Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2014
04/10/2014US20140097865 Circuit board having bypass pad
04/10/2014US20140097548 Semiconductor device connected by anisotropic conductive adhesive film
04/10/2014US20140097547 Semiconductor device
04/10/2014US20140097546 Multi-function and shielded 3d interconnects
04/10/2014US20140097545 Package structure and method for manufacturing package structure
04/10/2014US20140097543 Bonding of substrates including metal-dielectric patterns with metal raised above dielectric and structures so formed
04/10/2014US20140097542 Flip packaging device
04/10/2014US20140097541 Multilayer line trimming
04/10/2014US20140097540 Semiconductor structure
04/10/2014US20140097539 Technique for uniform cmp
04/10/2014US20140097538 Semiconductor device having a self-forming barrier layer at via bottom
04/10/2014US20140097536 TWO-SIDED-ACCESS EXTENDED WAFER-LEVEL BALL GRID ARRAY (eWLB) PACKAGE, ASSEMBLY AND METHOD
04/10/2014US20140097535 Stacked multi-chip integrated circuit package
04/10/2014US20140097534 Dual-phase intermetallic interconnection structure and method of fabricating the same
04/10/2014US20140097533 Pop Package Structure
04/10/2014US20140097532 Thermally Enhanced Package-on-Package (PoP)
04/10/2014US20140097531 Power Quad Flat No-Lead (PQFN) Package in a Single Shunt Inverter Circuit
04/10/2014US20140097529 Solder flow-impeding plug on a lead frame
04/10/2014US20140097528 Chip arrangements, a chip package and a method for manufacturing a chip arrangement
04/10/2014US20140097527 Method of manufacture integrated circuit package
04/10/2014US20140097526 Packaged ic having printed dielectric adhesive on die pad
04/10/2014US20140097525 Circuit boards, methods of fabricating the same, and semiconductor packages including the circuit boards
04/10/2014US20140097524 Coplanar waveguide for stacked multi-chip systems
04/10/2014US20140097513 Package-on-Package Type Package Including Integrated Circuit Devices and Associated Passive Components on Different Levels
04/10/2014US20140097498 Open Source Power Quad Flat No-Lead (PQFN) Leadframe
04/10/2014US20140097475 Integrated circuit packaging system with coreless substrate and method of manufacture thereof
04/10/2014US20140097469 Hydrogen mitigation schemes in the passivation of advanced devices
04/10/2014US20140097463 Anisotropic conductive adhesive
04/10/2014US20140097449 Semiconductor device
04/10/2014US20140097333 Monolithic Optical Packages and Methods Using Aluminum Nitride
04/10/2014US20140097012 Leadframe for semiconductor packages
04/10/2014US20140096998 Electrical Contact Pad
04/10/2014DE202014002730U1 Wärmerohr und Kühlmodul Heat pipe and cooling module
04/10/2014DE112010006084T5 Kühler Cooler
04/10/2014DE112005001698B4 Leistungszufuhr-Clamp-Schaltung, integrierte Schaltungsanordnung und Verfahren zum Bereitstellen eines elektrostatischen Entladungsschutzes Power supply clamp circuit, integrated circuit arrangement and method for providing an electrostatic discharge protection
04/10/2014DE102013220360A1 Eine zweiseitiger-Zugriff erweitertes Wafer-Level Ball Grid Array (eWLB) Packung, eine Anordnung und ein Verfahren A two-sided access advanced wafer level ball grid array (eWLB) package, a system and method
04/10/2014DE102013219852A1 Wärmeableitungsvorrichtung Heat dissipation device
04/10/2014DE102013111157A1 Halbleiter-Package und Verfahren zu dessen Herstellung The semiconductor package and method for its production
04/10/2014DE102013015960A1 Power module for motor cars, has electrical terminals arranged on upper surface of semiconductor chip, which is provided under carrier and embedded into cavity, and carrier provided with circuit board
04/10/2014DE102013015956A1 Power module for motor car, has semiconductor chip that is electrically contacted by specific portions of printed circuit board, and that is directly connected with copper structure
04/10/2014DE102012224432A1 Electric circuit has contact structure provided with contact portion that is formed on front side of protective layer facing away from front side of solar cell
04/10/2014DE102012218457A1 Optoelektronisches bauelement und verfahren zu seiner herstellung Optoelectronic component and process for its preparation
04/10/2014DE102012218413A1 Lighting device i.e. LED lamp, has carrier supporting semiconductor light source, and semiconductor light source arranged with one of metallization regions, where additive is added to device for increasing thermal conductivity of device
04/10/2014DE102012216546A1 Halbleiterchip, verfahren zur herstellung eines halbleiterchips und verfahren zum verlöten eines halbleiterchips mit einem träger Semiconductor chip process for producing a semiconductor chip and method for soldering a semiconductor chip to a carrier
04/10/2014DE102012216401A1 Semiconductor component e.g. power semiconductor component, for use in active devices, has shift element arranged in casting or spraying housing, and angled portions and press contact parts that are located outside casting or molding part
04/10/2014DE102012216280A1 Contact bridge for electrically interconnecting contact surface of e.g. MOSFET, mounted on conductor pattern carrier, has mold part comprising contact surface for thermal contact of surface of device over electrical isolating medium
04/10/2014DE102012019782A1 Elektrisches Kontakt-Pad An electrical contact pad
04/10/2014DE102011076324B4 Leistungselektronisches System mit Verbindungseinrichtung erster und zweiter Subsysteme Power electronic system with connection means, first and second subsystems
04/10/2014DE102011076323B4 Leistungselektronisches System mit erstem und zweitem Subsystem Electronic power system having first and second subsystem
04/10/2014DE102010024520A9 Verfahren zur Erhöhung der thermo-mechanischen Beständigkeit eines Metall-Keramik-Substrats A method for increasing the thermo-mechanical resistance of a metal-ceramic substrate
04/10/2014DE10066482B3 Verfahren zum Herstellen von elektronischen Bauteilen A method of manufacturing of electronic components
04/09/2014EP2717312A2 Electro-hydrodynamic cooling with enhanced heat transfer surfaces
04/09/2014EP2717311A2 Efficient cooling duct
04/09/2014EP2717310A1 Semiconductor device and wiring substrate
04/09/2014EP2717309A1 Element housing package, component for semiconductor device, and semiconductor device
04/09/2014EP2717303A1 Bonded structure
04/09/2014EP2717300A1 Semiconductor device
04/09/2014EP2716145A1 Printed circuit board for electric components, and printed circuit board system
04/09/2014EP2715788A1 Low temperature co-fired ceramic structure for high frequency applications and process for making same
04/09/2014EP2714584A1 Method for manufacturing flexible functional substrates
04/09/2014CN203537728U Set-top box with water cooling system
04/09/2014CN203536444U Electronic device
04/09/2014CN203536435U Subminiature packaged power supply module
04/09/2014CN203536431U Improved spiral inductor chip and connecting structure thereof
04/09/2014CN203536430U Bare chip of integrated circuit
04/09/2014CN203536429U Chip package structure
04/09/2014CN203536428U Lead frame free of weld mark
04/09/2014CN203536427U Semiconductor multi-chip packaging structure
04/09/2014CN203536426U Novel support bar structure used for lead frame
04/09/2014CN203536425U Novel structure used for fixing heat radiation copper sheet
04/09/2014CN203536424U Semiconductor lead frame structure convenient in heat radiation
04/09/2014CN203536423U Novel connection structure used in wire welding of chip with multiple welding windows in Y-axis direction
04/09/2014CN203536422U Lead frame
04/09/2014CN203536421U A novel structure of preventing a bonding material overflowing when a semiconductor welds a chip
04/09/2014CN203536420U Thick film hybrid integrated module and PCB high stable assembly structure
04/09/2014CN203536419U Aluminum pad structure capable of improving packaging reliability
04/09/2014CN203536418U Novel cushion block used for frame soldering aluminium foil of bilateral open no-lead lead frame
04/09/2014CN203536417U Water cooling base of solid amplifier module
04/09/2014CN203536416U Large-power integrated heating device equal-temperature bracket and large-power integrated heating device assembly
04/09/2014CN203536415U Thyristor module device
04/09/2014CN203536414U Ceramic copper-coated film heat sink module with good heat dissipation efficiency
04/09/2014CN203536413U IGBT thick substrate fin radiator with teeth
04/09/2014CN203536412U A three-dimensional packaging heat-dissipating structure of a rigid-flexible combined board
04/09/2014CN203536411U Semiconductor packaging structure
04/09/2014CN203536410U Supporting leg for bent-foot radiating fin used for semiconductor packaging part
04/09/2014CN203536409U A chip packaging structure
04/09/2014CN203536408U Plastic package diode
04/09/2014CN203536407U Plastic package diode
04/09/2014CN203536406U Novel structure for controlling thickness of bonding material
04/09/2014CN203536405U Novel wafer seat
04/09/2014CN203536404U Kovar metal structure used for laser seal welding
04/09/2014CN203536403U ESD protection device
04/09/2014CN203536377U Plug-in module with package outline
04/09/2014CN203535979U Short circuit chip for surface gold-coated microwave circuit
04/09/2014CN203533962U Radiator used for refrigeration of semiconductor
04/09/2014CN103718469A High-frequency module
04/09/2014CN103718314A Light-emitting device
04/09/2014CN103718292A Thin film structure for high density inductors and redistribution in wafer level packaging
04/09/2014CN103718291A Lead frame, method for manufacturing lead frame and semiconductor device using same
04/09/2014CN103718290A Heat-Dissipating Material And Method For Producing Same, And Electronic Device And Method For Producing Same
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