Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2005
10/13/2005US20050227414 Packaging method for integrated circuits
10/13/2005US20050227413 Method for depositing a solder material on a substrate
10/13/2005US20050227412 Flexible multi-chip module and method of making the same
10/13/2005US20050227411 Methods for fabricating electronic components to include supports for conductive structures
10/13/2005US20050227410 Manufacture of microelectronic fold packages
10/13/2005US20050227409 Microelectronics package assembly tool and method of manufacture therewith
10/13/2005US20050227408 Method for forming housings for electronic components and electronic components that are hermetically encapsulated thereby
10/13/2005US20050227384 Method for manufacturing semiconductor device
10/13/2005US20050227381 Using cell voltage as a monitor for deposition coverage
10/13/2005US20050227114 An aluminoxane and UV curable acrylic monomer such as trimethylolpropane triacrylate; humidity resistance for thin profile OLEDs that ensures reliability and suitable for mass production
10/13/2005US20050227084 Resin-impregnated flexible graphite articles
10/13/2005US20050227079 Manufacture of porous diamond films
10/13/2005US20050226745 Pump, cooling apparatus, electrical appliance and personal computer combined with the pump
10/13/2005US20050226309 Arrangement for determining a temperature loading of an integrated circuit and method
10/13/2005US20050226030 Magnetic memory device
10/13/2005US20050225957 Connnecting device for contacting a semiconductor component
10/13/2005US20050225956 Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus
10/13/2005US20050225946 Locking device for heat sink
10/13/2005US20050225945 Universal mountable heat sink with integral spring clip
10/13/2005US20050225944 Secure device of radiation module
10/13/2005US20050225943 Heat dissipation module
10/13/2005US20050225941 Centrifugal fan type cooling module
10/13/2005US20050225939 Heat Sink Fan
10/13/2005US20050225938 Cold plate
10/13/2005US20050225929 Electrode for electric double layer capacitor
10/13/2005US20050225917 Integrated semiconductor circuit and method for testing the same
10/13/2005US20050225911 Capacitor design in ESD circuits for eliminating current leakage
10/13/2005US20050225420 Deep submicron CMOS compatible suspending inductor
10/13/2005US20050225406 Temperature-compensated quartz-crystal oscillator
10/13/2005US20050225378 Bandgap reference circuit
10/13/2005US20050225348 Integrated circuit and associated packaged integrated circuit
10/13/2005US20050225340 Conductive material for integrated circuit fabrication
10/13/2005US20050225333 Method and system for non-contact measurement of microwave capacitance of miniature structures of integrated circuits
10/13/2005US20050224993 Adhesive of folded package
10/13/2005US20050224992 Method and apparatus to eliminate galvanic corrosion on copper doped aluminum bond pads on integrated circuits
10/13/2005US20050224991 Bump for semiconductor package, semiconductor package applying the bump, and method for fabricating the semiconductor package
10/13/2005US20050224990 High reflectivity p-contacts for group III-nitride light emitting diodes
10/13/2005US20050224989 Passive within via
10/13/2005US20050224988 Method for embedding a component in a base
10/13/2005US20050224987 Structure and method for contact pads having double overcoat-protected bondable metal plugs over copper-metallized integrated circuits
10/13/2005US20050224986 Stable metal structure with tungsten plug
10/13/2005US20050224985 Circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same
10/13/2005US20050224984 Structure and method for contact pads having a protected bondable metal plug over copper-metallized integrated circuits
10/13/2005US20050224979 Cu interconnects with composite barrier layers for wafer-to-wafer uniformity
10/13/2005US20050224978 Heat curable adhesive composition, article, semiconductor apparatus and method
10/13/2005US20050224975 High density nanostructured interconnection
10/13/2005US20050224973 Extension of fatigue life for C4 solder ball to chip connection
10/13/2005US20050224972 Circuit device and method of manufacturing the circuit device
10/13/2005US20050224971 Circuit board, device mounting structure, device mounting method, and electronic apparatus
10/13/2005US20050224970 Semiconductor device and method of producing the semiconductor device
10/13/2005US20050224969 Chip package structure and process for fabricating the same
10/13/2005US20050224968 Wafer level mounting frame for ball grid array packaging, and method of making and using the same
10/13/2005US20050224967 Microelectronic assembly with underchip optical window, and method for forming same
10/13/2005US20050224966 Interconnections for flip-chip using lead-free solders and having reaction barrier layers
10/13/2005US20050224964 Integrated circuit package and method having wire-bonded intra-die electrical connections
10/13/2005US20050224963 Voltage contrast monitor for integrated circuit defects
10/13/2005US20050224962 Manufacturing method for semiconductor integrated circuit, semiconductor integrated circuit, and semiconductor integrated circuit apparatus
10/13/2005US20050224961 Electronic package with optimized lamination process
10/13/2005US20050224960 Surface mounted package with die bottom spaced from support board
10/13/2005US20050224959 Die with discrete spacers and die spacing method
10/13/2005US20050224957 Semiconductor package with heat dissipating structure and method of manufacturing the same
10/13/2005US20050224956 Chip package structure and chip packaging process
10/13/2005US20050224955 Method and apparatus for establishing improved thermal communication between a die and a heatspreader in a semiconductor package
10/13/2005US20050224954 Thermal dissipation in integrated circuit systems
10/13/2005US20050224953 Heat spreader lid cavity filled with cured molding compound
10/13/2005US20050224952 Three dimensional six surface conformal die coating
10/13/2005US20050224951 Jet-dispensed stress relief layer in contact arrays, and processes of making same
10/13/2005US20050224950 Integrated circuit adapted for ECO and FIB debug
10/13/2005US20050224949 Semiconductor device and method of fabricating the same
10/13/2005US20050224948 Semiconductor device package having buffered memory module and method thereof
10/13/2005US20050224947 Three-dimensional multichip stack electronic package structure
10/13/2005US20050224946 Stackable optoelectronics chip-to-chip interconnects and method of manufacturing
10/13/2005US20050224945 Power semiconductor device package
10/13/2005US20050224944 Stacked semiconductor device
10/13/2005US20050224943 Semiconducting device with stacked dice
10/13/2005US20050224942 Semiconductor device with a plurality of ground planes
10/13/2005US20050224940 Method for maintaining solder thickness in flipchip attach packaging processes
10/13/2005US20050224939 Semiconductor device and method for manufacturing same
10/13/2005US20050224938 Electronic package having a sealing structure on predetermined area, and the method thereof
10/13/2005US20050224937 Exposed pad module integrated a passive device therein
10/13/2005US20050224936 Chip package structure
10/13/2005US20050224934 Circuit device
10/13/2005US20050224933 Thermally enhanced component interposer: finger and net structures
10/13/2005US20050224932 Electrically conductive wire
10/13/2005US20050224931 Method of producing electronic circuit and electronic circuit
10/13/2005US20050224930 System for reducing or eliminating semiconductor device wire sweep
10/13/2005US20050224929 Semiconductor package having a high-speed signal input/output terminal
10/13/2005US20050224928 Multi-part lead frame with dissimilar materials
10/13/2005US20050224927 Chip fixed structure
10/13/2005US20050224926 Integrated circuit device having flexible leadframe
10/13/2005US20050224925 Lead frame having a tilt flap for locking molding compound and semiconductor device having the same
10/13/2005US20050224924 Leadless semiconductor package and manufacturing method thereof
10/13/2005US20050224923 Methods of eliminating pattern collapse on photoresist patterns
10/13/2005US20050224922 Polymer dielectrics for memory element array interconnect
10/13/2005US20050224921 Method for bonding wafers to produce stacked integrated circuits
10/13/2005US20050224919 Spacer die structure and method for attaching
10/13/2005US20050224918 Lead frame, method of manufacturing the same, semiconductor device using lead frame and method of manufacturing semiconductor device
10/13/2005US20050224914 Semiconductor integrated circuit device, method of enerating pattern thereof, method of manufacturing the same, and pattern generating apparatus for the same
10/13/2005US20050224912 Circuit and method for enhanced low frequency switching noise suppression in multilayer printed circuit boards using a chip capacitor lattice
10/13/2005US20050224910 Semiconductor integrated circuit having polysilicon fuse, method of forming the same, and method of adjusting circuit parameter thereof
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