Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2005
11/10/2005US20050247437 Heat dissipating device
11/10/2005US20050247434 Heat dissipating device
11/10/2005US20050247407 Terminal electrode forming apparatus and system for holding electronic components
11/10/2005US20050247398 Manufacturing tool for wafer level package and method of placing dies
11/10/2005US20050246891 Multilayer wiring board, manufacturing method therefor and test apparatus thereof
11/10/2005DE202005012652U1 Power light diode module has light diode on carrier plate having a hole through which a cooling body is inserted to contact the rear face of the diode and cool it
11/10/2005DE202005007407U1 Kühlung einer Projektions-LED Cooling a Projection LED
11/10/2005DE19654560B4 Verfahren zur Bildung eines Kontaktloches bei einem Halbleiterbauelement A method of forming a contact hole in a semiconductor device
11/10/2005DE102005016845A1 Leuchtdiodenarray mit einer Haftschicht Emitting diode array with an adhesive layer
11/10/2005DE102005015789A1 Halbleitervorrichtung und Verfahren zur Herstellung derselben A semiconductor device and method of manufacturing the same
11/10/2005DE102004063406A1 Vorrichtung und Verfahren zum Verhindern von Plasmaladungsschäden An apparatus and method for preventing plasma charge damage
11/10/2005DE102004020642A1 Cooling device for electronic microprocessors operates with a gravity cooling element with a flow of liquid expanding during heating and a radiator for contracting liquid
11/10/2005DE102004019161A1 Verfahren und eine Vorrichtung zum Auftragen von mehrkomponentigen Auftragmassen A method and an apparatus for applying plural component coating compositions
11/10/2005DE102004018475A1 Leistungshalbleiteranordnung Power semiconductor device
11/10/2005DE102004018471A1 Leistungshalbleiterschaltung und Verfahren zum Herstellen einer Leistungshalbleiterschaltung Power semiconductor circuit and method for manufacturing a power semiconductor circuit
11/10/2005DE102004018144A1 Cooler for e.g. graphics card, has discharge channels that are formed in nozzle plate and fluidly connected with discharge pipe connection for conduction of cooling medium e.g. water, on base plate
11/09/2005EP1594173A1 Cooling device for electronic component using thermo-electric conversion material
11/09/2005EP1594167A1 Optoelectronic receiver
11/09/2005EP1594165A2 Method of electrically insulating a substrate for a power-device
11/09/2005EP1594163A1 A screened electrical device and a process for manufacturing the same
11/09/2005EP1594162A1 Optoelectronic receiver
11/09/2005EP1594160A1 Method for manufacturing a free-hanging inductor on a substrate and corresponding device
11/09/2005EP1593853A1 Fan with case having air supplying opening, cooling unit and electronic apparatus comprising fan
11/09/2005EP1593156A2 Method of manufacturing a slice of semiconductor
11/09/2005EP1593134A2 Protecting resin-encapsulated components
11/09/2005EP1430532B1 Encapsulation of pin solder for maintaining accuracy in pin position
11/09/2005EP1421617B1 Power electronics component
11/09/2005EP1317774B1 Method and apparatus for temperature gradient control in an electronic system
11/09/2005EP1309447A4 Lead-free alloys with improved wetting properties
11/09/2005EP0903386B1 Pressure-sensitive adhesive having excellent heat resistance and heat conductivity, adhesive sheets, and method of securing electronic component to heat-radiating member therewith
11/09/2005EP0879470B1 Over-voltage protection device and method for making same
11/09/2005CN2739799Y Miniature surface-pasted overcurrent-overvoltage integrated protective semiconductor device
11/09/2005CN2739798Y Semiconductor integrated circuit lead frame
11/09/2005CN2739797Y High power semiconductor device
11/09/2005CN2739796Y Micron-level chip packaging structure
11/09/2005CN2739795Y Improved structure of radiator for liquid-cooled radiating device
11/09/2005CN2739794Y Combined structure of radiator hood
11/09/2005CN2739793Y Improved structure of heat exchange type radiator
11/09/2005CN1695408A Multilayer printed board, electronic apparatus, and packaging method
11/09/2005CN1695246A 半导体封装及层叠型半导体封装 The semiconductor package and the laminated semiconductor package
11/09/2005CN1695245A Lateral LUBISTOR structure and method
11/09/2005CN1695244A An electronic assembly having a more dense arrangement of contacts that allows for routing of traces to the contacts
11/09/2005CN1695243A Method for maintaining solder thickness in flipchip attach packaging processes
11/09/2005CN1695242A Method and structure to enhance temperature/humidity/bias performance of semiconductor devices by surface modification
11/09/2005CN1695240A Measurement of lateral diffusion of diffused layers
11/09/2005CN1695239A Semiconductor device and method of manufacturing the device
11/09/2005CN1695234A Process monitor and system for producing semiconductor
11/09/2005CN1695233A Three beam MEMS device and correlation method
11/09/2005CN1695232A CMOS process with an integrated, high performance, silicide agglomeration fuse
11/09/2005CN1695149A Nested design approach
11/09/2005CN1694611A Electronic apparatus incorporating a cooling unit
11/09/2005CN1694312A Power delivery system for integrated circuits
11/09/2005CN1694270A Optical surface mount technology package
11/09/2005CN1694254A Semiconductor device, method of generating pattern thereof, method of manufacturing the same, and pattern generating apparatus for the same
11/09/2005CN1694251A Semiconductor device capable of being connected to external terminals by wire bonding in stacked assembly
11/09/2005CN1694250A High-frequency circuit module and radio communication apparatus
11/09/2005CN1694249A Semiconductor device having a multilayer interconnection structure, fabrication method thereof, and designing method thereof
11/09/2005CN1694248A Semiconductor device and manufacturing method therefor
11/09/2005CN1694247A Structure of package
11/09/2005CN1694246A Convection radiating air ventilation cover
11/09/2005CN1694245A Heat sink and method for processing surfaces thereof
11/09/2005CN1694244A Printed circuit board
11/09/2005CN1694240A Method for producing a spiral inductance on a substrate, and a device fabricated according to such a method
11/09/2005CN1694239A Method for forming covering on copper-containing metal interconnector and multi-level semiconductor device
11/09/2005CN1694233A Manufacturing method of lead frame
11/09/2005CN1226789C Power feed and heat dissipating device for power semiconductor devices
11/09/2005CN1226788C Electrostatic discharge preventing method and device and integrated circuit
11/09/2005CN1226787C Metal pad and junction pad area structure
11/09/2005CN1226786C Lead wire holder
11/09/2005CN1226785C Semiconductor power device
11/09/2005CN1226784C Cooling device for cooling heat-generating element and electronic apparatus comprising same
11/09/2005CN1226783C Electronic product with heat radiation plate
11/09/2005CN1226752C Composite particle for dielectrics, ultramicro particulate composite resin particle, composition for forming dielectrics and use thereof
11/09/2005CN1226662C Liquid crystal display device
11/09/2005CN1226433C Manufacturing method of lead wire framework copper belt
11/09/2005CN1226346C Resin composition for insulation and laminated body using said composition
11/08/2005US6963510 Programmable capacitor and method of operating same
11/08/2005US6963493 Multilayer electronic devices with via components
11/08/2005US6963489 Controlling thermal, acoustic, and/or electromagnetic properties of a computing device
11/08/2005US6963393 Measurement of lateral diffusion of diffused layers
11/08/2005US6963389 Alignment method, exposure apparatus and device fabrication method
11/08/2005US6963265 Ball grid array resistor network having a ground plane
11/08/2005US6963204 Method to include delta-I noise on chip using lossy transmission line representation for the power mesh
11/08/2005US6963193 a-C:H ISFET device, manufacturing method, and testing methods and apparatus thereof
11/08/2005US6963143 Method of ball grid array (BGA) alignment, method of testing, alignment apparatus and semiconductor device assembly
11/08/2005US6963142 Flip chip integrated package mount support
11/08/2005US6963141 Semiconductor package for efficient heat spreading
11/08/2005US6963140 Transistor having multiple gate pads
11/08/2005US6963139 Semiconductor device including a layer having a β-crystal structure
11/08/2005US6963138 Dielectric stack
11/08/2005US6963137 Low dielectric constant layers
11/08/2005US6963136 Semiconductor integrated circuit device
11/08/2005US6963135 Semiconductor package for memory chips
11/08/2005US6963134 Semiconductor sensor with substrate having a certain electric potential
11/08/2005US6963133 Semiconductor device and method for manufacturing semiconductor device
11/08/2005US6963131 soldered to cooling body; semiconductors
11/08/2005US6963130 Heatsinking and packaging of integrated circuit chips
11/08/2005US6963129 Multi-chip package having a contiguous heat spreader assembly
11/08/2005US6963126 Semiconductor device with under-fill material below a surface of a semiconductor chip
11/08/2005US6963125 Electronic device packaging
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