Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2005
10/06/2005US20050218491 Circuit component module and method of manufacturing the same
10/06/2005US20050218490 Semiconductor storage device, semiconductor device, and manufacturing method therefor
10/06/2005US20050218489 Semiconductor device
10/06/2005US20050218487 Method for manufacturing wiring substrate and method for manufacturing electronic device
10/06/2005US20050218486 Semiconductor BGA package having a segmented voltage plane and method of making
10/06/2005US20050218485 Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same
10/06/2005US20050218484 Wiring carrier design
10/06/2005US20050218483 Method and semiconductor device having copper interconnect for bonding
10/06/2005US20050218482 Top finger having a groove and semiconductor device having the same
10/06/2005US20050218481 Composite polymer dielectric film
10/06/2005US20050218480 Device mounting board and semiconductor apparatus using device mounting board
10/06/2005US20050218479 Spacer die structure and method for attaching
10/06/2005US20050218478 Semiconductor device
10/06/2005US20050218477 Semiconductor device and method for manufacturing the same
10/06/2005US20050218476 Integrated process for fuse opening and passivation process for Cu/Low-K IMD
10/06/2005US20050218475 Low power fuse structure and method for making the same
10/06/2005US20050218474 Use of DAR coating to modulate the efficiency of laser fuse blows
10/06/2005US20050218471 Integrated circuit device
10/06/2005US20050218470 Integrated circuit device
10/06/2005US20050218465 Integrated electronic sensor
10/06/2005US20050218454 Semiconductor device and method for manufacturing same
10/06/2005US20050218451 Semiconductor device incorporating semiconductor constructing body and method of fabricating the same
10/06/2005US20050218426 Power semiconductor module
10/06/2005US20050218401 Device for detecting an attack against an integrated circuit chip
10/06/2005US20050218316 Cooled photodetector
10/06/2005US20050218195 Underfill fluxing curative
10/06/2005US20050218110 Method for manufacturing wiring substrate and method for manufacturing electronic device
10/06/2005US20050217885 Circuit board for connecting an integrated circuit to a support and ic bga package using same
10/06/2005US20050217829 Low-profile thermosyphon-based cooling system for computers and other electronic devices
10/06/2005US20050217826 Integrated circuit heat pipe heat spreader with through mounting holes
10/06/2005US20050217825 Heat dissipating sheet and heat dissipating module made of the heat dissipating sheet
10/06/2005US20050217824 Cooling element for an electronic device
10/06/2005US20050217823 Aluminum bonding member and method for producing same
10/06/2005US20050217787 Tape automated bonding with strip carrier frame assembly
10/06/2005US20050217786 Inserting E-plane probes between green tape openings which is covered with conductive metal layer, screen printing a transmission lines on tape stack, firing to form waveguide resonators
10/06/2005US20050217574 Fixture and method for uniform electroless metal deposition on integrated circuit bond pads
10/06/2005DE4041346B4 Standard-Kunststoffgehäuse mit darin verkapselten Halbleiterchips Standard plastic housing with encapsulated therein semiconductor chips
10/06/2005DE19946753B4 Verfahren zur Erkennung und Vermeidung von ätzkritischen Bereichen Methods for the detection and prevention of ätzkritischen areas
10/06/2005DE19802347B4 Stapelbares Halbleitersubstrat und stapelbare Halbleiterbaugruppe sowie Herstellungsverfahren derselben und Herstellungsverfahren eines stapelbaren Halbleiterbaugruppenmoduls A stackable semiconductor substrate and stackable semiconductor package as well as manufacturing methods thereof, and preparation process of a stackable semiconductor assembly module
10/06/2005DE19651528B4 Chipanordnung und Verfahren zum Herstellen derselben Chip arrangement and method for manufacturing the same
10/06/2005DE19611239B4 Leitfähige Paste Conductive paste
10/06/2005DE10393423T5 Verfahren und Vorrichtung zur flexiblen Fluidzuführung zur Kühlung von gewünschten Hot Spots in einer wärmeerzeugenden Einrichtung Method and apparatus for flexible fluid supply for the cooling of hot spots in a desired heat-generating device
10/06/2005DE10360513B4 Integrated semiconductor circuit chip with DMOS power transistor structure has thick high current heat conductive metal layers between transistor and metal rails on chip surface
10/06/2005DE102005011429A1 Drahtbondverfahren und Halbleiterbauelement Wire bonding method and semiconductor device
10/06/2005DE102005011259A1 Heat sink e.g. for microprocessors and micro-controllers, includes supply element for feeding cooling fluid into deepest point of trough recess
10/06/2005DE102005010156A1 Integrierte Schaltung mit Umlenkungsschicht und Anordnung aus gestapelten Einzelschaltkreisen Integrated circuit with deflection layer and arrangement of stacked single circuits
10/06/2005DE102004060345A1 Halbleitervorrichtung mit geschichteten Chips A semiconductor device with stacked chips
10/06/2005DE102004031878B3 Elektrisches Mehrschichtbauelement mit zuverlässigem Lötkontakt Electrical multilayer component with reliable solder contact
10/06/2005DE102004021365A1 Gehäuse für eine elektronische Schaltung und Verfahren zum Abdichten des Gehäuses Housing for an electronic circuit and method for sealing the housing
10/06/2005DE102004019442A1 Method for manufacturing low power converters, involves applying layer of electrically insulating material to substrate and component
10/06/2005DE102004018469B3 Leistungshalbleiterschaltung Power semiconductor circuit
10/06/2005DE102004013816A1 Verfahren zum Herstellen eines Sensormoduls und Sensormodul A method of manufacturing a sensor module and sensor module
10/06/2005DE102004012737A1 Heat take-off from power semiconductors, at a plastics welding extrusion assembly, has a hollow profile with the semiconductors around it and air drawn through by a fan to be passed to an air heater
10/06/2005DE102004008461A1 Gehäuseanordnung Housing assembly
10/06/2005DE10045696B4 Schaltungsanordnung Circuitry
10/06/2005CA2558862A1 Method and apparatus for venting an electronic control module
10/06/2005CA2558507A1 Wafer scale die handling
10/05/2005EP1583405A2 Circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same
10/05/2005EP1583160A2 Microelectronic assembly with underchip optical window, and method for forming same
10/05/2005EP1583146A2 High density nanostructured interconnection
10/05/2005EP1583142A2 Deposition method and semiconductor device
10/05/2005EP1583108A1 Dielectric composition for forming dielectric layer for use in circuitized substrates
10/05/2005EP1582963A1 Apparatus for detection of attacks on a circuit chip
10/05/2005EP1582892A1 Optical component
10/05/2005EP1582884A1 Semiconductor motor drive circuit with end of life detection
10/05/2005EP1582828A1 Apparatus and method for cooling one or more semiconductor elements and/or laser materials
10/05/2005EP1582546A1 Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
10/05/2005EP1582093A2 Improved patching methods and apparatus for fabricating memory modules
10/05/2005EP1581969A1 Post cmp porogen burn out process
10/05/2005EP1581968A1 Integrated antifuse structure for finfet and cmos devices
10/05/2005EP1581578A1 Composition and method to achieve reduced thermal expansion in polyarylene networks
10/05/2005EP1576320A4 Electroosmotic microchannel cooling system
10/05/2005EP1231633B1 Material of heat-dissipating plate on which semiconductor is mounted, method for fabricating the same, and ceramic package produced by using the same
10/05/2005CN2731721Y Integrated circuit component
10/05/2005CN2731716Y Metal-over-metal assembly and assembly group having multiple-layer metal-over-metal
10/05/2005CN2731714Y Circuit and sensor having static discharging protection
10/05/2005CN2731713Y Semiconductor device and static discharging protection circuit
10/05/2005CN2731712Y Metal inlaid structure
10/05/2005CN2731711Y Copper metal inlaid structure
10/05/2005CN2731710Y Bond pad for flip chip package and semiconductor assembly
10/05/2005CN2731709Y Combined fixed fins group of radiator
10/05/2005CN2731708Y 散热器 Heat sink
10/05/2005CN2731707Y Extension radiation fins array
10/05/2005CN2731706Y 半导体装置 Semiconductor device
10/05/2005CN2730170Y Inner layer structure of clothes with cold/hot control function
10/05/2005CN1679384A Heat sink having folded fin heat exchanger core
10/05/2005CN1679383A Heat sink made from longer and shorter graphite sheets
10/05/2005CN1679171A TFT array substrate, liquid crystal display device, manufacturing methods of TFT array substrate and liquid crystal display device, and electronic device
10/05/2005CN1679163A A packaged semiconductor with coated leads and method therefor
10/05/2005CN1679162A Substrate based unmolded package
10/05/2005CN1678765A Metallic material for electronic part, electronic part, electronic equipment, method of working metallic material, process for producing electronic part and electronic optical part
10/05/2005CN1678529A Anomalous expansion materials
10/05/2005CN1678513A Microchip with thermal stress relief means
10/05/2005CN1678409A Method for edge sealing barrier films
10/05/2005CN1678175A Circuit component module and method of manufacturing the same
10/05/2005CN1678173A Circuit substrate and method for mounting electronic element
10/05/2005CN1678168A Circuit board, electronic device and mfg. method thereof
10/05/2005CN1678165A Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip
10/05/2005CN1677677A Semiconductor device and method of manufacturing the same
10/05/2005CN1677672A 半导体器件 Semiconductor devices
1 ... 1306 1307 1308 1309 1310 1311 1312 1313 1314 1315 1316 1317 1318 1319 1320 1321 1322 1323 1324 1325 1326 ... 2262