Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2005
10/13/2005US20050224909 Power semiconductor switching-device and semiconductor power module using the device
10/13/2005US20050224908 Integrated circuit with intergrated capacitor and methods for making same
10/13/2005US20050224883 Circuit design for increasing charge device model immunity
10/13/2005US20050224882 Low trigger voltage esd nmosfet triple-well cmos devices
10/13/2005US20050224855 Via recess in underlying conductive line
10/13/2005US20050224851 Semiconductor device and method for manufacturing thereof
10/13/2005US20050224849 Metal heater for in situ heating and crystallization of ferroelectric polymer memory film
10/13/2005US20050224836 Silicon controlled rectifier
10/13/2005US20050224822 Light-emitting diode array having an adhesive layer
10/13/2005US20050224795 Display device
10/13/2005US20050224792 Novel test structure for speeding a stress-induced voiding test and method of using same
10/13/2005US20050224791 Semiconductor package security features using thermochromatic inks and three-dimensional identification coding
10/13/2005US20050224767 dielectric compositions for forming dielectric layers that can be used as circuitized substrates and particularly those used in multilayered circuit boards, chip carriers, and the like; comprising: a cured epoxy resin material; and a particulate filler
10/13/2005US20050224586 Circuits associated with fusible elements for establishing and detecting of the states of those elements
10/13/2005US20050224561 Method of manufacturing electronic component mounting body, electronic component mounting body, and electro-optical device
10/13/2005US20050224457 Method and apparatus for repairing shape, and method for manufacturing semiconductor device using those
10/13/2005US20050224453 Method for selectively covering a micro machined surface
10/13/2005US20050224256 Interlayer member used for producing multilayer wiring board and method of producing the same
10/13/2005US20050224252 Component mounting substrate and structure
10/13/2005US20050224251 Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same
10/13/2005US20050224248 Current sensor
10/13/2005US20050224220 Nanoengineered thermal materials based on carbon nanotube array composites
10/13/2005US20050224218 Heat dissipating assembly
10/13/2005US20050224217 Multiple evaporator heat pipe assisted heat sink
10/13/2005US20050224215 End surface structure of a heat pipe for contact with a heat source
10/13/2005US20050224212 Diffusion bonded wire mesh heat sink
10/13/2005US20050224167 Material separation to form segmented product
10/13/2005US20050223552 Bonding an interconnect to a circuit device and related devices
10/13/2005US20050223550 Method for making a non-detachable microcircuit card
10/13/2005DE19649409B4 Verfahren zum Herstellen eines Diamantfilms auf einem Substrat A method for producing a diamond film on a substrate
10/13/2005DE19526010B4 Elektronisches Bauelement Electronic component
10/13/2005DE10345524B4 Verfahren zur Bestimmung eines relativen Versatzes zweier strukturierter Schaltungsmuster auf einem Halbleiterwafer mittels eines Rasterelektronenmikroskops Method for determining a relative displacement of two structured circuit pattern on a semiconductor wafer by means of a scanning electron microscope
10/13/2005DE10344273B4 Verbesserter Kontakt für Speicherzellen Improved contact for memory cells
10/13/2005DE10341544B4 Verfahren zum Herstellen einer Leiterbahnanordnung und Leiterbahnanordnung A method for producing a conductive strip array and interconnect arrangement
10/13/2005DE102005014118A1 Packing for semiconductors has an integrated switching circuit chip with top and bottom sides and a conductor framework in direct contact with a surface on the top/bottom side
10/13/2005DE102005011807A1 Verfahren und Anordnung zur Kühlung eines Substrats, insbesondere eines Halbleiters Method and arrangement for cooling a substrate, particularly a semiconductor,
10/13/2005DE102004054358A1 Verfahren zum Korrigieren eines Lithographieprozesses und Verfahren zur Herstellung einer Überlagerungsmarkierung A method for correcting a lithography process and a superposition process for producing marking
10/13/2005DE102004047033A1 Substrat Substratum
10/13/2005DE102004037011A1 LCD device for e.g. wall-mountable television, has two resistance compensation structures with recess or hole in gate and data link lines and gate and data lines, to compensate resistance value of gate and data link lines
10/13/2005DE102004014925A1 Elektronische Schaltkreisanordnung Electronic circuitry
10/13/2005DE102004014644A1 Integrierter Schaltkreis Integrated circuit
10/13/2005DE102004014537A1 Chipintegrierter Detektor zum Analysieren von Flüssigkeiten Chip integrated detector for analyzing fluids
10/13/2005DE102004014496A1 Heat removal device for computer processors has curved cooling surfaces for heat sink
10/13/2005DE102004012979A1 Kopplungssubstrat für Halbleiterbauteile und Verfahren zur Herstellung desselben Coupling of the same substrate for semiconductor devices and methods for making
10/13/2005DE102004007690B3 Integrierte Schaltungsanordnung An integrated circuit device
10/13/2005DE10056869B4 Halbleiterbauteil mit einer strahlungsabsorbierenden leitenden Schutzschicht und Verfahren zur Herstellung derselben A semiconductor device comprising a radiation-conducting protective layer and method of manufacturing the same
10/13/2005DE10029269B4 Verfahren zur Herstellung eines elektronischen Bauteiles aus gehäusebildenden Substraten A process for producing an electronic component from housing forming substrates
10/13/2005DE10017746B4 Verfahren zur Herstellung eines elektronischen Bauteils mit mikroskopisch kleinen Kontaktflächen A method of manufacturing an electronic component with microscopically small contact surfaces
10/12/2005EP1585371A2 Organic electroluminescence device and manufacturing method thereof
10/12/2005EP1585179A1 Sheet for optical-semiconductor element encapsulation and process for producing optical semiconductor device using the sheet
10/12/2005EP1585174A1 Circuit device and manufacturing method of the same
10/12/2005EP1585173A2 Aluminium bonding member and method for producing same
10/12/2005EP1585172A1 Magnetic memory device
10/12/2005EP1584703A1 Mask, method of manufacturing the same, method of forming thin film pattern, method of manufacturing electro-optical device and electronic equipment
10/12/2005EP1584639A1 Curable resin composition and products of curing thereof
10/12/2005EP1584115A2 Semiconducting island as active layer in fet
10/12/2005EP1584109A2 Device and method for encapsulating with encapsulating material and electronic component fixed on a carrier
10/12/2005EP1584103A2 Two-stage etching process for producing an integrated circuit arrangement, in particular comprising a capacitor assembly, in addition to an integrated circuit arrangement
10/12/2005EP1584101A2 Semiconductor package having non-ceramic based window frame
10/12/2005EP1583858A2 Sacrificial template method of fabricating a nanotube
10/12/2005EP1583788A1 Phosphorus-modified epoxy resin
10/12/2005EP1356477A4 Compliant and crosslinkable thermal interface materials
10/12/2005EP1133796B1 Two-dimensional support for semiconductor chips, and a method for producing such a two-dimensional support
10/12/2005EP0922301B1 Substrate with conductor formed of low-resistance aluminum alloy
10/12/2005CN2733596Y 半导体结构 Semiconductor structure
10/12/2005CN2733595Y Lead-frame and semiconductor device using the same
10/12/2005CN2733594Y Terminal structure of rectifying chip
10/12/2005CN2733593Y Electric interference isolated transistor structure
10/12/2005CN2733592Y Column shaped heat pipe
10/12/2005CN2733591Y Locking device of radiating module
10/12/2005CN2733590Y Heat sink with flow conducting hood
10/12/2005CN2733589Y Heat radiating fin set
10/12/2005CN2733588Y Ultra-thin footless packaging structure for integrated circuit or discrete component
10/12/2005CN2733525Y An electric conductor and chip using the same
10/12/2005CN2733298Y Improved structure of radiator fins
10/12/2005CN1682447A Coding of information in integrated circuits
10/12/2005CN1682379A Semiconductor device exhibiting enhanced pattern recognition when illuminated
10/12/2005CN1682370A Integrated circuit arrangement comprising intermediate material and assembly
10/12/2005CN1682367A Manufacture of semiconductor device
10/12/2005CN1682366A Method of preventing shift of alignment marks during rapid thermal processing
10/12/2005CN1682363A Wafer coating and singulation method
10/12/2005CN1682359A Semiconductor device and method for manufacturing the same
10/12/2005CN1682358A Semiconductor device with virtual patterns
10/12/2005CN1681648A Thermal interconnect and interface systems, methods of production and uses thereof
10/12/2005CN1681381A Thermal-interface material and production thereof
10/12/2005CN1681377A Method of manufacturing electronic component mounting body, electronic component mounting body, and electro-optical device
10/12/2005CN1681374A Three-dimensional mounting structure and method for producing the same
10/12/2005CN1681192A Method of switching a power supply of voltage domains of a semiconductor circuit, and corresponding semiconductor circuit
10/12/2005CN1681123A 集成电路 IC
10/12/2005CN1681122A High-voltage electrostatic discharging protector with gap structure
10/12/2005CN1681120A System and method for ESD protection on high voltage i/o circuits triggered by a diode string
10/12/2005CN1681119A IC device and production thereof
10/12/2005CN1681118A Semiconductor apparatus and method of fabricating the same
10/12/2005CN1681117A Semiconductor element and wafer level chip size package therefor
10/12/2005CN1681116A 半导体装置 Semiconductor device
10/12/2005CN1681115A Radiator of electronic device
10/12/2005CN1681114A Radiating mould set
10/12/2005CN1681113A Hot-piping radiator
10/12/2005CN1681112A Hot-piping radiator
10/12/2005CN1681111A Radiator and production thereof
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