1 Isolating conduit for a dielectric fluid
04/03/2014WO2014048639A1 Method for producing a passive electronic component, method for producing an optoelectronic assembly and passive electronic component
04/03/2014WO2014048502A1 Method for coating and bonding substrates
04/03/2014WO2014048449A1 Electronic device and method for forming an electrical connection
04/03/2014WO2014048046A1 Trench-type terminal for semiconductor power device and preparation method therefor
04/03/2014WO2014024807A3 Curable silicone composition and cured product thereof
04/03/2014WO2014023287A3 Contact bump connection and contact bump and method for producing a contact bump connection
04/03/2014WO2012067687A3 Nanoscale emitters with polarization grading
04/03/2014US20140094016 Alignment for Backside Illumination Sensor
04/03/2014US20140094007 Through silicon via and method of fabricating same
04/03/2014US20140094001 Semiconductor device and method for manufacturing the same
04/03/2014US20140094000 Semiconductor device
04/03/2014US20140092939 Thermal Sensor with Second-Order Temperature Curvature Correction
04/03/2014US20140092573 Contact protection for integrated circuit device loading
04/03/2014US20140092079 Thin film transistor array substate and liquid crystal display apparatus thereof
04/03/2014US20140091483 Method of manufacturing semiconductor apparatus and semiconductor apparatus
04/03/2014US20140091482 Semiconductor Device and Method of Depositing Encapsulant Along Sides and Surface Edge of Semiconductor Die in Embedded WLCSP
04/03/2014US20140091481 Semiconductor package
04/03/2014US20140091480 Dicing tape-integrated wafer back surface protective film
04/03/2014US20140091478 Semiconductor device
04/03/2014US20140091477 System and method for chemical-mechanical planarization of a metal layer
04/03/2014US20140091476 Directed self assembly of block copolymers to form vias aligned with interconnects
04/03/2014US20140091475 Method and apparatus to improve reliability of vias
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