Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2005
09/29/2005WO2005091313A1 Electronic component
09/29/2005WO2005091262A1 Electroluminescent display devices
09/29/2005WO2005090789A1 Gas jetting device, electronic device and gas jetting method
09/29/2005WO2005090510A1 Resin composition and semiconductor devices made by using the same
09/29/2005WO2005090228A1 Flip chip bonded micro-electro-mechanical system (mems) device
09/29/2005WO2005090032A1 Process for producing ceramic sheet, ceramic substrate utilizing the same and use thereof
09/29/2005WO2005089510A2 Method of forming one or more base structures on an ltcc cofired module
09/29/2005WO2005089477A2 Direct cooling of leds
09/29/2005WO2005057629A3 Assembly and adhesive layer for semiconductor components
09/29/2005WO2005055321A3 Electronical circuit package with cavity resonance cut off member
09/29/2005WO2005041121B1 Rfid device and method of making
09/29/2005WO2005034200A3 Adjustable self-aligned air gap dielectric for low capacitance wiring
09/29/2005WO2005031805A3 Multi-surface ic packaging structures and methods for their manufacture
09/29/2005WO2004100253A3 Electronic component as well as system support and panel for the production thereof
09/29/2005US20050216876 Method and apparatus for routing differential signals across a semiconductor chip
09/29/2005US20050216291 Complete mold system
09/29/2005US20050215415 For a semiconductor production and/or inspection apparatus; the average concentration of free carbon in the work mounting portion is different from the average concentration of free carbon in the base layer
09/29/2005US20050215086 Sheet-form connector and production method and application therefor
09/29/2005US20050215072 Method and system for treating a dielectric film
09/29/2005US20050215067 Combination insulator and organic semiconductor formed from self-assembling block co-polymers
09/29/2005US20050215058 Methods of forming channels on an integrated circuit die and die cooling systems including such channels
09/29/2005US20050215049 Semiconductor device and method of manufacturing the same
09/29/2005US20050215048 Structure and method for contact pads having an overcoat-protected bondable metal plug over copper-metallized integrated circuits
09/29/2005US20050215047 Method of manufacturing a semiconductor device having damascene structures with air gaps
09/29/2005US20050215045 Methods of forming bumps using barrier layers as etch masks and related structures
09/29/2005US20050215044 Method for forming photoresist layer on subsrtate and bumping process using the same
09/29/2005US20050215043 Low fabrication cost, high performance, high reliability chip scale package
09/29/2005US20050215004 Method of forming MIM capacitor electrodes
09/29/2005US20050214988 Method and structure for buried circuits and devices
09/29/2005US20050214982 Electrical fuse for silicon-on-insulator devices
09/29/2005US20050214981 Circuit device and manufacturing method thereof
09/29/2005US20050214980 Land grid array packaged device and method of forming same
09/29/2005US20050214979 Semiconductor package and method for manufacturing the same
09/29/2005US20050214978 Lower profile flexible substrate package for electronic components
09/29/2005US20050214977 Microelectronic packaging and methods for thermally protecting package interconnects and components
09/29/2005US20050214975 Method of fabricating the planar encapsulated surface
09/29/2005US20050214972 Semiconductor device assembly method and semiconductor device assembly apparatus
09/29/2005US20050214971 Bumping process, bump structure, packaging process and package structure
09/29/2005US20050214970 Method and apparatus for lubricating microelectromechanical devices in packages
09/29/2005US20050214968 Method for fixing a semiconductor chip in a plastic housing body, optoelectronic semiconductor component
09/29/2005US20050214956 High throughput measurement of via defects in interconnects
09/29/2005US20050214518 Circuit board, process for producing the same, and power module
09/29/2005US20050214516 Multi-layer ceramic substrate and manufacturing method thereof
09/29/2005US20050214060 Deck stain applicator
09/29/2005US20050213926 Curable silicone resin composition, sealing material for optical semiconductor, and optical semiconductor device
09/29/2005US20050213458 Method and system of recognizing ID marks appended on base materials, and method of manufacturing products by base materials with the ID marks
09/29/2005US20050213384 Semiconductor device and method of forming the same
09/29/2005US20050213373 Microelectronic device package filled with liquid or pressurized gas and associated method of manufacture
09/29/2005US20050213308 Hybrid integrated circuit device
09/29/2005US20050213304 Cooling devices for cooling electric components, module consisting of a cooling device and electric components and assembly comprising a cooling device or module and a support
09/29/2005US20050213303 Cooler, electronic apparatus, and method for fabricating cooler
09/29/2005US20050213301 Cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel
09/29/2005US20050213281 Extended thin film capacitor (tfc)
09/29/2005US20050212906 Methods and systems for processing a device, methods and systems for modeling same and the device
09/29/2005US20050212642 Embedded toroidal transformers in ceramic substrates
09/29/2005US20050212624 Microwave circuit
09/29/2005US20050212562 Architecture of function blocks and wirings in a structured ASIC and configurable driver cell of a logic cell zone
09/29/2005US20050212549 Motor driving system having power semiconductor module life detection function
09/29/2005US20050212547 System and method for measuring time dependent dielectric breakdown with a ring oscillator
09/29/2005US20050212543 System and method for measuring negative bias thermal instability with a ring oscillator
09/29/2005US20050212387 Piezoelectric oscillator
09/29/2005US20050212149 Adhesion by plasma conditioning of semiconductor chip surfaces
09/29/2005US20050212148 Semiconductor device
09/29/2005US20050212147 Semiconductor wafer, semiconductor chip, and semiconductor chip inspection method
09/29/2005US20050212146 Resin-sealed semiconductor device and method of manufacturing the same
09/29/2005US20050212145 Semiconductor device and method of manufacturing the same
09/29/2005US20050212143 Microelectronics; encapsulation
09/29/2005US20050212142 Semiconductor device and manufacturing metthod thereof
09/29/2005US20050212141 Semiconductor appartus
09/29/2005US20050212140 Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip
09/29/2005US20050212139 Oxidizing top layer of diffusion barrier to form metal oxide layer, reducing oxidation state to form seed layer, and depositing conductor; atomic layer deposition; chemical mechanical polishing
09/29/2005US20050212138 Barrier enhancement
09/29/2005US20050212137 Semiconductor device having a multilayer interconnection structure and fabrication method thereof
09/29/2005US20050212136 Multi-layer wiring structure with dummy patterns for improving surface flatness
09/29/2005US20050212135 Interconnect structure with dielectric barrier and fabrication method thereof
09/29/2005US20050212134 Semiconductor package structure with reduced parasite capacitance and method of fabricating the same
09/29/2005US20050212133 Under bump metallization layer to enable use of high tin content solder bumps
09/29/2005US20050212132 Chip package and process thereof
09/29/2005US20050212131 Electric wave readable data carrier manufacturing method, substrate, and electronic component module
09/29/2005US20050212130 Semiconductor chip, semiconductor device, method for producing semiconductor device, and electronic equipment
09/29/2005US20050212129 Semiconductor package with build-up structure and method for fabricating the same
09/29/2005US20050212128 Copper interconnect
09/29/2005US20050212127 Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities
09/29/2005US20050212126 Semiconductor device and method of manufacturing the same
09/29/2005US20050212125 Electrical component
09/29/2005US20050212124 Device for cooling hot spot in micro system
09/29/2005US20050212123 Integrated heat spreader with downset edge, and method of making same
09/29/2005US20050212122 Multi-layer fet array and method of fabricating
09/29/2005US20050212121 IC die with directly bonded liquid cooling device
09/29/2005US20050212120 Electronic assembly with integrated IO and power contacts
09/29/2005US20050212118 Chip packaging structure and method of making wafer level packaging
09/29/2005US20050212117 Microcap wafer bonding method and apparatus
09/29/2005US20050212116 Semiconductor device
09/29/2005US20050212115 Structure for containing desiccant
09/29/2005US20050212114 Semiconductor device
09/29/2005US20050212113 Spaced pads arranged along side surface of circuit substrate, with leads fixed thereto
09/29/2005US20050212112 Semiconducting device with folded interposer
09/29/2005US20050212110 Circuit device
09/29/2005US20050212109 Vertically stacked semiconductor device
09/29/2005US20050212108 Semiconductor chip package
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