Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2005
10/12/2005CN1681110A Radiator and radiating fins thereof
10/12/2005CN1681109A Sheet for optical-semiconductor element encapsulation and process for producing optical semiconductor device using the sheet
10/12/2005CN1681108A Electronic circuit device having silicon substrate
10/12/2005CN1681104A Stable metal structure with tungsten plug
10/12/2005CN1681099A Interconnections for flip-chip using lead-free solders and having reaction barrier layers
10/12/2005CN1681097A Manufacture of semiconductor chip installing body and the said installing body
10/12/2005CN1681093A Method for manufacturing a semiconductor device having a W/WN/polysilicon layered film
10/12/2005CN1681089A Semiconductor device and method of manufacturing the same
10/12/2005CN1681081A Semiconductor wafer and its producing method
10/12/2005CN1681079A In-situ dry clean chamber for front end of line fabrication
10/12/2005CN1681078A Semiconductor device, and method and apparatus for manufacturing semiconductor device
10/12/2005CN1681056A Electronic component and manufacturing method of electronic component
10/12/2005CN1680749A Light diode device, radiating system of light diode and illuminator containing it
10/12/2005CN1223250C Multilayer wiring substrate and method for producing the same
10/12/2005CN1223249C Low side surface internet structure
10/12/2005CN1223244C Double-sided wiring board and its mfg. method
10/12/2005CN1223107C Energy conditioning circuit assembly
10/12/2005CN1223097C Thick film millimeter wave transceiver module
10/12/2005CN1223018C Non-rectangular thermoelectric miniature assembly and cooling device for chip using said assembly
10/12/2005CN1223005C MOS device and manufacturing process thereof
10/12/2005CN1222998C Forming anti-fuse structure in silicone on insulator and method thereof
10/12/2005CN1222997C Semiconductor device comprising an arrangement of an electrically programmable non-volatile memory element
10/12/2005CN1222996C Semiconductor device and method for mfg. same
10/12/2005CN1222995C Mixed IC device
10/12/2005CN1222994C Semiconductor device and method of fabricating the same
10/12/2005CN1222993C Packaging device for small semiconductor
10/12/2005CN1222991C Wiring method and element arragning method using the same, and method of producing image display devices
10/12/2005CN1222392C Fluxing under fill compositions
10/11/2005US6954919 Semiconductor integrated circuit capable of facilitating layout modification
10/11/2005US6954706 Method for measuring integrated circuit processor power demand and associated system
10/11/2005US6954360 Thermally enhanced component substrate: thermal bar
10/11/2005US6954359 Cooling device, electronic apparatus, display unit, and method of producing cooling device
10/11/2005US6954274 Method of inspecting semiconductor integrated circuit which can quickly measure a cubic body
10/11/2005US6954130 Integrated passive components and package with posts
10/11/2005US6954098 Power-rail ESD clamp circuit for mixed-voltage I/O buffer
10/11/2005US6954080 Method and apparatus for die testing on wafer
10/11/2005US6954002 System and method of enhancing alignment marks
10/11/2005US6954001 Semiconductor device including a diffusion layer
10/11/2005US6954000 Semiconductor component with redistribution circuit having conductors and test contacts
10/11/2005US6953999 High density chip level package for the packaging of integrated circuits and method to manufacture same
10/11/2005US6953998 Unmolded package for a semiconductor device
10/11/2005US6953997 Semiconductor device with improved bonding pad connection and placement
10/11/2005US6953996 Low-loss coplanar waveguides and method of fabrication
10/11/2005US6953995 Hermetic chip in wafer form
10/11/2005US6953993 Acceleration sensor and method of manufacturing acceleration sensor
10/11/2005US6953992 Electronic component with at least one semiconductor chip and method for its manufacture
10/11/2005US6953991 Semiconductor device
10/11/2005US6953990 Wafer-level packaging of optoelectronic devices
10/11/2005US6953989 Film carrier tape for mounting electronic devices thereon and final defect marking method using the same
10/11/2005US6953988 Semiconductor package
10/11/2005US6953987 Composite integrated circuit device having restricted heat conduction
10/11/2005US6953986 Leadframes for high adhesion semiconductor devices and method of fabrication
10/11/2005US6953985 Wafer level MEMS packaging
10/11/2005US6953984 Hydrogenated oxidized silicon carbon material
10/11/2005US6953981 Semiconductor device with deep substrates contacts
10/11/2005US6953956 Semiconductor device having borderless logic array and flexible I/O
10/11/2005US6953948 Semiconductor substrate and process for its production
10/11/2005US6953893 Circuit board for connecting an integrated circuit to a support and IC BGA package using same
10/11/2005US6953892 Connection housing for an electronic component
10/11/2005US6953891 Moisture-resistant electronic device package and methods of assembly
10/11/2005US6953761 produced under high pressure with a sintering aid of Nd, Sm, Eu, Gd, Er, Pr, Dy, Yb, oxides or nitrides; surface smoothness after mirror polishing; laser diodes
10/11/2005US6953756 Glass ceramic sintered body and wiring board using the sintered body
10/11/2005US6953748 Method of manufacturing semiconductor device
10/11/2005US6953745 Void-free metal interconnection structure and method of forming the same
10/11/2005US6953744 Methods of fabricating integrated circuit devices providing improved short prevention
10/11/2005US6953733 Method of manufacturing alignment mark and aligning method using the same
10/11/2005US6953712 Circuit device manufacturing method
10/11/2005US6953711 Flip chip on lead frame
10/11/2005US6953710 Method for packaging a semiconductor device
10/11/2005US6953709 Semiconductor device and its manufacturing method
10/11/2005US6953708 Method of producing a semiconductor component having a compliant buffer layer
10/11/2005US6953707 Method and system for chip-to-package interconnection
10/11/2005US6953706 Method of providing a semiconductor package having an internal heat-activated hydrogen source
10/11/2005US6953600 Complex of an amine compound and aluminum hydride and an organic solvent used to form wiring or an electrode which can be suitably used in a variety of electronic devices
10/11/2005US6953539 Silicon carbide impregnated with copper alloy
10/11/2005US6953360 Reduced contact resistance electrical connector
10/11/2005US6953349 Multilayer circuit board for high frequency signals
10/11/2005US6953227 High-power multi-device liquid cooling
10/06/2005WO2005094150A1 Method and arrangement for cooling a substrate, especially a semiconductor
10/06/2005WO2005094144A1 Circuit device and method for manufacturing same
10/06/2005WO2005094087A1 Video processor alignment clamping spring
10/06/2005WO2005093834A1 Chip stacking semiconductor device
10/06/2005WO2005093833A1 Overmolded semiconductor package with an integrated emi and rfi shield
10/06/2005WO2005093832A1 Method for producing an integrated circuit assembly with an auxiliary indentation, particularly with aligning marks, and an integrated circuit arrangement
10/06/2005WO2005093831A1 Nanostructures containing metal-semiconductor compounds
10/06/2005WO2005093830A1 Heat exchanger
10/06/2005WO2005093829A1 Semiconductor package having an interfacial adhesive layer
10/06/2005WO2005093828A1 High frequency package, transmitting and receiving module and wireless equipment
10/06/2005WO2005093827A1 Through wiring board and method for producing the same
10/06/2005WO2005093826A1 Device and method for joining substrates
10/06/2005WO2005093816A1 Semiconductor device for radio frequency applications and method for making the same
10/06/2005WO2005093789A1 Method of producing an element comprising an electrical conductor encircled by magnetic material
10/06/2005WO2005092070A2 Vertically stacked semiconductor device
10/06/2005WO2005091968A2 Compact radiator for an electronic device
10/06/2005WO2005091868A2 Wafer scale die handling
10/06/2005WO2005091760A2 Semiconductor package with crossing conductor assembly and method of manufacture
10/06/2005WO2005074026A3 Tin-based coating of electronic component
10/06/2005WO2005051065A3 Pumped liquid cooling for computer systems using liquid metal coolant
10/06/2005WO2005048664A3 High temperature circuits
10/06/2005WO2005041265A3 Paste for forming an interconnect and interconnect formed from the paste
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