Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2005
10/20/2005US20050233550 Method of laser marking, laser marking apparatus and method and apparatus for detecting a mark
10/20/2005US20050233519 Method of manufacturing semiconductor device
10/20/2005US20050233518 Electronic circuit device having silicon substrate
10/20/2005US20050233517 Semiconductor device and method for manufacturing same
10/20/2005US20050233515 Method of etching a semiconductor device
10/20/2005US20050233503 Method for the production of structured layers on substrates
10/20/2005US20050233502 Methods of fabrication for flip-chip image sensor packages
10/20/2005US20050233501 Semiconductor device and a method of manufacturing the same
10/20/2005US20050233500 Method of manufacturing semiconductor package having multiple rows of leads
10/20/2005US20050233497 Method of forming a multi-die semiconductor package
10/20/2005US20050233496 Method of making assemblies having stacked semiconductor chips
10/20/2005US20050233482 Method of making contact pin card system
10/20/2005US20050233480 Clearance inspection apparatus and clearance inspection method
10/20/2005US20050233478 Structure and method for providing precision passive elements
10/20/2005US20050233172 Alumina insulation for coating implantable components and other microminiature devices
10/20/2005US20050233122 Manufacturing method of laminated substrate, and manufacturing apparatus of semiconductor device for module and laminated substrate for use therein
10/20/2005US20050233112 Higher melting substrate is an oxide or nitride of aluminum, titanium or zirconium; layer is silica powder, glass powder, glaze powder, copper oxide, lead oxide, hafnium oxide, or boron oxide and has embedded nanostructure stalagmites or columns extending towards the substrate; no polishing required
10/20/2005US20050232045 Semiconductor device having a low-resistance bus interconnect, method of manufacturing same, and display apparatus employing same
10/20/2005US20050231925 Semiconductor device and method for manufacturing the same
10/20/2005US20050231922 Functional printed circuit board module with an embedded chip
10/20/2005US20050231919 Semiconductor device socket
10/20/2005US20050231918 Electronic module assembly
10/20/2005US20050231916 Cooling apparatus for heat generating devices
10/20/2005US20050231914 Cooling device for electronic apparatus
10/20/2005US20050231912 Electronic apparatus and method of cooling the electronic apparatus
10/20/2005US20050231911 Interface module-mounted LSI package
10/20/2005US20050231890 Thermal dissipating capacitor and electrical component comprising same
10/20/2005US20050231889 Capacitor-embedded substrate
10/20/2005US20050231721 Wafer pre-alignment apparatus and method
10/20/2005US20050231626 Packaged microelectronic imagers and methods of packaging microelectronic imagers
10/20/2005US20050231555 Member to be recognized for alignment; head unit and electronic device provided therewith; method of manufacturing LCD, organic EL device, electron emission device, PDP device, electrophoretic display device, color filter, and organic EL; method of forming spacer, metallic wire, lens, resist, and light diffusion member, each of said methods using said head unit
10/20/2005US20050231299 Integrated circuit and method for manufacturing same
10/20/2005US20050231268 Threshold voltage detector for process effect compensation
10/20/2005US20050230852 Semiconductor chip package
10/20/2005US20050230851 Display device
10/20/2005US20050230850 Microelectronic assembly having a redistribution conductor over a microelectronic die
10/20/2005US20050230848 Component built-in module and method for producing the same
10/20/2005US20050230847 Bonding pad structure and method of forming the same
10/20/2005US20050230846 Wafer level chip scale packaging structure and method of fabricating the same
10/20/2005US20050230845 Portable telephone
10/20/2005US20050230844 Flip-chip image sensor packages and methods of fabrication
10/20/2005US20050230843 Flip-chip type semiconductor devices and conductive elements thereof
10/20/2005US20050230842 Multi-chip flip package with substrate for inter-die coupling
10/20/2005US20050230841 Integrated circuit package with low modulus layer and capacitor/interposer
10/20/2005US20050230840 Semiconductor wafer, semiconductor chip and method for manufacturing the same
10/20/2005US20050230838 Metal wiring and method of manufacturing the same, and metal wiring substrate and method of manufacturing the same
10/20/2005US20050230837 Semiconductor component with coreless transformer
10/20/2005US20050230836 Method of forming air gaps in a dielectric material using a sacrificial film and resulting structures
10/20/2005US20050230835 Semiconductor device
10/20/2005US20050230834 Multi-stage curing of low K nano-porous films
10/20/2005US20050230832 Three-level unitary interconnect structure
10/20/2005US20050230831 Structure to improve adhesion between top CVD low-k dielectiric and dielectric capping layer
10/20/2005US20050230829 Semiconductor device
10/20/2005US20050230828 Carrier, chip package structure, and circuit board package structure
10/20/2005US20050230827 Semiconductor device, magnetic sensor, and magnetic sensor unit
10/20/2005US20050230826 Semiconductor device and multilayer substrate therefor
10/20/2005US20050230825 Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer
10/20/2005US20050230824 BGA semiconductor device having a dummy bump
10/20/2005US20050230823 Semiconductor device and printed circuit board
10/20/2005US20050230822 NANO IC packaging
10/20/2005US20050230821 Semiconductor packages, and methods of forming semiconductor packages
10/20/2005US20050230820 Power semiconductor arrangement
10/20/2005US20050230819 Semiconductor Heat-Dissipating Substrate, and Manufacturing Method and Package Therefor
10/20/2005US20050230818 Display device
10/20/2005US20050230817 Chip bonding heater with differential heat transfer
10/20/2005US20050230816 Semiconductor module mounting structure, a cardlike semiconductor module, and heat receiving members bonded to the cardlike semiconductor module
10/20/2005US20050230815 Interconnect alloys and methods and apparatus using same
10/20/2005US20050230814 Semiconductor packaging substrate and method of producing the same
10/20/2005US20050230812 Electronic component comprising a multilayer substrate and corresponding method of production
10/20/2005US20050230811 Compliant contact pin assembly and card system
10/20/2005US20050230810 Compliant contact pin assembly and card system
10/20/2005US20050230809 Compliant contact pin assembly and card system
10/20/2005US20050230808 Methods for making semiconductor packages with leadframe grid arrays
10/20/2005US20050230807 Power semiconductor module
10/20/2005US20050230806 Conductive elements with adjacent, mutually adhered regions and semiconductor device assemblies including such conductive elements
10/20/2005US20050230805 Semiconductor device, method for producing the same, circuit board, and electronic apparatus
10/20/2005US20050230804 Manufacturing method for semiconductor device, semiconductor device and semiconductor chip
10/20/2005US20050230803 Leadframe packaging structure and the method of manufacturing the same
10/20/2005US20050230802 Stacked die BGA or LGA component assembly
10/20/2005US20050230801 Semiconductor device
10/20/2005US20050230800 Thermally enhanced stacked die package and fabrication method
10/20/2005US20050230799 Multi-chip module with embedded package and method for manufacturing the same
10/20/2005US20050230797 Chip packaging structure
10/20/2005US20050230796 Semiconductor integrated circuit
10/20/2005US20050230795 LSI package provided with interface module, and transmission line header employed in the package
10/20/2005US20050230794 Semiconductor device with improved design freedom of external terminal
10/20/2005US20050230793 Semiconductor device
10/20/2005US20050230792 Modifying a semiconductor device to provide electrical parameter monitoring
10/20/2005US20050230790 Tape carrier for TAB
10/20/2005US20050230789 Method for removing tiebars after molding of semiconductor chip
10/20/2005US20050230788 Magnetic shield member, magnetic shield structure, and magnetic memory device
10/20/2005US20050230786 Semiconductor device having a measuring pattern and a method of measuring the semiconductor device using the measuring pattern
10/20/2005US20050230783 High performance system-on-chip discrete components using post passivation process
10/20/2005US20050230782 Semiconductor device and method for manufacturing the same
10/20/2005US20050230778 Passivation of power semiconductor device
10/20/2005US20050230773 Electronic component, mounted structure, electro-optical device, and electronic device
10/20/2005US20050230761 Semiconductor device
10/20/2005US20050230757 Electro-optical device and electronic apparatus
10/20/2005US20050230746 Power semiconductor switching devices and power semiconductor devices
10/20/2005US20050230733 Semiconductor device having landing pad and fabrication method thereof
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