Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2005
11/08/2005US6963124 Locking of mold compound to conductive substrate panels
11/08/2005US6963123 IC package, optical transmitter, and optical receiver
11/08/2005US6963122 Capacitor structure and automated design flow for incorporating same
11/08/2005US6963114 SOI MOSFET with multi-sided source/drain silicide
11/08/2005US6963112 Electrostatic discharge protection circuit with a diode string
11/08/2005US6963111 Efficient pMOS ESD protection circuit
11/08/2005US6963110 System and method for ESD protection
11/08/2005US6963077 Sublithographic nanoscale memory architecture
11/08/2005US6963033 Ball grid array attaching means having improved reliability and method of manufacturing same
11/08/2005US6962957 Epoxy resin composition for semiconductor encapsulation, process for producing the same, and semiconductor device
11/08/2005US6962954 Activated polyethylene glycol compounds
11/08/2005US6962884 Monitoring low temperature rapid thermal anneal process using implanted wafers
11/08/2005US6962877 Methods of preventing oxidation of barrier metal of semiconductor devices
11/08/2005US6962875 Variable contact method and structure
11/08/2005US6962872 High density chip carrier with integrated passive devices
11/08/2005US6962871 Composite polymer dielectric film
11/08/2005US6962870 Method of manufacturing semiconductor device and semiconductor device
11/08/2005US6962868 Semiconductor integrated circuit device and wiring arranging method thereof
11/08/2005US6962867 Methods of fabrication of semiconductor dice having back side redistribution layer accessed using through-silicon vias and assemblies thereof
11/08/2005US6962866 System-on-a-chip with multi-layered metallized through-hole interconnection
11/08/2005US6962865 Semiconductor device, method of fabricating the same, stack-type semiconductor device, circuit board and electronic instrument
11/08/2005US6962864 Wire-bonding method for chips with copper interconnects by introducing a thin layer
11/08/2005US6962863 Semiconductor device having interconnection layer with multiply layered sidewall insulation film
11/08/2005US6962854 Marks and method for multi-layer alignment
11/08/2005US6962836 Method of manufacturing a semiconductor device having leads stabilized during die mounting
11/08/2005US6962834 Wafer-level hermetic micro-device packages
11/08/2005US6962833 Magnetic shield for integrated circuit packaging
11/08/2005US6962829 Method of making near chip size integrated circuit package
11/08/2005US6962827 Semiconductor device capable of shortening test time and suppressing increase in chip area, and method of manufacturing semiconductor integrated circuit device
11/08/2005US6962753 comprising soft magnetic powder mixed with an organic binding agent and having an electromagnetic interference suppressing effect, powder excellent in thermal conductivity is further dispersed into the organic binding agent
11/08/2005US6962752 Curable composition for forming low bleeding gel type cured product
11/08/2005US6962727 Organosiloxanes
11/08/2005US6962613 Low-temperature fabrication of thin-film energy-storage devices
11/08/2005US6962294 Integrated circuit having an active shield
11/08/2005US6962282 System for providing an open-cavity low profile encapsulated semiconductor package
11/08/2005US6962192 Heat dissipation assembly with retaining device
11/08/2005US6961995 Absorbs the stresses that occur between a chip carrier and a printed wiring board during thermal cycling
11/03/2005WO2005104636A1 Electronics module and method for manufacturing the same
11/03/2005WO2005104635A1 Heat conduction from an embedded component
11/03/2005WO2005104324A2 Folded, fully buffered memory module
11/03/2005WO2005104323A2 Improved microchannel heat sink
11/03/2005WO2005104314A2 Method for production of electronic and optoelectronic circuits
11/03/2005WO2005104249A1 Semiconductor chip for driving light emitting element, light emitting device and lighting equipment
11/03/2005WO2005104231A2 Multi-substrate circuit assembly
11/03/2005WO2005104230A1 Wiring board, semiconductor device and wiring board manufacturing method
11/03/2005WO2005104229A1 Power semiconductor arrangement
11/03/2005WO2005104228A1 Sensor device, sensor system and methods for manufacturing them
11/03/2005WO2005104227A1 Stacked module systems and methods
11/03/2005WO2005104226A2 Method for production of through-contacts in a plastic mass and semiconductor component with said through contacts
11/03/2005WO2005104213A2 COSMETIC FORMULATIONS COMPRISING ZnO NANOPARTICLES
11/03/2005WO2005104212A2 Wiring structure for integrated circuit with reduced intralevel capacitance
11/03/2005WO2005104211A2 Land grid array packaged device and method of forming same
11/03/2005WO2005104198A1 Semiconductor substrate and process for fabricating the same
11/03/2005WO2005104188A2 Polymer dielectrics for memory element array interconnect
11/03/2005WO2005103320A1 Indium oxide/zinc oxide/magnesium oxide sputtering target and transparent conductive film
11/03/2005WO2005103180A1 Adhesive sheet, semiconductor device and process for producing semiconductor device
11/03/2005WO2005074013A3 Silicon carbide on diamond substrates and related devices and methods
11/03/2005WO2005055310A3 Process for packaging components, and packaged components
11/03/2005WO2005048664B1 High temperature circuits
11/03/2005WO2005037913A3 Highly conductive macromolecular materials and improved methods for making same
11/03/2005WO2004090940A3 Esd protection device and method making the same
11/03/2005WO2004090938A3 Thermal interconnect and interface systems, methods of production and uses thereof
11/03/2005WO2004070471A3 Arc layer for semiconductor device
11/03/2005US20050246598 Voltage/process evaluation in semiconductors
11/03/2005US20050245659 Thermal interface material and method for manufacturing same
11/03/2005US20050245137 Memory module, socket and mounting method providing improved heat dissipating characteristics
11/03/2005US20050245102 Method of using capacitive bonding in a high frequency integrated circuit
11/03/2005US20050245098 Method and apparatus for selectively altering dielectric properties of localized semiconductor device regions
11/03/2005US20050245088 Method for barc over-etch time adjust with real-time process feedback
11/03/2005US20050245076 Sealing and protecting integrated circuit bonding pads
11/03/2005US20050245075 Semiconductor device and method of manufacturing same
11/03/2005US20050245070 Barrier for interconnect and method
11/03/2005US20050245067 Top layers of metal for high performance IC's
11/03/2005US20050245066 Methods of forming solder bumps on exposed metal pads and related structures
11/03/2005US20050245065 Semiconductor device and method for manufacturing the same
11/03/2005US20050245063 Method for forming suspended transmission line structures in back end of line processing
11/03/2005US20050245062 Single row bond pad arrangement
11/03/2005US20050245061 Semiconductor device and manufacturing method thereof
11/03/2005US20050245060 Package design using thermal linkage from die to printed circuit board
11/03/2005US20050245059 Method for making an interconnect pad
11/03/2005US20050245050 Implementation of protection layer for bond pad protection
11/03/2005US20050245012 High performance CMOS transistors using PMD linear stress
11/03/2005US20050245005 Wafer edge ring structures and methods of formation
11/03/2005US20050245004 Method for manufacturing wiring substrate and method for manufacturing electronic device
11/03/2005US20050245003 Method of fabricating a semiconductor device
11/03/2005US20050245002 Method of manufacturing a semiconductor device and used for the same
11/03/2005US20050245001 Shielded laminated structure with embedded chips
11/03/2005US20050244729 Method of measuring the overlay accuracy of a multi-exposure process
11/03/2005US20050244291 Pump and electronic apparatus having this pump
11/03/2005US20050244280 Liquid loop with multiple pump assembly
11/03/2005US20050243659 Methods for writing and reading highly resolved domains for high density data storage
11/03/2005US20050243630 Memory cell with an asymmetrical area
11/03/2005US20050243529 Microelectronic connection components having bondable wires
11/03/2005US20050243525 Captive socket actuator
11/03/2005US20050243524 Expandable bracing apparatus and method
11/03/2005US20050243521 Aligning socket load plates to integral heat spreaders
11/03/2005US20050243520 Pump and electronic device having the pump
11/03/2005US20050243519 Method and apparatus for cooling heat-generating structure
11/03/2005US20050243518 Heat-receiving apparatus and electronic equipment
11/03/2005US20050243517 High serviceability liquid cooling loop using tubing hinge
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