Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2005
11/02/2005EP1591872A2 Electronic apparatus incorporating a cooling unit
11/02/2005EP1591871A1 Heat dissipating structure for computer host
11/02/2005EP1591465A1 Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device
11/02/2005EP1590838A2 Peltier cooler integrated with electronic device(s)
11/02/2005EP1590830A1 Single-phase power converter module
11/02/2005EP1590829A2 Method for producing a chip panel by means of a heating and pressing process using a thermoplastic material
11/02/2005EP1268665B1 Flame retardant phosphorus element-containing epoxy resin compositions
11/02/2005CN2738396Y Double-layer radiator combined clamping structure
11/02/2005CN1692496A Electronic member, method for making the same, and semiconductor device
11/02/2005CN1692495A Semiconductor integrated device and method for manufacturing same
11/02/2005CN1692493A Method of cutting semiconductor wafer and protective sheet used in the cutting method
11/02/2005CN1692491A Semiconductor device, dram integrated circuit device, and method of producing the same
11/02/2005CN1692484A Semiconductor sensor and plating method for semiconductor device
11/02/2005CN1692481A 半导体装置 Semiconductor device
11/02/2005CN1692479A Semiconductor device and production method therefor
11/02/2005CN1692283A Sheet-form connector and production method and application therefor
11/02/2005CN1692075A Particulate alumina, method for producing particulate alumina and composition containing particulate alumina
11/02/2005CN1691881A Electronic apparatus
11/02/2005CN1691880A Electronic apparatus
11/02/2005CN1691877A Manufacturing method of laminated substrate, and semiconductor device for module and manufacturing apparatus
11/02/2005CN1691871A Multilayer substrate including components therein
11/02/2005CN1691852A Organic electroluminescence device and manufacturing method thereof
11/02/2005CN1691500A Elastic wave device and package substrate
11/02/2005CN1691492A Power module and electric transportation apparatus incorporating the same
11/02/2005CN1691416A Electronic part and surface treatment method of the same
11/02/2005CN1691348A Flat panel display device
11/02/2005CN1691343A Structure of image sensor module and wafer level package and its forming method
11/02/2005CN1691325A Semiconductor circuit and method of fabrication
11/02/2005CN1691324A Electrostatic discharge protecting device
11/02/2005CN1691323A Structure to improve adhesion between top cvd low-K dielectiric and dielectric capping layer
11/02/2005CN1691322A Fuse regions of a semiconductor memory device and methods of fabricating the same
11/02/2005CN1691321A Semiconductor integrated circuit, method of forming the same, and method of adjusting circuit parameter thereof
11/02/2005CN1691320A Method and structure for improving adhesion between intermetal dielectric layer and cap layer
11/02/2005CN1691319A Semiconductor device
11/02/2005CN1691318A Semiconductor device and manufacturing method of the same
11/02/2005CN1691316A Heat dissipating device
11/02/2005CN1691315A Exposed active element base module with embedded passive element
11/02/2005CN1691314A Flip ball grid array packaging base plate and making technique thereof
11/02/2005CN1691313A Power module and method of manufacturing the same
11/02/2005CN1691307A Method of fabricating semiconductor device
11/02/2005CN1691301A Method for manufacturing connection construction
11/02/2005CN1691286A Electrode contact structure and method for production thereof
11/02/2005CN1691280A Method for manufacturing a semiconductor substrate and method for manufacturing an electro-optical device
11/02/2005CN1690920A Heat-receiving apparatus and electronic equipment
11/02/2005CN1690779A Electro-optical device and electronic apparatus
11/02/2005CN1690440A Electronic device
11/02/2005CN1690438A Electronic apparatus having the pump
11/02/2005CN1690160A Thermal interface material and its production method
11/02/2005CN1689935A Film for protecting mother glass for flat panel display and use thereof
11/02/2005CN1689934A Film for protecting mother glass for flat panel display and use thereof
11/02/2005CN1689732A Method for preparing aluminum nitride sintered body
11/02/2005CN1225956C Method for manufacturing sealed electronic component using reproduceable packaging sealant
11/02/2005CN1225792C Substrate charge circuit for input/output electrostatic discharge protection and protection method thereof
11/02/2005CN1225791C Semiconductor configuration and making process
11/02/2005CN1225790C Connecting pad structure and mfg. method thereof
11/02/2005CN1225789C Optical valve heat radiator
11/02/2005CN1225788C Heating electronic component radiator bound by binding column
11/02/2005CN1225786C Windowed non-ceramic package having embedded frame
11/02/2005CN1225785C Wiring base board and method for producing belt type wiring base board
11/02/2005CN1225784C Ball grid array packaging body
11/02/2005CN1225783C Semiconductor device substrate and manufacturing method thereof, semiconductor packaging element
11/02/2005CN1225780C Method of forming a fuse
11/01/2005US6961915 Design methodology for dummy lines
11/01/2005US6961247 Power grid and bump pattern with reduced inductance and resistance
11/01/2005US6961245 High frequency module
11/01/2005US6961243 CPU heatsink fastener
11/01/2005US6961231 Interposer providing low-inductance decoupling capacitance for a packaged integrated circuit
11/01/2005US6961230 Capacitor, capacitor equipped semiconductor device assembly, capacitor equipped circuit substrate assembly and electronic unit including semiconductor device, capacitor and circuit substrate
11/01/2005US6961229 Electronic circuit device
11/01/2005US6960978 Fuse structure
11/01/2005US6960837 Method of connecting core I/O pins to backside chip I/O pads
11/01/2005US6960836 Reinforced bond pad
11/01/2005US6960835 Stress-relief layer for semiconductor applications
11/01/2005US6960834 Semiconductor device having multi-layer interconnection structure and method of manufacturing the same
11/01/2005US6960831 Semiconductor device having a composite layer in addition to a barrier layer between copper wiring and aluminum bond pad
11/01/2005US6960830 Semiconductor integrated circuit device with dummy bumps
11/01/2005US6960829 Method for producing a semiconductor wafer, semiconductor chip, and intermediate semiconductor product
11/01/2005US6960828 Electronic structures including conductive shunt layers
11/01/2005US6960826 Multi-chip package and manufacturing method thereof
11/01/2005US6960825 Semiconductor device having radiation structure
11/01/2005US6960824 Structure and method for fabrication of a leadless chip carrier
11/01/2005US6960823 Semiconductor device and method of manufacturing the same
11/01/2005US6960822 Solder mask and structure of a substrate
11/01/2005US6960811 Low capacitance ESD protection device, and integrated circuit including the same
11/01/2005US6960808 Semiconductor device having a lower parasitic capacitance
11/01/2005US6960792 Bi-directional silicon controlled rectifier structure with high holding voltage for latchup prevention
11/01/2005US6960784 Charging sensor method and apparatus
11/01/2005US6960523 Method of reducing erosion of a nitride gate cap layer during reactive ion etch of nitride liner layer for bit line contact of DRAM device
11/01/2005US6960522 Method for making damascene interconnect with bilayer capping film
11/01/2005US6960519 Interconnect structure improvements
11/01/2005US6960518 Buildup substrate pad pre-solder bump manufacturing
11/01/2005US6960496 Method of damascene process flow
11/01/2005US6960495 Method for making contacts in a high-density memory
11/01/2005US6960494 Semiconductor package and method of manufacturing the same
11/01/2005US6960493 Semiconductor device package
11/01/2005US6960492 Semiconductor device having multilayer wiring and manufacturing method therefor
11/01/2005US6960490 Method and resulting structure for manufacturing semiconductor substrates
11/01/2005US6960396 semiconductor; plated layer of tin-bismuth solder alloy on the lead; nontoxic; sufficient bonding strength and wettability; reduced whisker formation
11/01/2005US6960366 Plated terminations
11/01/2005US6960278 Method of improving the properties of adhesion of a non-oxide ceramic substrate before gluing it
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