Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2014
04/09/2014CN103718289A Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication
04/09/2014CN103718288A Ceramic substrate and process for producing same
04/09/2014CN103718286A Protective layer for protecting TSV tips during thermo-compressive bonding
04/09/2014CN103718285A Low-stress TSV design using conductive particles
04/09/2014CN103718279A Emi shielding and thermal dissipation for semiconductor device
04/09/2014CN103717688A A reactive hot-melt adhesive for use on electronics
04/09/2014CN103717669A Epoxy resin composition for cast molding and electrical device using same
04/09/2014CN103717634A Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and method for producing semiconductor device
04/09/2014CN103717552A Method of manufacturing oxide ceramic circuit board, and oxide ceramic circuit board
04/09/2014CN103717035A Heat radiating device and fixing assembly thereof
04/09/2014CN103716992A Wiring board with embedded device, built-in stopper and electromagnetic shielding
04/09/2014CN103716980A Positive electrode oxidation film printing substrate used for power module
04/09/2014CN103715991A Micro CMOS power amplifier
04/09/2014CN103715232A Groove type terminal used for semiconductor power device and preparation method of groove type terminal
04/09/2014CN103715207A Capacitor of TFT array substrate and manufacturing method and relevant device thereof
04/09/2014CN103715206A Pixel unit, array substrate and display panel
04/09/2014CN103715184A Three-dimensional multi-chip storage system packaging structure based on flexible base board and manufacturing method thereof
04/09/2014CN103715183A Semiconductor device
04/09/2014CN103715181A Semiconductor package and method for fabricating the same
04/09/2014CN103715180A Passive device for embedded substrate and substrate with passive device embedded therein
04/09/2014CN103715179A Substrate, alignment mark manufacturing method thereof and display device
04/09/2014CN103715178A Dual-phase intermetallic interconnection structure and method of fabricating the same
04/09/2014CN103715177A Combination of patterned metal wire and substrate
04/09/2014CN103715176A Semiconductor device
04/09/2014CN103715175A Semiconductor device, method of manufacturing semiconductor device, and solid-state imaging device
04/09/2014CN103715174A Integrated circuit connector access area and manufacturing method thereof
04/09/2014CN103715173A Semiconductor integrated circuit device
04/09/2014CN103715172A Electrical fuse and method of fabricating the same
04/09/2014CN103715171A Conductive metal interconnection wire and manufacturing method thereof
04/09/2014CN103715170A Semiconductor unit and method for manufacturing the same
04/09/2014CN103715169A Semiconductor device and designing method of semiconductor device
04/09/2014CN103715168A Package structure and method for manufacturing package structure
04/09/2014CN103715167A Semiconductor device, apparatus of estimating lifetime, method of estimating lifetime
04/09/2014CN103715166A Apparatus and method for a component package
04/09/2014CN103715165A Semiconductor package and fabrication method thereof
04/09/2014CN103715164A Flexible circuit board and chip package structure
04/09/2014CN103715163A Lead frame and semiconductor encapsulation
04/09/2014CN103715162A Lead frame strip used for semi-conductor packaging
04/09/2014CN103715161A Chip arrangements, a chip package and a method for manufacturing a chip arrangement
04/09/2014CN103715160A Thread guiding frame and power module sealing using same
04/09/2014CN103715159A Power semiconductor housing with redundant functionality
04/09/2014CN103715158A Double-sided semiconductor structure using through-silicon vias
04/09/2014CN103715157A Heat dissipation device
04/09/2014CN103715156A Cooling device and semiconductor device
04/09/2014CN103715155A Integrated circuit including package substrate
04/09/2014CN103715154A Cooling device
04/09/2014CN103715153A Thermally enhanced package on package (PoP)
04/09/2014CN103715152A Connection basal plate and laminated packaging structure
04/09/2014CN103715151A Semiconductor device and manufacturing method of the same
04/09/2014CN103715150A Die cap and flip chip package with die cap
04/09/2014CN103715149A Perimeter trench sensor array package
04/09/2014CN103715148A Copper-free base plate DCB ceramic welding module
04/09/2014CN103715147A Complementary type thin film transistor drive backboard, manufacturing method thereof and display panel
04/09/2014CN103715141A Array substrate and preparation method thereof
04/09/2014CN103715135A Via hole, making method thereof and array substrate
04/09/2014CN103715133A Mos transistor and forming method thereof
04/09/2014CN103715110A Method for manufacturing semiconductor module, joint device and semiconductor module
04/09/2014CN103715109A Packaged IC having printed dielectric adhesive on die pad
04/09/2014CN103715105A Method of manufacturing semiconductor apparatus and semiconductor apparatus
04/09/2014CN103715104A Semiconductor device and method of forming supporting layer over semiconductor die
04/09/2014CN103715100A Solder flow-impeding plug on a lead frame
04/09/2014CN103713438A Array substrate, manufacturing method thereof and display device
04/09/2014CN103709983A High temperature resisting bottom filler glue and preparation method thereof
04/09/2014CN103706907A Manufacturing method of semiconductor device and semiconductor device
04/09/2014CN102623306B Metal-multilayer insulator-metal capacitor, manufacture method for same and integrated circuit thereof
04/09/2014CN102593088B Semiconductor chip, semiconductor structure using same and manufacturing method for semiconductor chip
04/09/2014CN102576695B Assemblies and methods for directly connecting integrated circuits to electrically conductive sheets
04/09/2014CN102414813B Printed circuit board cooling assembly
04/09/2014CN102349153B Lead frame and method for manufacturing same
04/09/2014CN102317236B Substrate comprising aluminum/graphite composite, heat dissipation part comprising same, and LED luminescent member
04/09/2014CN102315181B Semiconductor device
04/09/2014CN102280416B Semiconductor device and method of manufacture thereof
04/09/2014CN102237295B Semiconductor structure manufacturing method
04/09/2014CN102231371B Semiconductor chip and storage device
04/09/2014CN102222629B 半导体装置及其制造方法 Semiconductor device and manufacturing method
04/09/2014CN102214628B Package substrate and fabricating method thereof
04/09/2014CN102191002B High-humidity and high-temperature resisting single component epoxy adhesive and its preparation method
04/09/2014CN102176808B Laminated body, method of manufacturing susbtrate, substrate, and semiconductor device
04/09/2014CN102098876B Manufacturing process for circuit substrate
04/09/2014CN101996978B Chip package body and forming method thereof
04/09/2014CN101993031B Protection structure and semiconductor structure of contact pad
04/09/2014CN101908532B Thin double-faced display OLED (Organic Light Emitting Diode) device and manufacturing method thereof
04/09/2014CN101728312B SOI substrate and method for manufacturing same
04/09/2014CN101661922B Copper interconnection line with silicon through hole having high depth-to-width ratio and preparation method thereof
04/09/2014CN101571268B High power LED lamp
04/09/2014CN101533812B Semiconductor package having side walls and method for manufacturing same
04/09/2014CN101500395B Stack radiator and its radiation fin
04/09/2014CN101437364B Device mounting structure and device mounting method
04/08/2014US8694945 Automatic place and route method for electromigration tolerant power distribution
04/08/2014US8692394 Adhesive for semiconductor bonding, adhesive film for semiconductor bonding, method for mounting semiconductor chip, and semiconductor device
04/08/2014US8692393 Alignment mark design for semiconductor device
04/08/2014US8692392 Crack stop barrier and method of manufacturing thereof
04/08/2014US8692391 Embedded ball grid array substrate and manufacturing method thereof
04/08/2014US8692389 Dicing tape-integrated film for semiconductor back surface
04/08/2014US8692388 Integrated circuit package system with waferscale spacer
04/08/2014US8692387 Stacked die semiconductor package
04/08/2014US8692386 Semiconductor device, method of manufacturing semiconductor device, and electronic device
04/08/2014US8692385 Device for connecting nano-objects to external electrical systems, and method for producing said device
04/08/2014US8692384 Semiconductor device with through silicon via and alignment mark
04/08/2014US8692383 Semiconductor device and method of manufacturing the same
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