Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2005
10/06/2005WO2005038761A3 Heat spreader for display device
10/06/2005WO2005022598A3 Integrated circuit package having inductance loop formed from same-pin-to-same-bonding-pad structure
10/06/2005WO2004105092A3 Esd protection for semiconductor products
10/06/2005US20050222381 Solvent extraction in solid form; corrosion resistance; electronics, electrical engineering
10/06/2005US20050222300 Encapsulating epoxy resin composition, and electronic parts device using the same
10/06/2005US20050221787 Integrated radio frequency circuits
10/06/2005US20050221635 Micro-bumps to enhance lga interconnections
10/06/2005US20050221622 Deposition method and semiconductor device
10/06/2005US20050221611 Wiring structure of a semiconductor integrated circuit and a method of forming the wiring structure
10/06/2005US20050221610 Method and apparatus of stress relief in semiconductor structures
10/06/2005US20050221605 Microelectronic packages including nanocomposite dielectric build-up materials and nanocomposite solder resist
10/06/2005US20050221604 Interconnect structure for an integrated circuit and method of fabrication
10/06/2005US20050221602 Electrodepositing a metal in integrated circuit applications
10/06/2005US20050221601 Semiconductor device and method for manufacturing the same
10/06/2005US20050221600 Method of manufacturing a semiconductor device having damascene structures with air gaps
10/06/2005US20050221599 Etching method, semiconductor and fabricating method for the same
10/06/2005US20050221598 Wafer support and release in wafer processing
10/06/2005US20050221573 Integrated circuit device, method of manufacturing the same and method of forming vanadium oxide film
10/06/2005US20050221572 High tolerance TCR balanced high current resistor for RF CMOS and RF SiGe BiCMOS applications and cadenced based hierarchical parameterized cell design kit with tunable TCR and ESD resistor ballasting feature
10/06/2005US20050221555 Embedded capacitors using conductor filled vias
10/06/2005US20050221554 Back end IC wiring with improved electro-migration resistance
10/06/2005US20050221552 Substrate support for in-situ dry clean chamber for front end of line fabrication
10/06/2005US20050221540 Use of DAR coating to modulate the efficiency of laser fuse blows
10/06/2005US20050221539 Semiconductor device capable of preventing moisture-absorption of fuse area thereof and method for manufacturing the fuse area
10/06/2005US20050221538 Resin encapsulated semiconductor device and the production method
10/06/2005US20050221537 Plastic packaging with high heat dissipation and method for the same
10/06/2005US20050221536 Method of manufacturing radiating plate and semiconductor apparatus using the same
10/06/2005US20050221535 Method for making self-coplanarity bumping shape for flip chip
10/06/2005US20050221534 Stress-relief layer and stress-compensation collar in contact arrays, and processes of making same
10/06/2005US20050221533 Method of making chip package with grease heat sink
10/06/2005US20050221532 Stress-compensation layers in contact arrays, and processes of making same
10/06/2005US20050221531 Carrier substrates and conductive elements thereof
10/06/2005US20050221529 Complex microdevices and apparatus and methods for fabricating such devices
10/06/2005US20050221113 Packagin for dilute hypochlorite
10/06/2005US20050221094 Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
10/06/2005US20050220414 Sheet for optical-semiconductor element encapsulation and process for producing optical semiconductor device using the sheet
10/06/2005US20050219927 Method for stabilizing or offsetting voltage in an integrated circuit
10/06/2005US20050219825 ATCA integrated heatsink and core power distribution mechanism
10/06/2005US20050219824 Retaining device for heat sink
10/06/2005US20050219823 Locking device for heat sink
10/06/2005US20050219822 Circuit cooling
10/06/2005US20050219821 Fan and heat sink arrangement
10/06/2005US20050219817 Control apparatus having fluid passage for cooling purpose
10/06/2005US20050219816 Clearing of vapor lock in a microchannel cooling subsystem
10/06/2005US20050219815 Heat dissipation module
10/06/2005US20050219813 Adjustable heat sink shroud
10/06/2005US20050219800 Switching device for configurable interconnect and method for preparing the same
10/06/2005US20050219796 Integrated ultracapacitor as energy source
10/06/2005US20050219790 Semiconductor component comprising an integrated capacitor structure tha has a plurality of metallization planes
10/06/2005US20050219784 System and method for extracting energy from an ultracapacitor
10/06/2005US20050219782 System and method for ESD protection on high voltage i/o circuits triggered by a diode string
10/06/2005US20050219781 Electronic card with protection against aerial discharge
10/06/2005US20050219780 Electrostatic discharge protection device and method using depletion switch
10/06/2005US20050219778 Semiconductor device
10/06/2005US20050219492 Alignment method, exposure apparatus and device fabrication method
10/06/2005US20050219009 Circuitry module
10/06/2005US20050218965 Semiconductor integrated circuit
10/06/2005US20050218959 Semiconductor integrated circuit device
10/06/2005US20050218917 Semiconductor component with internal heating
10/06/2005US20050218916 Semiconductor device and inspection method
10/06/2005US20050218908 Method to include delta-i noise on chip using lossy transmission line representation for the power mesh
10/06/2005US20050218900 Voltage measuring apparatus
10/06/2005US20050218795 Organic electroluminescence device and manufacturing method thereof
10/06/2005US20050218542 Resin-impregnated flexible graphite articles
10/06/2005US20050218531 Optoelectronic component and method for producing it
10/06/2005US20050218530 Micro device and method for manufacturing the same
10/06/2005US20050218529 Circuit support for a semiconductor chip and component
10/06/2005US20050218528 Capillary underfill channel
10/06/2005US20050218527 Semiconductor device for preventing defective filling of interconnection and cracking of insulating film
10/06/2005US20050218526 Semiconductor device
10/06/2005US20050218524 Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing same
10/06/2005US20050218523 Integrated circuit with metal layer having carbon nanotubes and methods of making same
10/06/2005US20050218520 Semiconductor device and manufacturing method for the same
10/06/2005US20050218519 Semiconductor device and manufacturing method thereof
10/06/2005US20050218518 Semiconductor device assemblies and packages including multiple semiconductor device components
10/06/2005US20050218517 Semiconductor flip-chip package and method for the fabrication thereof
10/06/2005US20050218516 Sacrificial component
10/06/2005US20050218515 Self-coplanarity bumping shape for flip chip
10/06/2005US20050218514 Cavity down semiconductor package
10/06/2005US20050218513 Semiconductor apparatus, manufacturing method thereof, semiconductor module apparatus using semiconductor apparatus, and wire substrate for semiconductor apparatus
10/06/2005US20050218512 Semiconductor device, electrical inspection method thereof, and electronic apparatus including the semiconductor device
10/06/2005US20050218511 Mounting structure of ball grid array
10/06/2005US20050218510 Use of palladium in IC manufacturing with conductive polymer bump
10/06/2005US20050218509 Semiconductor substrate with interconnections and embedded circuit elements
10/06/2005US20050218508 Electronic packaging apparatus and method
10/06/2005US20050218507 Lid assembly for front end of line fabrication
10/06/2005US20050218506 Non-magnetic, hermetically-sealed micro device package
10/06/2005US20050218505 Multi-substrate circuit assembly
10/06/2005US20050218504 Filled cavities semiconductor devices
10/06/2005US20050218503 Multilayer wiring board, method for producing the same, and method for producing fiber reinforced resin board
10/06/2005US20050218502 Capacitor-mounted wiring board and method of manufacturing the same
10/06/2005US20050218501 Semiconductor wafer and manufacturing method therefor
10/06/2005US20050218500 Split-gate power module for suppressing oscillation therein
10/06/2005US20050218499 Method for manufacturing leadless semiconductor packages
10/06/2005US20050218498 Semiconductor device
10/06/2005US20050218497 Through electrode, spacer provided with the through electrode, and method of manufacturing the same
10/06/2005US20050218496 Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same
10/06/2005US20050218495 Microelectronic assembly having encapsulated wire bonding leads
10/06/2005US20050218494 Semiconductor device, a method of manufacturing the same and an electronic device
10/06/2005US20050218493 Coupling spaced bond pads to a contact
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