Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2005
10/05/2005CN1677671A Integrated circuit device
10/05/2005CN1677670A Integrated circuit device, method of manufacturing the same and method of forming vanadium oxide film
10/05/2005CN1677668A Integrated circuit device
10/05/2005CN1677667A Hybrid integrated circuit device and method of manufacturing the same
10/05/2005CN1677666A Semiconductor device
10/05/2005CN1677665A 电路装置及其制造方法 Circuit device and manufacturing method thereof
10/05/2005CN1677664A Device for electrostatic discharge protection and method of manufacturing the same
10/05/2005CN1677663A Electrostatic discharging protection device capable of bearing high-voltage and negative voltage
10/05/2005CN1677662A Electrostatic discharging protection device for high-voltage assembly and mfg. method
10/05/2005CN1677661A Multi-layer wiring structure with dummy patterns for improving surface flatness
10/05/2005CN1677660A Semiconductor apparatus, manufacturing method thereof, semiconductor module apparatus using semiconductor apparatus, and wire substrate for semiconductor apparatus
10/05/2005CN1677659A Through electrode, spacer provided with the through electrode, and method of manufacturing the same
10/05/2005CN1677658A Semiconductor device and method for manufacturing the same
10/05/2005CN1677657A Semiconductor device and manufacturing method for the same
10/05/2005CN1677656A Semiconductor device and method of producing the semiconductor device
10/05/2005CN1677655A Method of manufacturing radiating plate and semiconductor apparatus using the same
10/05/2005CN1677654A Radiating module
10/05/2005CN1677653A 散热器 Heat sink
10/05/2005CN1677652A Vice mounting board and semiconductor apparatus using device mounting board
10/05/2005CN1677651A Device mounting board
10/05/2005CN1677650A Semiconductor package device with layer-increasing structure and making method thereof
10/05/2005CN1677649A Semiconductor element with crystal-particle-protection function
10/05/2005CN1677646A Semiconductor device, electrostatic discharging protection device and its making method
10/05/2005CN1677644A Low dielectric semiconductor device and process for fabricating the same
10/05/2005CN1677643A Method of manufacturing a semiconductor device having damascene structures with air gaps
10/05/2005CN1677642A Method of manufacturing semiconductor device
10/05/2005CN1677635A Manufacturing method and manufacturing apparatus for semiconductor device
10/05/2005CN1677634A Semiconductor apparatus and method of fabricating the apparatus
10/05/2005CN1677633A Motor drive device with power semiconductor module life testing function
10/05/2005CN1677630A Crystal-covering package method and structure for covering crystal
10/05/2005CN1677625A Deposition method and semiconductor device
10/05/2005CN1677621A Method of forming MIM capacitor electrodes
10/05/2005CN1677614A Semiconductor device, electrical inspection method thereof, and electronic apparatus including the semiconductor device
10/05/2005CN1677590A Conducting polymer composite and solid electrolytic capacitor using the same
10/05/2005CN1677211A Semiconductor device having a low-resistance bus interconnect, method of manufacturing same, and display apparatus employing same
10/05/2005CN1677114A Voltage measuring apparatus
10/05/2005CN1676939A Pump, cooling apparatus, electrical appliance and personal computer combined with the pump
10/05/2005CN1676568A Thermal interface material and its manufacturing method
10/05/2005CN1676565A Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
10/05/2005CN1222200C Circuit micro assembly
10/05/2005CN1222198C Printed circuit board with testing point formed at side
10/05/2005CN1222042C Metal inter-connector and active matrix bottom therewith
10/05/2005CN1222037C Memory assembly and its making method
10/05/2005CN1222036C Semiconductor device fabrication method and device thereof
10/05/2005CN1222035C Heat-generating electronic elements radiator jointed by jointer
10/05/2005CN1222034C Radiator capable of notable controlling high frequency current passing through electronic element
10/05/2005CN1222033C Package for electronic device and method of mfg. package
10/05/2005CN1222024C Method for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby
10/05/2005CN1222018C Mfg. method of semiconductor
10/05/2005CN1221992C Ceramic electronic element
10/05/2005CN1221610C Paste composition, and protective film and semiconductor device both obtained with the same
10/04/2005USRE38806 Semiconductor device and method of manufacturing the same
10/04/2005USH2128 Radiation hardened microcircuits
10/04/2005US6952584 Method & systems for providing information to a home system regarding a wireless unit roaming in a visited system
10/04/2005US6952352 Integrated circuit chip package with formable intermediate 3D wiring structure
10/04/2005US6952348 Heat sink assembly incorporating mounting frame
10/04/2005US6952347 Power module
10/04/2005US6952345 Method and apparatus for cooling heat-generating structure
10/04/2005US6952055 Intermediate structures in porous substrates in which electrical and optical microdevices are fabricated and intermediate structures formed by the same
10/04/2005US6952054 Semiconductor package having interconnect with conductive members
10/04/2005US6952053 Metal bond pad for integrated circuits allowing improved probing ability of small pads
10/04/2005US6952052 Cu interconnects with composite barrier layers for wafer-to-wafer uniformity
10/04/2005US6952050 Semiconductor package
10/04/2005US6952049 Capacitor-built-in type printed wiring substrate, printed wiring substrate, and capacitor
10/04/2005US6952048 Semiconductor device with improved design freedom of external terminal
10/04/2005US6952046 Electronic and optoelectronic component packaging technique
10/04/2005US6952045 Memory device power distribution in electronic systems
10/04/2005US6952037 Electrostatic discharge semiconductor protection circuit of reduced area
10/04/2005US6952030 High-density three-dimensional memory cell
10/04/2005US6952027 Semiconductor integrated circuit device and electronic card using the same
10/04/2005US6952020 Semiconductor device and manufacturing method thereof
10/04/2005US6951981 Asymmetric transfer molding method and an asymmetric encapsulation made therefrom
10/04/2005US6951980 dielectrics; integrated circuits; semiconductors
10/04/2005US6951907 Composition of epoxy resin, secondary amine-functional adhesion promotor and curative of nitrogen-compound and transition metal complex
10/04/2005US6951826 Silicon carbide deposition for use as a low dielectric constant anti-reflective coating
10/04/2005US6951812 Copper transition layer for improving copper interconnection reliability
10/04/2005US6951811 Method of producing vias and other conductor parts on an electrode terminal forming surface of a semiconductor wafer
10/04/2005US6951807 Semiconductor device and manufacturing method thereof
10/04/2005US6951806 Metal region for reduction of capacitive coupling between signal lines
10/04/2005US6951781 Semiconductor device and method of manufacturing the same
10/04/2005US6951779 Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages
10/04/2005US6951777 Methods for forming a slot with a laterally recessed area at an end thereof through an interposer or other carrier substrate
10/04/2005US6951776 Method of fabricating a thin and fine ball-grid array package with embedded heat spreader
10/04/2005US6951774 Semiconductor device and method of manufacturing the same
10/04/2005US6951773 Chip packaging structure and manufacturing process thereof
10/04/2005US6951125 System and method for aligning an integrated circuit die on an integrated circuit substrate
09/2005
09/29/2005WO2005091692A1 Module heat radiation structure and control device using the same
09/29/2005WO2005091367A1 Electronic circuit, semiconductor device, and mounting board
09/29/2005WO2005091365A2 Coupling substrate for semiconductor components and method for the production thereof
09/29/2005WO2005091364A1 Integrated electronic module structure for vehicles
09/29/2005WO2005091363A1 Heat sink board and manufacturing method thereof
09/29/2005WO2005091362A1 Method, device and system for controlling heating of circuits
09/29/2005WO2005091361A1 Semiconductor device and method of manufacturing thereof
09/29/2005WO2005091360A1 Substrate for semiconductor device and semiconductor device
09/29/2005WO2005091359A1 Method for producing a sensor module and corresponding sensor module
09/29/2005WO2005091354A1 Solder composition and method of bump formation therewith
09/29/2005WO2005091353A1 A non-leaded semiconductor package and a method to assemble the same
09/29/2005WO2005091352A1 Packaging of microelectronic, optoelectronic and other devices
09/29/2005WO2005091351A1 Substrate for device bonding and method for manufacturing same
09/29/2005WO2005091345A1 Carbon nanotube-containing metal thin film
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