Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2005
09/29/2005US20050212107 Circuit device and manufacturing method thereof
09/29/2005US20050212106 Multilayer integrated circuit for RF communication and method for assembly thereof
09/29/2005US20050212104 Semiconductor device
09/29/2005US20050212103 Semiconductor device designed to produce no resonance of loop due to ultrasonic vibration, semiconductor design apparatus and method of manufacturing semiconductor device
09/29/2005US20050212102 Method for attaching shields on substrates
09/29/2005US20050212101 Semiconductor device and method of manufacturing the same
09/29/2005US20050212100 Semiconductor device for optical communication and manufacturing method therefor
09/29/2005US20050212099 Lead on chip semiconductor package
09/29/2005US20050212098 Surface-mountable semiconductor component and method for producing it
09/29/2005US20050212097 Charge device model (CDM) electrostatic discharge (ESD) failure rate via capacitive coating
09/29/2005US20050212095 Substrate and method for measuring the electrophysiological properties of cell membranes
09/29/2005US20050212094 Conducting polymer composite and solid electrolytic capacitor using the same
09/29/2005US20050212093 Semiconductor device and apparatus for fabricating the same
09/29/2005US20050212092 Wafer, semiconductor chip, and semiconductor device manufacturing method
09/29/2005US20050212091 Semiconductor apparatus and method of fabricating the apparatus
09/29/2005US20050212090 Integrated circuit
09/29/2005US20050212085 Semiconductor device and method for manufacturing it
09/29/2005US20050212084 Chip circuit comprising an inductor
09/29/2005US20050212081 Fuse region of a semiconductor device and method of fabricating the same
09/29/2005US20050212080 Diode junction poly fuse
09/29/2005US20050212078 Integrated circuit module package and assembly method thereof
09/29/2005US20050212076 Power semiconductor component with increased robustness
09/29/2005US20050212067 Microelectromechanical devices with lubricants and getters formed thereon
09/29/2005US20050212054 Semiconductor device and method of manufacturing the same
09/29/2005US20050212052 High voltage ESD-protection structure
09/29/2005US20050212050 Device for electrostatic discharge protection and method of manufacturing the same
09/29/2005US20050212049 Semiconductor device and process for producing the same
09/29/2005US20050212018 Conductive lines buried in insulating areas
09/29/2005US20050212016 On-chip integrated detector for analyzing fluids
09/29/2005US20050212012 Horizontal MOS transistor
09/29/2005US20050212011 Architecture for mask programmable devices
09/29/2005US20050212009 Semiconductor device having electrostatic destruction protection circuit using thyristor as protection element
09/29/2005US20050211981 Mask, method of manufacturing the same, method of forming thin film pattern, method of manufacturing electro-optical device and electronic equipment
09/29/2005US20050211980 Device and method for detecting stress migration properties
09/29/2005US20050211979 IC package, inspection method of IC package mounting body, repairing method of IC package mounting body, and inspection pin for IC package mounting body
09/29/2005US20050211900 Device for maintaining an object under vacuum and methods for making same, use in non-cooled infrared sensors
09/29/2005US20050211888 Solid state imaging device
09/29/2005US20050211752 Metallic solder thermal interface material layer and application of the same
09/29/2005US20050211750 Method of creating solder bar connections on electronic packages
09/29/2005US20050211682 Laser processing
09/29/2005US20050211465 Electronic parts packaging structure and method of manufacturing the same
09/29/2005US20050211464 connecting microcircuits patterns such as tape carrier packages, flexible printed circuit, liquid crystal displays or printed circuit board using dielectric thermoplastic resins and anisotropic electroconductive adhesive including conductive particles
09/29/2005US20050211419 Heat dissipation module
09/29/2005US20050211418 Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
09/29/2005US20050211417 Interwoven manifolds for pressure drop reduction in microchannel heat exchangers
09/29/2005US20050211416 Heat sink with fins and a method for manufacturing the same
09/29/2005US20050211236 Dicing saw with variable indexing capability
09/29/2005US20050210913 Remedies to prevent cracking in a liquid system
09/29/2005US20050210906 Heat sink
09/29/2005US20050210905 Separate thermal and electrical throttling limits in processors
09/29/2005DE3812135B4 Verfahren zum Herstellen von elektrischen Kontakten hoher Ausbeute an amorphes N+-Silizium A method for producing electrical contacts high yield of amorphous N + -silicon
09/29/2005DE202005010867U1 Soldered joint`s shape and height manipulating body, has laser holes that are annealed vertically into silicone elastomer band, where solder joints are coated by body to determine shape and height of joints which can be controlled
09/29/2005DE19731944B4 Testmusterbereich bzw. eine Testelementgruppe zur Lebensdauerauswertung von Ladungsträgern in einem Halbleitersubstrat Test pattern area or a test element group for lifetime evaluation of charge carriers in a semiconductor substrate
09/29/2005DE19723096B4 Verfahren zum Bilden einer Verbindungsleitung A method of forming an interconnector
09/29/2005DE19707325B4 Verfahren zum Prüfen integrierter Schaltkreise A method of testing integrated circuits
09/29/2005DE10393232T5 Halbleiterchipgehäuse mit Drain-Klemme A semiconductor chip package with drain clip
09/29/2005DE10392461T5 Packaging-System für Halbleitervorrichtungen Packaging system for semiconductor devices
09/29/2005DE10297766T5 Wärmeableitungsvorrichtung für Integrierte Schaltungen Heat dissipation device for Integrated Circuits
09/29/2005DE10233607B4 Anordnung mit einem Halbleiterchip und einem mit einer Durchkontaktierung versehenen Träger sowie einem ein Anschlusspad des Halbleiterchips mit der Durchkontaktierung verbindenden Draht und Verfahren zum Herstellen einer solchen Anordnung Arrangement with a semiconductor chip and a carrier provided with a via hole and a connection pad of a semiconductor chip to the plated-through hole connecting wire and method of manufacturing such an arrangement
09/29/2005DE102005008346A1 Halbleitervorrichtung Semiconductor device
09/29/2005DE102005008272A1 Sensorvorrichtung Sensor device
09/29/2005DE102004060922A1 Klebstofffilm zum Herstellen einer Halbleitereinrichtung Adhesive film for manufacturing a semiconductor device
09/29/2005DE102004035343A1 Contacting card for use in testing integrated circuits, has a substrate carrier with contacts matching those of a wafer substrate to be tested and connects from these contacts to a testing device
09/29/2005DE102004030124A1 Cooling system for electronic components in e.g. computer, has components click-fixed into the interior of the device housing
09/29/2005DE102004028888A1 Electronic component, especially regulator or micromechanical sensor element for automobiles, with gel layer of specific hardness for protecting circuitry against corrosion, temperature and vibration
09/29/2005DE102004012238A1 Arrangement of semiconductor elements on a wafer has capacitors near sawing edge and fuse elements near chips for testing
09/29/2005DE102004012231A1 Metal-ceramic substrate for electronics switches or modules comprises a ceramic layer containing aluminum oxide, zirconium oxide and yttrium oxide with a copper foil or layer formed on both sides
09/29/2005DE102004011808A1 Power module for automotive application, has molded housing surrounding semiconductor component and wire bond, and connection area left out from housing and suspended on layer
09/29/2005DE102004011203A1 Verfahren zum Montieren von Halbleiterchips und entsprechende Halbleiterchipanordnung A method for mounting semiconductor chips and corresponding semiconductor chip system
09/29/2005DE102004010614A1 Basishalbleiterbauteil für einen Halbleiterbeuteilstapel und Verfahren zur Herstellung desselben Based semiconductor device for a Halbleiterbeuteilstapel and method of manufacturing the same
09/29/2005DE102004010115A1 Semiconductor circuit manufacturing method, involves bonding discrete semiconductor components on substrate such that base and emitter terminals of corresponding P and N conductive regions on one side of substrate are accessible
09/29/2005DE102004009567A1 Wiring carrier for accommodating chip, is divided into function unit, such that bending rigidity of cross board and side band portion is increased
09/29/2005DE102004008475A1 Semiconductor chip breaking strength increasing method for use during manufacturing of chips, involves applying coating on backside of wafer for protecting chips from physical or chemical effects, where thickness of coating is large
09/29/2005DE102004005586B3 Halbleiterbauteil mit einem Halbleiterchipstapel auf einer Umverdrahtungsplatte und Herstellung desselben Of the same semiconductor device with a semiconductor chip stack on a rewiring and manufacturing
09/29/2005DE102004005269B4 Light emitting semiconductor element has multilayers on a substrate with the pn junction insulatively separated into light emitting and protective diode sections
09/28/2005EP1580818A1 Process for producing optical semiconductor device
09/28/2005EP1580810A2 A semiconductor device with a plurality of ground planes
09/28/2005EP1580809A2 Ceramic substrate incorporating an ESD protection for a light emitting diode
09/28/2005EP1580808A2 Method and apparatus for routing differential signals across a semiconductor chip
09/28/2005EP1580807A1 Cooler for elelectronic power device
09/28/2005EP1580804A1 Composition for porous film formation, porous films, process for production of the films, interlayer dielectrics, and semiconductor devices
09/28/2005EP1580568A2 Semiconductor device, magnetic sensor, and magnetic sensor unit
09/28/2005EP1580235A1 Resin composition, cured resin, cured resin sheet, laminate, prepreg, electronic part, and multilayer substrate
09/28/2005EP1579509A1 Group iii nitride based flip-chip integrated circuit and method for fabricating
09/28/2005EP1579505A1 Electronic device and use thereof
09/28/2005EP1579504A1 Method of producing semiconductor elements using a test structure
09/28/2005EP1579503A2 Semiconductor device power interconnect striping
09/28/2005EP1579502A2 Electronic device and method of manufacturing same
09/28/2005EP1579501A2 Thermal interface materials and methods for their preparation and use
09/28/2005EP1579499A1 Method of self-assembling electronic circuitry and circuits formed thereby
09/28/2005EP1579496A2 Electronic device and method of manufacturing same
09/28/2005EP1579495A2 Method for fabrication of semiconductor device
09/28/2005EP1579165A2 Heatsink with multiple, selectable fin densities
09/28/2005EP1579155A2 Method and system for cooling high power density devices
09/28/2005EP1578559A1 Bonding material and bonding method
09/28/2005EP1176159B1 Thermosetting resin composition and flexible-circuit overcoating material comprising the same
09/28/2005EP1042807B1 Semiconductor device
09/28/2005EP0886894B1 Contact carriers for populating substrates with spring contacts
09/28/2005CN2729905Y Semiconductor package structure witn open heat-sink component
09/28/2005CN2729904Y Improved structure of heat sink of central processor
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