Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2005
11/16/2005CN1698195A Hermetic sealing cap and method for producing same
11/16/2005CN1698190A Joining method and joining device
11/16/2005CN1697870A Dry thermal interface material
11/16/2005CN1697848A Process for producing high-purity epoxy resin and epoxy resin composition
11/16/2005CN1697604A Fan device and heat-emitting element cooling apparatus
11/16/2005CN1697603A Heating element radiating structure
11/16/2005CN1697602A Cooling appts.
11/16/2005CN1697588A A pattern form object and a manufacturing method thereof
11/16/2005CN1697310A LC oscillator
11/16/2005CN1697190A Optical device and method for fabricating the same
11/16/2005CN1697177A Circuit and method for ESD protection
11/16/2005CN1697176A Thin film in low dielectric constant and fabricating method
11/16/2005CN1697175A Semiconductor device and manufacturing method thereof
11/16/2005CN1697174A Semiconductor device and method for fabricating the same
11/16/2005CN1697173A Structure of constituting pins in high density
11/16/2005CN1697172A Die set for wire frame of wafer
11/16/2005CN1697171A Flat plate heat pipe of containing micro canals in parallel
11/16/2005CN1697170A Transmission canal with diphasic heat sink
11/16/2005CN1697169A Semiconductor package with heat dissipating structure and method of manufacturing the same
11/16/2005CN1697168A Enhanced heat elimination mechanism of heat elimination fins
11/16/2005CN1697167A Heat sink and manufacturing method
11/16/2005CN1697166A Structure for bearing and installing wafer and bearing seat
11/16/2005CN1697165A Transfer medium for seat body of load bearing wafer
11/16/2005CN1697164A Carrier tape, a method of manufacturing an electronic device with the carrier tape, and a tape carrier package with the carrier tape
11/16/2005CN1697163A Wiring board and semiconductor package using the same
11/16/2005CN1697162A Structure for constructing and installing chip embedded typed semiconductor components
11/16/2005CN1697161A Semiconductor chip and circuit board, manufacturing method of same, and electronic equipment
11/16/2005CN1697160A Semiconductor micro device
11/16/2005CN1697156A Method for fabricating metal interconnection line with use of barrier metal layer formed in low temperature
11/16/2005CN1697148A Semiconductor device and method of manufacturing the semiconductor device
11/16/2005CN1697127A Method of manufacturing semiconductor device
11/16/2005CN1697125A Manufacturing tool for wafer level package and method of placing dies
11/16/2005CN1696231A Interface adhesive compsn. and rework prepn.
11/16/2005CN1696169A Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
11/16/2005CN1227957C Method for manufacturing circuit device and circuit device
11/16/2005CN1227956C Flexible wiring board and making method thereof and display device with flexible wiring board
11/16/2005CN1227737C Method and apparatus for personalization of semiconductor
11/16/2005CN1227736C Semiconductor integrated circuit
11/16/2005CN1227734C Semiconductor device
11/16/2005CN1227733C 半导体器件 Semiconductor devices
11/16/2005CN1227732C Heat dissipater for high-power semiconductor module and manufacturing method thereof
11/16/2005CN1227731C Laminates for encapsulating devices
11/16/2005CN1227725C Noise shielded multi-layer substrates and manufacture thereof
11/16/2005CN1227721C Electronic component and semiconductor device, method for manufacturing and mounting thereof, and circuit board and electronic equipment
11/16/2005CN1227394C Steel wire spring clamp head, wire-guiding frame conveying belt and electroplating system
11/15/2005US6965515 Thermoelectric cooling of low-noise amplifier transistors in wireless communications networks
11/15/2005US6965513 Carbon nanotube thermal interface structures
11/15/2005US6965208 Motor speed detecting device for use between motor and system
11/15/2005US6965171 Method and structure for selective thermal paste deposition and retention on integrated circuit chip modules
11/15/2005US6965170 High wireability microvia substrate
11/15/2005US6965169 Hybrid integrated circuit package substrate
11/15/2005US6965168 Micro-machined semiconductor package
11/15/2005US6965167 Laminated chip electronic device and method of manufacturing the same
11/15/2005US6965166 Semiconductor device of chip-on-chip structure
11/15/2005US6965165 Top layers of metal for high performance IC's
11/15/2005US6965164 Electronic device and method of manufacturing the same
11/15/2005US6965163 Substrate-less microelectronic package
11/15/2005US6965162 Semiconductor chip mounting substrate and semiconductor device using it
11/15/2005US6965161 Ceramic multilayer substrate and method for manufacturing the same
11/15/2005US6965160 Semiconductor dice packages employing at least one redistribution layer
11/15/2005US6965159 Joining integrated circuit dies to connector frame; computer cards
11/15/2005US6965158 Multi-layer substrates and fabrication processes
11/15/2005US6965157 Semiconductor package with exposed die pad and body-locking leadframe
11/15/2005US6965156 Amorphous carbon metal-to-metal antifuse with adhesion promoting layers
11/15/2005US6965154 Semiconductor device
11/15/2005US6965140 Copper wire as main electroconductive films; multilayer; electrodes containing Group 8 metal
11/15/2005US6965136 Photon-blocking layer
11/15/2005US6965107 Semiconductor-based encapsulated infrared sensor and electronic device
11/15/2005US6964924 Integrated circuit process monitoring and metrology system
11/15/2005US6964919 Low-k dielectric film with good mechanical strength
11/15/2005US6964918 Electronic components such as thin array plastic packages and process for fabricating same
11/15/2005US6964915 Method of fabricating encapsulated semiconductor components by etching
11/15/2005US6964908 Metal-insulator-metal capacitor and method of fabricating same
11/15/2005US6964904 Semiconductor device and method for manufacturing the same
11/15/2005US6964899 Semiconductor device and method of manufacturing the same
11/15/2005US6964896 Methods of forming semiconductor logic circuitry, and semiconductor logic circuit constructions
11/15/2005US6964892 N-channel metal oxide semiconductor (NMOS) driver circuit and method of making same
11/15/2005US6964889 Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby
11/15/2005US6964888 Semiconductor device and method for fabricating the same
11/15/2005US6964887 Method for manufacturing semiconductor device
11/15/2005US6964886 Methods of fabrication for flip-chip image sensor packages
11/15/2005US6964885 Stress resistant land grid array (LGA) module and method of forming the same
11/15/2005US6964883 Bi-directional silicon controlled rectifier for electrostatic discharge protection
11/15/2005US6964881 Multi-chip wafer level system packages and methods of forming same
11/15/2005US6964880 Methods for the control of flatness and electron mobility of diamond coated silicon and structures formed thereby
11/15/2005US6964875 Array of gate dielectric structures to measure gate dielectric thickness and parasitic capacitance
11/15/2005US6964874 Void formation monitoring in a damascene process
11/15/2005US6964831 Method of fabricating polysilicon film by excimer laser crystallization process
11/15/2005US6964295 Heat dissipation device
11/10/2005WO2005107350A1 Multi-layer printed circuit board
11/10/2005WO2005107345A2 Microelectronic connection components having bondable wires
11/10/2005WO2005107334A1 Film-type getter and producing method thereof
11/10/2005WO2005107068A1 Basic body for filter device and filter device
11/10/2005WO2005106954A2 Power semiconductor circuit and method for producing a power semiconductor circuit
11/10/2005WO2005106953A1 A screened electrical device and a process for manufacturing the same
11/10/2005WO2005106952A1 Heat sink made from a diamond/copper composite material containing boron
11/10/2005WO2005106951A1 Assembly of a controllable electrical component on a substrate and method for producing the assembly
11/10/2005WO2005106946A1 Long-term annealed integrated circuit arrangements and method for producing the same
11/10/2005WO2005106943A2 Level realignment following an epitaxy step
11/10/2005WO2005106940A2 High performance cmos transisitors using pmd linear stress
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