Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/2005
10/27/2005US20050236676 Semiconductor device
10/27/2005US20050236673 System and method for ESD protection
10/27/2005US20050236672 MOS type semiconductor device having electrostatic discharge protection arrangement
10/27/2005US20050236670 Soi single crystalline chip structure
10/27/2005US20050236660 Semiconductor device and method of fabricating the same
10/27/2005US20050236655 Semiconductor device manufacturing method and semiconductor device
10/27/2005US20050236651 Semiconductor device, semiconductor circuit and method for producing semiconductor device
10/27/2005US20050236640 Laminates for encapsulating devices
10/27/2005US20050236624 Thin film transistor array substrate for liquid crystal display and method of fabricating the same
10/27/2005US20050236621 Solid-state imaging device and method of manufacturing the same
10/27/2005US20050236617 Semiconductor device
10/27/2005US20050236616 Reliable semiconductor structure and method for fabricating
10/27/2005US20050236181 Novel ECP method for preventing the formation of voids and contamination in vias
10/27/2005US20050236180 Laminate ceramic circuit board and process therefor
10/27/2005US20050236177 Multilayer printed wiring board
10/27/2005US20050236142 High surface area heat sink
10/27/2005US20050236104 Method for mounting semiconductor device, as well as circuit board, electrooptic device, and electronic device
10/27/2005US20050235494 Heat pipe and manufacturing method thereof
10/27/2005US20050235487 Device and method for fastener-free connection via a heat-shrinkable insert
10/27/2005DE19920444B4 Verfahren zum Herstellen eines Halbleiterbausteins sowie Halbleiterbaustein A method of manufacturing a semiconductor device and semiconductor module
10/27/2005DE10393437T5 Halbleiterbauelementbaugruppe A semiconductor device assembly
10/27/2005DE10393395T5 Schaltungsmaterialien, Schaltungen, mehrschichtige Schaltungen und Herstellungsverfahren davon Circuit materials, circuits, multilayer circuits and manufacturing method thereof
10/27/2005DE10335197B4 Kühlvorrichtung für ein elektronisches Bauelement, insbesondere für einen Mikroprozessor Cooling device for an electronic component, in particular for a microprocessor
10/27/2005DE102005013270A1 Schaltungsplatine zum Verbinden einer integrierten Schaltung mit einem Träger und einem IC-BGA-Gehäuse, das dieselbe verwendet Circuit board for connecting an integrated circuit having a substrate and an IC BGA package, using the same
10/27/2005DE102004018448A1 Halbleiterbauelement mit Gegensignalschaltung zum Vermeiden von Übersprechen elektronischer Baugruppen A semiconductor device with counter-signal circuit for preventing crosstalk of electronic modules
10/27/2005DE102004017284A1 Integrierte Halbleiterschaltung und Verfahren zur Prüfung der integrierten Halbleiterschaltung A semiconductor integrated circuit and method for testing the semiconductor integrated circuit
10/27/2005DE102004016940A1 Schaltungsträger für einen Halbleiterschip und Bauelement Component carrier for a semiconductor chip and component
10/27/2005DE102004016920A1 Verfahren zum Schalten einer Spannungsversorgung von Spannungsdomänen einer Halbleiterschaltung und entsprechende Halbleiterschaltung A method for switching a power supply voltage domains of a semiconductor circuit, and corresponding semiconductor circuit
10/27/2005DE102004015923A1 Inspection method for resist structures on wafer surfaces uses test structures with test elements set out as a measuring scale and exposed to asymmetrical unbalanced capillary forces
10/27/2005DE102004008803B3 Schutzdiode zum Schutz von Halbleiterschaltkreisen gegen elektrostatische Entladungen Protection diode for protecting semiconductor circuits against static discharges
10/27/2005DE10139985B4 Elektronisches Bauteil mit einem Halbleiterchip sowie Verfahren zu seiner Herstellung Electronic component having a semiconductor chip as well as methods for its preparation
10/27/2005CA2563557A1 Integrated circuit with analog connection matrix
10/27/2005CA2562936A1 Epoxy resin composition
10/26/2005EP1589799A1 Multi-layer ceramic substrate and method for manufacture thereof
10/26/2005EP1589798A1 Multilayer printed board, electronic apparatus, and packaging method
10/26/2005EP1589797A2 Manufacturing method of laminated substrate, and manufacturing apparatus of semiconductor device for module and laminated substrate for use therein
10/26/2005EP1589795A1 Laminate ceramic circuit board and process therefor
10/26/2005EP1589582A1 Wiring substrate and radiation detector using same
10/26/2005EP1589578A1 Method and structures for indexing dice
10/26/2005EP1589577A1 Memory cell for modification of revision identifier in an integrated circuit chip
10/26/2005EP1589576A2 Heat dissipation in a drive circuit module for a plasma display device, for example
10/26/2005EP1589570A1 Semiconductor device and process for producing the same
10/26/2005EP1589569A2 Injection casting system for encapsulating semiconductor devices and method of use
10/26/2005EP1589401A1 Air circulating structure for heat dissipation device
10/26/2005EP1588465A2 Electrostatic discharge circuit and method therefor
10/26/2005EP1588420A2 Sealed and pressurized liquid cooling system for microprocessor
10/26/2005EP1588413A2 Method and apparatus for the use of self-assembled nanowires for the removal of heat from integrated circuits
10/26/2005EP1588410A1 A method of improving stability in low k barrier layers
10/26/2005EP1588407A2 Area array package with non-electrically connected solder balls
10/26/2005EP1588401A2 Cooling apparatus having low profile extrusion and method of manufacture therefore
10/26/2005EP1588371A2 Tamper-resistant packaging and approach using magnetically-set data
10/26/2005EP1588319A1 Module for a hybrid card
10/26/2005EP1587892A1 Thermally-formable and cross-linkable precursor of a thermally conductive material
10/26/2005EP1587728A1 Stanchion with an integrated device for securing a load, in particular for tarpaulin-covered transport vehicles
10/26/2005EP1587705A2 Integrated component
10/26/2005EP1485724B1 Scatterometry structure with embedded ring oscillator, and methods of using same
10/26/2005EP1415271B1 Bonding of semiconductor chips in chip cards
10/26/2005EP1316108A4 Low-dielectric silicon nitride film and method of forming the same, semiconductor device and fabrication process thereof
10/26/2005EP0963606B1 An integrated circuit which uses a recessed local conductor for producing staggered interconnect lines
10/26/2005EP0813243B1 Material for a semiconductor device carrier substrate and method of producing the same
10/26/2005EP0771027B1 Semiconductor device
10/26/2005EP0744033B1 An integrated resistor for sensing electrical parameters
10/26/2005CN2736933Y Thermoelectric-electromagnetic pump driven liquid metal chip radiator
10/26/2005CN2736932Y Integrated circuit heat sink employing heat pipe technique
10/26/2005CN2736931Y Stamping structure of heat pipe radiator
10/26/2005CN2736930Y 散热器 Heat sink
10/26/2005CN2736929Y Heat sink of integrated circuit
10/26/2005CN2736928Y Riveted structure of radiator and heat pipe
10/26/2005CN2736927Y Riveted structure of heat pipe and radiating fin
10/26/2005CN2736926Y 散热器固定装置 Sink fixtures
10/26/2005CN2736925Y Heat sink
10/26/2005CN2736924Y Heat sink assembly and fixing structure thereof
10/26/2005CN2736923Y Plate type radiating structure
10/26/2005CN2736922Y Heat sink
10/26/2005CN2736851Y Fastener of radiator
10/26/2005CN2736848Y Fan fixing device
10/26/2005CN2736846Y Wind-guiding apparatus
10/26/2005CN1689384A Cooling device for electronic apparatus
10/26/2005CN1689225A Frequency-independent voltage divider
10/26/2005CN1689157A Semiconductor device and method of manufacturing thereof
10/26/2005CN1689156A Electronic component having an integrated passive electronic component and associated production method
10/26/2005CN1689155A Discrete semiconductor component
10/26/2005CN1689154A Flip chip die bond pads, die bond pad placement and routing optimization
10/26/2005CN1689153A Microstructure cooling device and use thereof
10/26/2005CN1689152A Method for forming metal-metal oxide etch stop/electric transfer screen for integrated circut interconnects and device
10/26/2005CN1688954A Scalable computer system having surface-mounted capacitive couplers for intercommunication
10/26/2005CN1688504A Method for selectively covering a micro machined surface
10/26/2005CN1688437A Thermal interface materials
10/26/2005CN1688024A Chip with built-in electromagnetic protection capacitance and related method
10/26/2005CN1688023A Flat power semiconductor device, its radiator pressure mounting method and apparatus
10/26/2005CN1688020A Liquid resin dropping packaging method
10/26/2005CN1225153C Circuit board device and its mounting method
10/26/2005CN1225063C Demountable clamping mechanism for land grid array connectors
10/26/2005CN1225037C Integrated circuit device
10/26/2005CN1225033C Optical semiconductor device and its making process
10/26/2005CN1225023C Integrated circuit die and/or package having a variable pitch contact array for maximization of number of signal lines per routing layer
10/26/2005CN1225022C Chip package base board
10/26/2005CN1225012C Method for preparing electronic instrument component by simultaneously adopoting soldifying adhesive and sealant
10/26/2005CN1224989C Surface-mounted capacitor
10/26/2005CN1224487C Improved apparatus for dispensing solder
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