Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2005
10/19/2005CN1224062C Planar inductive component and planar transformer
10/19/2005CN1223999C Magneto resistance sensor and its making process
10/19/2005CN1223920C Electronic instrument installed with liquid-cooling cooling apparatus for cooling heating parts
10/19/2005CN1223919C Radiating device of chip radiation using liquid metal gallium or its alloy as flow working medium
10/19/2005CN1223900C Photo-sensitive conducting resin, conductor pattern forming method and manufacturing method of ceramic laminated structural parts
10/19/2005CN1223622C Solidifying agent composition for epoxy resin, epoxy resin composition and use
10/19/2005CN1223539C Glass and conductive tube using this glass
10/18/2005US6956783 Semiconductor memory device including fuse element
10/18/2005US6956747 Semiconductor device
10/18/2005US6956743 Electronic component, in particular regulator for generators in motor vehicles
10/18/2005US6956742 Compact liquid converter assembly
10/18/2005US6956741 Semiconductor package with heat sink
10/18/2005US6956740 Heat sink with fins and manufacturing method thereof
10/18/2005US6956739 High temperature stable thermal interface material
10/18/2005US6956297 Electronic circuit unit that is easy to manufacture and method of manufacturing the same
10/18/2005US6956296 Transfer molding of integrated circuit packages
10/18/2005US6956295 Flip-chip image sensor packages
10/18/2005US6956294 Apparatus for routing die interconnections using intermediate connection elements secured to the die face
10/18/2005US6956293 Semiconductor device
10/18/2005US6956291 Apparatus and method for forming solder seals for semiconductor flip chip packages
10/18/2005US6956290 Flip-chip BGA semiconductor device for achieving a superior cleaning effect
10/18/2005US6956289 Semiconductor device
10/18/2005US6956288 Semiconductor device with folded film substrate and display device using the same
10/18/2005US6956287 Electronic component with flexible bonding pads and method of producing such a component
10/18/2005US6956286 Integrated circuit package with overlapping bond fingers
10/18/2005US6956285 EMI grounding pins for CPU/ASIC chips
10/18/2005US6956284 Integrated circuit stacking system and method
10/18/2005US6956283 Encapsulants for protecting MEMS devices during post-packaging release etch
10/18/2005US6956282 Stabilizer/spacer for semiconductor device
10/18/2005US6956281 Semiconductor device for reducing photovolatic current
10/18/2005US6956278 Low-density, high-resistivity titanium nitride layer for use as a contact for low-leakage dielectric layers
10/18/2005US6956277 Diode junction poly fuse
10/18/2005US6956272 Support frame for semiconductor packages
10/18/2005US6956255 Semiconductor device and drive circuit using the semiconductor devices
10/18/2005US6956252 Hybrid integrated circuit device
10/18/2005US6956250 Gallium nitride materials including thermally conductive regions
10/18/2005US6956174 Tip structures
10/18/2005US6956167 Lid-holding frame used in production of hollow-package type electronic products, and sealing-process using such lid-holding frame
10/18/2005US6956165 for electronics with multiple areas of stiffness/coefficient of thermal expansion; comprises epoxy resin and curing substance (vaporized hydrofluoric acid)
10/18/2005US6956100 A curable blends comprising a cycloalkanone solvent, is easily desolventized during film formation, also epoxy resins; good workability, used in spin coating, screen printing, adhesive layer on printed circuits
10/18/2005US6955986 Atomic layer deposition methods for forming a multi-layer adhesion-barrier layer for integrated circuits
10/18/2005US6955982 Flip chip C4 extension structure and process
10/18/2005US6955981 Pad structure to prompt excellent bondability for low-k intermetal dielectric layers
10/18/2005US6955980 Reducing the migration of grain boundaries
10/18/2005US6955949 System and method for reducing or eliminating semiconductor device wire sweep
10/18/2005US6955948 Method of manufacturing a component built-in module
10/18/2005US6955947 Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devices
10/18/2005US6955945 Memory expansion and chip scale stacking system and method
10/18/2005US6955944 Fabrication method for a semiconductor CSP type package
10/18/2005US6955942 Method for manufacturing circuit device
10/18/2005US6955941 Methods and apparatus for packaging semiconductor devices
10/18/2005US6955936 Methods and devices related to electrode pads for p-type Group III nitride compound semiconductors
10/18/2005US6955934 Wafer-level packaging of optical receivers
10/18/2005US6955932 Single and double-gate pseudo-FET devices for semiconductor materials evaluation
10/18/2005US6955929 Method of measuring a gate channel length of a metal-oxide semiconductor transistor
10/18/2005US6955285 Apparatus for aligning and dispensing solder columns in an array
10/18/2005US6955214 Radiator with seamless heat conductor
10/18/2005US6955212 Water-cooler radiator module
10/18/2005US6955062 Spray cooling system for transverse thin-film evaporative spray cooling
10/18/2005US6954986 Method for fabricating electrical connecting element
10/18/2005CA2323507C Microwave module
10/13/2005WO2005096379A2 System and method for coupling internal circuitry of an integrated circuit to the integrated circuit's package pins
10/13/2005WO2005096378A1 Electronic switching circuit arrangement
10/13/2005WO2005096377A1 A heat exchanger
10/13/2005WO2005096376A1 Heat sink manufacturing method
10/13/2005WO2005096375A2 Use of nanoscale particles for creating scratch-resistant protective layers on semiconductor chips
10/13/2005WO2005096374A1 Electronic product comprising an electrical component and a cast mass for electrical insulation of the component and method for production of the product
10/13/2005WO2005096373A1 Electronic component encapsulating body manufacturing method and electronic component encapsulating body
10/13/2005WO2005096370A1 A semiconductor apparatus
10/13/2005WO2005096367A1 Heater, reflow apparatus, and solder bump forming method and apparatus
10/13/2005WO2005096364A1 Semiconductor device and method for manufacturing same
10/13/2005WO2005096350A2 Electromagnetic bandgap structure for suppressing electromagnetic coupling in microstrip and flip chip on board applications
10/13/2005WO2005096320A2 Thermally conductive compositions and methods of making thereof
10/13/2005WO2005096242A2 Apparatus and method of power control
10/13/2005WO2005095936A1 An integrated electronic sensor
10/13/2005WO2005095802A1 Arrangement with an electronically commutated external rotor motor
10/13/2005WO2005094515A2 Structure and method for contact pads having an overcoat-protected bondable metal plug over copper-metallized integrated circuits
10/13/2005WO2005094438A2 Complete mold system
10/13/2005WO2005094244A2 System, method and apparatus for self-cleaning dry etch
10/13/2005WO2005065255A3 Semiconductor chip package
10/13/2005WO2005059995A3 Semiconductor package with integrated heatsink and electromagnetic shield
10/13/2005WO2005048316A3 Teardrop shaped lead frames
10/13/2005WO2005041294A3 Integrated circuit packaging
10/13/2005WO2005018291A3 Thermally enhanced electronic module with self-aligning heat sink
10/13/2005WO2005002295A3 Circuit and method for suppression of electromagnetic coupling and switching noise in multilayer printed circuits boards
10/13/2005US20050229138 Automatic wiring method and apparatus for semiconductor package and automatic identifying method and apparatus for semiconductor package
10/13/2005US20050228606 Method in an integrated circuit (IC) manufacturing process for identifying and redirecting ICs mis-processed during their manufacture
10/13/2005US20050228166 Anomalous expansion materials
10/13/2005US20050228148 Phosphorus- containing epoxy resin, phosphorus- containing epoxy resin composition, process for producing the resin, sealant containing the composition, molding material containing the composition, and laminate containing the composition
10/13/2005US20050228097 Thermally conductive compositions and methods of making thereof
10/13/2005US20050227726 Roller construction with a sense of feel for a mobile navigation device
10/13/2005US20050227507 Low loss interconnect structure for use in microelectronic circuits
10/13/2005US20050227484 System for modifying small structures
10/13/2005US20050227480 Low dielectric semiconductor device and process for fabricating the same
10/13/2005US20050227476 Method for fabricating a semiconductor device
10/13/2005US20050227474 Method of connecting base materials
10/13/2005US20050227470 Method for manufacturing a semiconductor device having a W/WN/polysilicon layered film
10/13/2005US20050227467 Semiconductor device and method of manufacture thereof
10/13/2005US20050227416 Electronic device and method of manufacture the same
10/13/2005US20050227415 Method for fabricating encapsulated semiconductor components
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