Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2005
11/01/2005US6960033 Array with light-emitting power semiconductor component and corresponding production method
11/01/2005US6959920 Protection against in-process charging in silicon-oxide-nitride-oxide-silicon (SONOS) memories
11/01/2005US6959856 Solder bump structure and method for forming a solder bump
11/01/2005US6959755 Tube-style radiator structure for computer
11/01/2005US6959753 Construction of phase change material embedded electronic circuit boards and electronic circuit board assemblies using porous and fibrous media
10/2005
10/27/2005WO2005101939A1 Mounting plate for electronic components
10/27/2005WO2005101935A1 Connection structure of inner conductor and multilayer substrate
10/27/2005WO2005101934A1 Composite electronic component and method for producing the same
10/27/2005WO2005101509A1 Semiconductor device and process for fabricating the same
10/27/2005WO2005101504A1 Power module
10/27/2005WO2005101502A1 An integrated circuit, a method and an assembly for manufacturing the integrated circuit, and a mobile phone having the integrated circuit
10/27/2005WO2005101501A1 Housing formed by a metallic layer
10/27/2005WO2005101500A2 Manufacture of porous diamond films
10/27/2005WO2005101499A2 Methods of forming solder bumps on exposed metal pads and related structures
10/27/2005WO2005101498A2 HIGH REFLECTIVITY P-CONTACT FOR InGaN LEDs
10/27/2005WO2005101497A2 Method and apparats for lubricating microelectromechanical devices in packages
10/27/2005WO2005101496A2 Method for structured application of a laminatable film to a substrate for a semiconductor module
10/27/2005WO2005101495A1 Flexible printed circuit board for mounting semiconductor chip
10/27/2005WO2005101494A2 Three dimensional six surface conformal die coating
10/27/2005WO2005101493A2 Improved bonding arrangement and method for ltcc circuitry
10/27/2005WO2005101492A2 Stacked die bga or lga component assembly
10/27/2005WO2005101491A2 Micropede stacked die component assembly
10/27/2005WO2005101490A2 Component that is situated on a cooling fin
10/27/2005WO2005101489A2 Housing for led chip and light source
10/27/2005WO2005101481A2 Power semiconductor
10/27/2005WO2005101476A1 Semiconductor element and semiconductor element manufacturing method
10/27/2005WO2005101475A1 Semiconductor element and semiconductor system
10/27/2005WO2005101460A2 Bonding an interconnect to a circuit device and related devices
10/27/2005WO2005101442A1 Integrated circuit with analog connection matrix
10/27/2005WO2005100899A2 Multiple evaporator heat pipe assisted heat sink
10/27/2005WO2005100897A1 Heat transport apparatus, method of manufacturing heat transport apparatus, and electronic equipment
10/27/2005WO2005100445A1 Composition for sealing optical semiconductor, optical semiconductor sealing material, amd method for producing composition for sealing optical semiconductor
10/27/2005WO2005100435A1 Epoxy resin composition
10/27/2005WO2005088429A3 Cooling system for electronic devices and device with such a cooling system
10/27/2005WO2005065064A3 Power potential-free module having a high insulation voltage
10/27/2005WO2005062381A3 Bump power connections of a semiconductor die
10/27/2005WO2005059993A3 Packaging substrates for integrated circuits and soldering methods
10/27/2005WO2005034203A3 Method and apparatus for a dual substrate package
10/27/2005WO2005008730A3 Low cost, high performance flip chip package structure
10/27/2005WO2004068550A3 Interconnect structures incorporating low-k dielectric barrier films
10/27/2005US20050240894 Multidirectional wiring on a single metal layer
10/27/2005US20050240891 Method of switching a power supply of voltage domains of a semiconductor circuit, and corresponding semiconductor circuit
10/27/2005US20050240886 Method of performing design rule checking
10/27/2005US20050239284 Wiring structure for integrated circuit with reduced intralevel capacitance
10/27/2005US20050239280 Method of manufacturing semiconductor device
10/27/2005US20050239279 Integrated circuits including spacers that extend beneath a conductive line and methods of fabricating the same
10/27/2005US20050239275 Compliant multi-composition interconnects
10/27/2005US20050239273 Protective metal structure and method to protect low -K dielectric layer during fuse blow process
10/27/2005US20050239269 Method for releasing stress of embedded chip and chip embedded structure
10/27/2005US20050239268 Integrated circuit with removable scribe street trim and test pads
10/27/2005US20050239259 High voltage power device with low diffusion pipe resistance
10/27/2005US20050239247 Novel architecture to monitor isolation integrity between floating gate and source line
10/27/2005US20050239237 Method for producing a BGA chip module and BGA chip module
10/27/2005US20050239236 Printed circuit board and fabrication method thereof
10/27/2005US20050239235 Method for manufacturing an adhesive substrate with a die-cavity sidewall
10/27/2005US20050238878 Device mounting board
10/27/2005US20050238857 Laminated glazing panel
10/27/2005US20050238804 Nano-powder-based coating and ink compositions
10/27/2005US20050238803 Method for adhering getter material to a surface for use in electronic devices
10/27/2005US20050238747 Injection casting system for encapsulating semiconductor devices and method of use
10/27/2005US20050238296 Optical semiconductor device
10/27/2005US20050237812 Thin film transistor array panel for a liquid crystal display
10/27/2005US20050237778 System with meshed power and signal buses on cell array
10/27/2005US20050237722 Power module comprising at least two substrates and method for producing the same
10/27/2005US20050237720 Retainer for heat sink
10/27/2005US20050237719 Heat dissipating device
10/27/2005US20050237718 Fan-shaped heat-dissipating device
10/27/2005US20050237683 Semiconductor integrated circuit device
10/27/2005US20050237681 High voltage ESD protection circuit with low voltage transistors
10/27/2005US20050237637 Lens module and assembling method thereof
10/27/2005US20050237415 Image sensor module having auto-aligned lens, and method of fabricating the same, and method of automatically controlling focus of lens
10/27/2005US20050237077 Method for testing using a universal wafer carrier for wafer level die burn-in
10/27/2005US20050237076 Method for testing using a universal wafer carrier for wafer level die burn-in
10/27/2005US20050237075 Method for testing using a universal wafer carrier for wafer level die burn-in
10/27/2005US20050236721 Method of reducing film stress on overlay mark
10/27/2005US20050236720 Semiconductor chip having pads with plural junctions for different assembly methods
10/27/2005US20050236719 IC module assembly
10/27/2005US20050236718 Printed circuit board
10/27/2005US20050236717 System in-package test inspection apparatus and test inspection method
10/27/2005US20050236716 Heat dissipation structure and method thereof
10/27/2005US20050236715 Nickel alloy salicide transistor structure and method for manufacturing same
10/27/2005US20050236713 Semiconductor device
10/27/2005US20050236712 Substrate contact and method of forming the same
10/27/2005US20050236709 Multiple chip semiconductor package and method of fabricating same
10/27/2005US20050236707 Integrated circuit package with improved power signal connection
10/27/2005US20050236706 Semiconductor device and hybrid integrated circuit device
10/27/2005US20050236705 Wire bonding system and method of use
10/27/2005US20050236704 Chip package structure and process for fabricating the same
10/27/2005US20050236702 Semiconductor package for a large die
10/27/2005US20050236701 Leadframe, plastic-encapsulated semiconductor device, and method for fabricating the same
10/27/2005US20050236699 Method of forming a support frame for semiconductor packages
10/27/2005US20050236698 Semiconductor device in which semiconductor chip is mounted on lead frame
10/27/2005US20050236697 Semiconductor device having improved solder joint and internal lead lifetimes
10/27/2005US20050236696 Fan out type wafer level package structure and method of the same
10/27/2005US20050236695 Siloxane epoxy polymers for low-k dielectric applications
10/27/2005US20050236694 Silicon oxycarbide and silicon carbonitride based materials for MOS devices
10/27/2005US20050236689 High-frequency amplification device
10/27/2005US20050236688 Fuse regions of a semiconductor memory device and methods of fabricating the same
10/27/2005US20050236683 Prevention of tampering in electronic devices
10/27/2005US20050236681 Metrology structure and methods
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