Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2005
11/03/2005US20050243515 Apparatus for enhancing heat transfer efficiency of endothermic/exothermic article
11/03/2005US20050243511 Cooling unit having a heat radiating portion, and electronic apparatus incorporating a cooling unit
11/03/2005US20050243229 Active matrix substrate with height control member
11/03/2005US20050242897 Method and apparatus for synthesizing high-frequency signals for wireless communications
11/03/2005US20050242708 LED device with a vertical leadframe that is configured for surface mounting
11/03/2005US20050242448 Overlay key, method of manufacturing the same and method of measuring an overlay degree using the same
11/03/2005US20050242447 Semiconductor device support element with fluid-tight boundary
11/03/2005US20050242446 Integrated circuit package with different hardness bump pad and bump and manufacturing method therefor
11/03/2005US20050242445 Semiconductor device and fabrication process therefor
11/03/2005US20050242444 Integrated circuit having a strengthened passivation structure
11/03/2005US20050242443 A palladium layer and a gold layer are formed by an electrolytic plating on a solderd part having a nickel layer; thickness of the palladium layer is 0.007 to 0.1 mu m; thickness of the gold layer is 0.003 to 0.02 mu; the gold layer partially laps a palladium strike surface
11/03/2005US20050242442 Customizing back end of the line interconnects
11/03/2005US20050242441 Improved metal wiring pattern for memory devices
11/03/2005US20050242440 Insulating film forming method capable of enhancing adhesion of silicon carbide film, etc. and semiconductor device
11/03/2005US20050242439 Method and structure for connecting ground/power networks to prevent charge damage in silicon on insulator
11/03/2005US20050242438 Circuit comprising a capacitor and at least one semiconductor component, and method of designing same
11/03/2005US20050242437 Method and apparatus for supporting microelectronic substrates
11/03/2005US20050242436 Display device and manufacturing method of the same
11/03/2005US20050242435 Semiconductor device including a hybrid metallization layer stack for enhanced mechanical strength during and after packaging
11/03/2005US20050242434 Electronic packaging using conductive interposer connector
11/03/2005US20050242433 Device comprising electrode pad
11/03/2005US20050242432 Semiconductor chip having pads with plural junctions for different assembly methods
11/03/2005US20050242431 Integrated circuit dies
11/03/2005US20050242430 Multi-level semiconductor device with capping layer with improved adhesion
11/03/2005US20050242429 Integrated circuit ground system
11/03/2005US20050242428 Heat spreader for thermally enhanced semiconductor package
11/03/2005US20050242427 FCBGA package structure
11/03/2005US20050242426 Semiconductor package having a first conductive bump and a second conductive bump and methods for manufacturing the same
11/03/2005US20050242425 Semiconductor device with a protected active die region and method therefor
11/03/2005US20050242424 Semiconductor device using semiconductor chip
11/03/2005US20050242423 Stacked module systems and methods
11/03/2005US20050242422 Semiconductor component having multiple stacked dice
11/03/2005US20050242421 Mold assembly for a package stack via bottom-leaded plastic (BLP) packaging
11/03/2005US20050242420 Elastic wave device and package substrate
11/03/2005US20050242419 Method of fabricating an apparatus including a sealed cavity and an apparatus embodying the method
11/03/2005US20050242418 Structure of package
11/03/2005US20050242417 Semiconductor chip package and method for manufacturing the same
11/03/2005US20050242416 Low-capacitance bonding pad for semiconductor device
11/03/2005US20050242415 Integrated circuit package with improved electro-static discharge protection
11/03/2005US20050242414 Low-k interlevel dielectric layer (ild) and method
11/03/2005US20050242409 Imagine sensor with a protection layer
11/03/2005US20050242408 Structure of image sensor module and a method for manufacturing of wafer level package
11/03/2005US20050242405 Method of manufacturing semiconductor integrated circuit device having capacitor element
11/03/2005US20050242404 Misalignment-tolerant multiplexing/demultiplexing architectures
11/03/2005US20050242402 Semiconductor device and its manufacture method
11/03/2005US20050242400 Electrostatic discharge protection circuit
11/03/2005US20050242399 MOSFET with electrostatic discharge protection structure and method of fabrication
11/03/2005US20050242393 Semiconductor device
11/03/2005US20050242375 Very fine-grain voltage island integrated circuit
11/03/2005US20050242374 Semiconductor structure integrated under a pad
11/03/2005US20050242367 Thin-film electronic device, in particular power device, and method for making same
11/03/2005US20050242356 Test circuit under pad
11/03/2005US20050242351 Thin film transistor array panel for liquid crystal display
11/03/2005US20050242337 Switching device for reconfigurable interconnect and method for making the same
11/03/2005US20050241844 Sealing device and apparatus
11/03/2005US20050241817 Heat spreader with controlled Z-axis conductivity
11/03/2005US20050241812 Multiple-pass heat exchanger with gaps between fins of adjacent tube segments
11/03/2005US20050241809 Pump, cooling system, and electronic apparatus
11/03/2005US20050241808 Heat dissipation device
11/03/2005US20050241806 Radiator plate rapid cooling apparatus
11/03/2005US20050241804 Liquid cooling device
11/03/2005US20050241803 Liquid cooling loop using tubing and bellows for stress isolation and tolerance variation
11/03/2005US20050241802 Liquid loop with flexible fan assembly
11/03/2005US20050241801 Lightweight heat sink
11/03/2005US20050241800 Twin fin arrayed cooling device
11/03/2005US20050241799 High serviceability liquid cooling loop using flexible bellows
11/03/2005US20050241578 Oxidizing method and oxidizing unit for object to be processed
11/03/2005US20050241401 Overstress indication
11/03/2005US20050241312 Pump, electronic apparatus, and cooling system
11/03/2005DE4426121B4 Verfahren zur Herstellung einer Halbleiterspeichervorrichtung A method of manufacturing a semiconductor memory device
11/03/2005DE19845294B4 Halbleitervorrichtung und Herstellungsverfahren einer Halbleitervorrichtung A semiconductor device and manufacturing method of a semiconductor device
11/03/2005DE10356885B4 Verfahren zum Gehäusen von Bauelementen und gehäustes Bauelement A method for housings of components and a housed component
11/03/2005DE10355597B4 Kühlsystem zur Kühlung einer in einem Computersystem angeordneten elektronischen Komponente Cooling system for cooling a computer system arranged in an electronic component
11/03/2005DE10339787B4 Speichermodul Memory module
11/03/2005DE10258570B4 Leistungshalbleitermodul The power semiconductor module
11/03/2005DE102005018280A1 Semiconductor device, e.g. liquid crystal display driver integrated circuit package, includes bump structures having width greater than pitch gap between successively arrayed bump structures, and having non-conductive sidewall
11/03/2005DE102005016830A1 Halbleitervorrichtung und Verfahren zu ihrer Herstellung Semiconductor device and process for their preparation
11/03/2005DE102005008491A1 Harzgekapselte Halbleitervorrichtung und Verfahren zu ihrer Herstellung Resin-encapsulated semiconductor device and process for their preparation
11/03/2005DE102004055815A1 Mounting plate for electronic components has cooling conduits integrated in a plate body and a fastening device for mounting components
11/03/2005DE102004041026A1 Contact formation at predetermined points, comprises filling a mould containing contact cut outs, with a hardenable elastic material, hardening and removal
11/03/2005DE102004031186A1 Vorrichtung und Verfahren zum Abführen von Wärmeenergie Apparatus and method for removing heat energy
11/03/2005DE102004023305A1 Leistungshalbleiter Power semiconductor
11/03/2005DE102004019435A1 An einer Kühlrippe angeordnetes Bauelement Arranged on a cooling fin component
11/03/2005DE102004018679A1 Prüfkörper für Elektronenmikroskope und Verfahren zur Herstellung eines Prüfkörpers Test specimens for electron microscopes and methods for producing a test specimen
11/03/2005DE102004018477A1 Semiconductor module e.g. for power converters, has first electrode between heat-sinks and second electrode between first electrode and second heat sink
11/03/2005DE102004018476A1 Leistungshalbleiteranordnung Power semiconductor device
11/03/2005DE102004015611A1 Offset portion compensation device for analog amplifier, has integrated circuit unit providing output signal whose offset portion depends on mechanical stress component, and combination device to combine compensation and output signals
11/03/2005DE102004015597A1 Semiconductor system comprises substrate with contact pad connected to e.g. solder beads, system being encapsulated on at least five sides and mechanical decoupling system mounted between encapsulation and semiconductor
11/03/2005DE102004015403A1 Verwendung nanoskaliger Partikel zur Erzeugung kratzfester Schutzschichten auf Halbleiterchips Use of nanoscale particles to produce scratch resistant protective layers on semiconductor chips
11/03/2005DE102004015091A1 Verdrahtungsträger-Design Wiring board design
11/03/2005DE102004014752A1 Halbleiterbauelement mit kernlosem Wandler Semiconductor component with coreless transformer
11/03/2005DE10164880B4 Wiring board e.g. for mobile communications device or computer, has insulating pattern formed on substrate, intersecting wiring pattern to define electrode
11/02/2005EP1592124A2 Radio-frequency circuit module and radio communication apparatus
11/02/2005EP1592063A2 Assembly in pressure contact with a power semiconductor module
11/02/2005EP1592061A2 Multilayer substrate including components therein
11/02/2005EP1592060A1 Apparatus for enhancing heat transfer efficiency of endothermic/exothermic article
11/02/2005EP1592059A2 Heat sink and method for processing surfaces thereof
11/02/2005EP1592055A2 Method of making a power semiconductor device
11/02/2005EP1592047A2 Integrated passive devices and method of manufacture
11/02/2005EP1591949A2 Memory card
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