Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2005
10/20/2005US20050230728 Semiconductor device and method of manufacturing the same
10/20/2005US20050230716 Semiconductor integrated circuit equipment and its manufacture method
10/20/2005US20050230712 Semiconductor device and method of manufacturing the same
10/20/2005US20050230711 [circuit connecting structure and fabricating method thereof]
10/20/2005US20050230700 Flip chip light emitting diode with micromesas and a conductive mesh
10/20/2005US20050230698 Semiconductor light emitting apparatus and its manufacturing method
10/20/2005US20050230482 Module for a data carrier with improved bump counterparts
10/20/2005US20050230365 Methods of drilling through-holes in homogenous and non-homogeneous substrates
10/20/2005US20050230350 In-situ dry clean chamber for front end of line fabrication
10/20/2005US20050230146 Multilayer printed board, electronic apparatus, and packaging method
10/20/2005US20050230086 Water-cooling heat dissipation system
10/20/2005US20050230083 Water-cooler radiator module
10/20/2005US20050230082 Thermal interface material and method for manufacturing same
10/20/2005US20050230081 Heat dissipation device and manufacturing method thereof
10/20/2005US20050230042 Bonding structure and method for bonding members
10/20/2005US20050230035 Thin film forming apparatus and thin film forming method
10/20/2005US20050230030 Thermal dissipating capacitor and electrical component comprising same
10/20/2005US20050230005 Test pad for reducing die sawing damage
10/20/2005US20050229393 Methods of forming a contact pin assembly
10/20/2005US20050229389 Heat sink fins processing installation
10/20/2005US20050229385 Embedded toroidal inductors
10/20/2005DE10393851T5 Halbleiterelement-Wärmeableitungselement, Halbleitervorrichtung, in der dieses eingesetzt wird, und Verfahren zu dessen Herstellung Semiconductor element heat dissipating element, the semiconductor device in which this is used, and process for its preparation
10/20/2005DE10393793T5 Strahlungsschutz in integrierten Schaltungen Radiation protection in integrated circuits
10/20/2005DE10393768T5 Kupferflockenpulver, Verfahren zur Herstellung des Kupferflockenpulvers und eine das Kupferflockenpulver verwendende leitfähige Paste Copper flake powder, process for producing the copper flake powder and copper flake powder used conductive paste
10/20/2005DE10297823T5 Verfahren zum Kapseln intergrierter Schaltungen und über das Verfahren hergestellte integrierte Schaltungsbausteine Method for encapsulating intergrated circuits and integrated circuit chips produced on the procedure
10/20/2005CA2563240A1 Tamper respondent covering
10/19/2005EP1587350A1 Method for metallizing an electric component on a flexible circuit support and flexible circuit support with an electric component metallized thereon
10/19/2005EP1587144A1 Test structure for an electronic device and corresponding test method
10/19/2005EP1587143A1 Resin sealed semiconductor integrated circuit
10/19/2005EP1587142A1 Electronic component, mounted structure, electro-optical device, and electronic device
10/19/2005EP1587141A2 Method and apparatus involving capacitively coupled communication within a stack of laminated chips
10/19/2005EP1587140A2 Electronic device which accommodates an electronic circuit provided with a gel layer and method for producing said device
10/19/2005EP1587135A1 Helical inductor
10/19/2005EP1586886A2 Calibration standard for electron microscope, and method for its manufacture
10/19/2005EP1586615A1 Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same
10/19/2005EP1586117A1 Method for producing microsystems
10/19/2005EP1586110A2 Feedthrough design and method for a hermetically sealed microdevice
10/19/2005EP1149433B1 Electrical contact element and use of the contact element
10/19/2005CN2735548Y Large-power LED radiating structure
10/19/2005CN2735547Y Electric crystal capable of stably erecting wafer
10/19/2005CN2735546Y Radiating module
10/19/2005CN2735545Y Fastener for column type heat pipe radiator
10/19/2005CN2735544Y Cone-shaped vacuum heat pipe
10/19/2005CN2735543Y Radiating module
10/19/2005CN2735542Y Radiator
10/19/2005CN2735541Y Radiator
10/19/2005CN2735540Y Central wind concentration type wind guidance cover for radiating fan
10/19/2005CN2735377Y Flip chip structure
10/19/2005CN2735286Y Rdiating fin set and heat pipe composite structure
10/19/2005CN1685777A Thermally enhanced package for an integrated circuit
10/19/2005CN1685776A High-frequency layered part and manufacturing method thereof
10/19/2005CN1685607A 高频功率放大器模块 High-frequency power amplifier module
10/19/2005CN1685578A Light emitting device
10/19/2005CN1685568A Anisotropic conductive sheet, its manufacturing method and its application
10/19/2005CN1685515A Semiconductor integrated device and method for manufacturing same
10/19/2005CN1685509A Electronic package with back side cavity mounted capacitors and method of fabrication therefor
10/19/2005CN1685507A Method for producing a component comprising a conductor structure that is suitable for use at high frequencies
10/19/2005CN1685506A A power/ground configuration for low impedance integrated circuit
10/19/2005CN1685505A Crack resistant interconnect module
10/19/2005CN1685504A Semiconductor die package including drain clip
10/19/2005CN1685503A Method of machining terminal board
10/19/2005CN1685502A High frequency signal transmission structure
10/19/2005CN1685500A Integrated circuit package including sealed gaps and prevention of vapor induced failures and method of manufacturing the same
10/19/2005CN1685499A Press pack power semiconductor module
10/19/2005CN1685498A Thermal enhanced package for block mold assembly
10/19/2005CN1685487A Methods to planarize semiconductor device and passivation layer
10/19/2005CN1685450A Current-carrying electronic component and method of manufacturing same
10/19/2005CN1684575A Capacitor-embedded substrate
10/19/2005CN1684320A IC socket
10/19/2005CN1684257A 半导体装置 Semiconductor device
10/19/2005CN1684256A Silicon chip carrier with conductive through-VIAS and method for fabricating same
10/19/2005CN1684255A Semiconductor device and method for manufacturing the same
10/19/2005CN1684254A Diffusion and laser photoelectric coupling integrated circuit signal line
10/19/2005CN1684253A Bump structure for a semiconductor device and method of manufacture
10/19/2005CN1684252A Circulation flowing pulsating heat pipe for cooling electronic device
10/19/2005CN1684251A Heat interface material and its producing method
10/19/2005CN1684250A Heat radiation module
10/19/2005CN1684249A Semiconductor device and method for manufacturing same
10/19/2005CN1684244A Method of manufacturing a semiconductor device having damascene structures with air gaps
10/19/2005CN1684240A Semiconductor device, method for producing the same, circuit board, and electronic apparatus
10/19/2005CN1684239A Electric connection end structure of embedded chip and its producing method
10/19/2005CN1684238A Lead frame and method of manufacturing the same
10/19/2005CN1684225A Sheet material for forming chip protection film
10/19/2005CN1683980A 显示装置 The display device
10/19/2005CN1683961A Electronic component, mounted structure, electro-optical device, and electronic device
10/19/2005CN1683960A Display device and manufacturing method of the same
10/19/2005CN1683580A Cu-Ni-Si-Mg series copper alloy strip
10/19/2005CN1224305C Method for mfg. multilayer circuit board for semiconductor device
10/19/2005CN1224304C Method for mfg. ceramic multilayered board
10/19/2005CN1224301C High-frequency module
10/19/2005CN1224108C Solid image-forming apparatus and making method thereof
10/19/2005CN1224102C Stacked semiconductor device
10/19/2005CN1224101C Electronic electrostatic discharge protection device and its manufacturing method
10/19/2005CN1224100C 树脂密封型的半导体装置 The resin sealing type semiconductor device
10/19/2005CN1224099C Substrate with conductor formed of low-resistance aluminum alloy
10/19/2005CN1224098C Solid luminous device packaged radiating member and its making method
10/19/2005CN1224097C Semiconductor device and manufacture method thereof, circuit board and electronic device
10/19/2005CN1224096C High humidity sensitive electronic device part using air ventilation hole and gap
10/19/2005CN1224094C Integrated radio-frequency circuit
10/19/2005CN1224092C Semiconductor device having low dielectric film and fabrication process thereof
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