Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2005
11/10/2005WO2005106938A1 Method for forming a gate electrode having a metal
11/10/2005WO2005106929A1 Semiconductor wafer and method of producing the same
11/10/2005WO2005106778A1 Method for manufacturing sheet provided with ic tag, apparatus for manufacturing sheet provided with ic tag, sheet provided with ic tag, method for fixing ic chip, apparatus for fixing ic chip, and ic tag
11/10/2005WO2005105919A1 Resin composition for sealing and semiconductor device sealed with resin
11/10/2005WO2005105894A2 SILOXANE EPOXY POLYMERS FOR LOW-κ DIELECTRIC APPLICATIONS
11/10/2005WO2005104814A2 Composite ground shield for passive components in a semiconductor die
11/10/2005WO2005076319A3 Semiconductor component comprising a semiconductor chip stack on a wiring frame and method for producing the same
11/10/2005WO2005065281A3 Articles comprising high-electrical-conductivity nanocomposite material and method for fabricating same
11/10/2005US20050251777 Method and structure for implementing enhanced electronic packaging and PCB layout with diagonal vias
11/10/2005US20050251586 Multiple selectable function integrated circuit module
11/10/2005US20050250371 Sealing structure for connector
11/10/2005US20050250323 Under bump metallization layer to enable use of high tin content solder bumps
11/10/2005US20050250314 Method for fabricating metal interconnection line with use of barrier metal layer formed in low temperature
11/10/2005US20050250312 Structure and process of metal interconnects
11/10/2005US20050250310 Multi-layer interconnection circuit module and manufacturing method thereof
11/10/2005US20050250309 Semiconductor device using low-K material as interlayer insulating film and its manufacture method
11/10/2005US20050250306 Method for manufacturing a semiconductor substrate and method for manufacturing an electro-optical device
11/10/2005US20050250304 Method for fabricating connection regions of an integrated circuit, and integrated circuit having connection regions
11/10/2005US20050250300 Low ohmic layout technique for MOS transistors
11/10/2005US20050250292 Methods for forming backside alignment markers useable in semiconductor lithography
11/10/2005US20050250291 Methods for clearing alignment markers useable in semiconductor lithography
11/10/2005US20050250280 Capacitance process by using passivation film scheme
11/10/2005US20050250273 Display device and manufacturing method of the same
11/10/2005US20050250263 Apparatus and methods for integrated circuit with devices with body contact and devices with electrostatic discharge protection
11/10/2005US20050250256 Semiconductor device and fabricating method thereof
11/10/2005US20050250255 Over-passivation process of forming polymer layer over IC chip
11/10/2005US20050250254 Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device
11/10/2005US20050250252 Low warpage flip chip package solution-channel heat spreader
11/10/2005US20050250251 Method and apparatus for decoupling conductive portions of a microelectronic device package
11/10/2005US20050250250 Diamond composite heat spreader having thermal conductivity gradients and associated methods
11/10/2005US20050250249 Method of making an electronic package
11/10/2005US20050250248 Reworkable b-stageable adhesive and use in waferlevel underfill
11/10/2005US20050250247 Method for internal electrical insulation of a substrate for a power semiconductor module
11/10/2005US20050250246 Method and apparatus for shielding integrated circuits
11/10/2005US20050250245 Semiconductor chip arrangement and method
11/10/2005US20050250025 Method and lithographic structure for measuring lengths of lines and spaces
11/10/2005US20050249969 Preserving solderability and inhibiting whisker growth in tin surfaces of electronic components
11/10/2005US20050249968 Whisker inhibition in tin surfaces of electronic components
11/10/2005US20050249946 Protection film and method of making the same
11/10/2005US20050249945 Manufacturing tool for wafer level package and method of placing dies
11/10/2005US20050249525 Display device and manufacturing metho of the same
11/10/2005US20050248924 Thermal interface for electronic equipment
11/10/2005US20050248921 Method and apparatus for sealing a liquid cooled electronic device
11/10/2005US20050248920 Heat spreader with filtering function and electrical apparatus
11/10/2005US20050248918 Heat sink assembly with rotatable fins
11/10/2005US20050248909 Electronic device including chip parts and a method for manufacturing the same
11/10/2005US20050248891 Substrate-triggered bipolar junction transistor and ESD protection circuit
11/10/2005US20050248431 Method for producing a spiral inductance on a substrate, and a device fabricated according to such a method
11/10/2005US20050248421 Method for producing a coplanar waveguide system on a substrate, and a component for the transmission of electromagnetic waves fabricated in accordance with such a method
11/10/2005US20050248041 Electronic device with high lead density
11/10/2005US20050248040 Semiconductor device power interconnect striping
11/10/2005US20050248039 Semiconductor device
11/10/2005US20050248038 Chip scale package with heat spreader
11/10/2005US20050248037 Flip-chip package substrate with a high-density layout
11/10/2005US20050248036 Multi-chip package with high-speed serial communications between semiconductor die
11/10/2005US20050248035 Semiconductor devices having contact plugs with stress buffer spacers and methods of fabricating the same
11/10/2005US20050248034 Semiconductor device having a multilayer interconnection structure, fabrication method thereof, and designing method thereof
11/10/2005US20050248033 Semiconductor device having a dummy conductive via and a method of manufacture therefor
11/10/2005US20050248031 Mounting with auxiliary bumps
11/10/2005US20050248030 Semiconductor device and manufacturing method of the same
11/10/2005US20050248029 Embedded chip semiconductor without wire bondings
11/10/2005US20050248028 Chip-packaging with bonding options connected to a package substrate
11/10/2005US20050248027 Circuit structure integrating the power distribution functions of circuits and leadframes into the chip surface
11/10/2005US20050248026 Semiconductor device with pins and method of assembling the semiconductor device
11/10/2005US20050248025 RF seal ring structure
11/10/2005US20050248024 Power delivery system for integrated circuits
11/10/2005US20050248023 Circuit board with high density power semiconductors
11/10/2005US20050248022 High data rate chip mounting
11/10/2005US20050248021 Multi-mode integrated circuit structure
11/10/2005US20050248019 Overhang support for a stacked semiconductor device, and method of forming thereof
11/10/2005US20050248018 Multi-mode integrated circuit structure
11/10/2005US20050248017 Electronic circuit package
11/10/2005US20050248016 Chip-packaging with bonding options having a plurality of package substrates
11/10/2005US20050248015 Array capacitors in interposers, and methods of using same
11/10/2005US20050248014 Resin-encapsulated semiconductor apparatus and process for its fabrication
11/10/2005US20050248013 Assemblies with bond pads of two or more semiconductor devices electrically connected to the same surface of a plurality of leads
11/10/2005US20050248012 Mounting structure, electro-optical device, substrate for electro-optical device, and electronic apparatus
11/10/2005US20050248011 Flip chip semiconductor package for testing bump and method of fabricating the same
11/10/2005US20050248010 Semiconductor package and system module
11/10/2005US20050248009 Circuit device
11/10/2005US20050248008 Optical surface mount technology package
11/10/2005US20050248007 Surface mount multichip devices
11/10/2005US20050248006 Leads under chip IC package
11/10/2005US20050248005 Integrated circuit leadframes patterned for measuring the accurate amplitude of changing currents
11/10/2005US20050248004 Wafer and the manufacturing and reclaiming methods thereof
11/10/2005US20050248002 Fill for large volume vias
11/10/2005US20050248001 Method for producing a conductor path on a substrate, and a component having a conductor path fabricated in accordance with such a method
11/10/2005US20050248000 Semiconductor wafer and manufacturing process thereof
11/10/2005US20050247999 Semiconductor device
11/10/2005US20050247995 Metal contact fuse element
11/10/2005US20050247992 Semiconductor device, manufacturing method of semiconductor device and module for optical device
11/10/2005US20050247980 High voltage ESD-protection structure
11/10/2005US20050247979 ESD protection structure with SiGe BJT devices
11/10/2005US20050247974 Semiconductor device
11/10/2005US20050247968 Integrated circuit devices including a capacitor
11/10/2005US20050247959 Semiconductor arrangement
11/10/2005US20050247938 Light-emitting apparatus
11/10/2005US20050247931 Selectable decoupling capacitors for integrated circuits and associated methods
11/10/2005US20050247930 Shallow trench isolation void detecting method and structure for the same
11/10/2005US20050247665 Method of manufacturing an electronic parts packaging structure
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