Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2005
11/17/2005US20050253240 Micromechanical component and corresponsing production method
11/17/2005US20050253239 Memory card
11/17/2005US20050253238 Systems for degating packaged semiconductor device with tape substrates
11/17/2005US20050253237 Method of forming an array of semiconductor packages
11/17/2005US20050253236 Semiconductor device capable of being connected to external terminals by wire bonding in stacked assembly
11/17/2005US20050253235 Semiconductor chip and circuit board, manufacturing method of same, and electronic equipment
11/17/2005US20050253234 Semiconductor package and method of fabricating the same
11/17/2005US20050253233 Power module and electric transportation apparatus incorporating the same
11/17/2005US20050253232 Semiconductor device
11/17/2005US20050253231 Semiconductor package with encapsulated passive component
11/17/2005US20050253230 Large die package structures and fabrication method therefor
11/17/2005US20050253229 Semiconductor device and manufacturing method of same
11/17/2005US20050253228 Method for encapsulation of a chipcard and module obtained thus
11/17/2005US20050253227 Resin-molded package with cavity structure
11/17/2005US20050253226 Die package
11/17/2005US20050253224 Stacked multi-chip package
11/17/2005US20050253223 Semiconductor integrated circuit including metal mesh structure
11/17/2005US20050253219 Semiconductor device and method of manufacturing the same
11/17/2005US20050253213 Covers for microelectronic imagers and methods for wafer-level packaging of microelectronics imagers
11/17/2005US20050253211 Optical device and method for fabricating the same
11/17/2005US20050253208 Semiconductor micro device
11/17/2005US20050253207 Microelectronic assembly having a perimeter around a MEMS device
11/17/2005US20050253176 Chip scale image sensor and method for fabricating the same
11/17/2005US20050253172 Charge carrier flow apparatus and methods
11/17/2005US20050253159 Semiconductor (LED) chip attachment
11/17/2005US20050253155 Optoelectronic semiconductor chip and method for forming a contact structure for making electrical contact with an optoelectronic semiconductor chip
11/17/2005US20050253140 Method of bumping die pads for wafer testing
11/17/2005US20050252828 Carrier tape, a method of manufacturing an electronic device with the carrier tape, and a tape carrier package with the carrier tape
11/17/2005US20050252682 Wiring board and semiconductor package using the same
11/17/2005US20050252681 Microelectronic assembly having variable thickness solder joint
11/17/2005US20050252650 Integrated heat dissipation apparatus
11/17/2005US20050252649 Leadless lower temperature co-crystal phase transition metal heat conductive device
11/17/2005US20050252644 Heat-exchanging device
11/17/2005US20050252642 Finned heat dissipation module with smooth guiding structure
11/17/2005US20050252641 Heat dissipation device having thermally conductive cover board
11/17/2005US20050252640 Finned heat dissipation module having flow guide
11/17/2005US20050252639 Radiation fin having an airflow guiding front edge
11/17/2005US20050252638 CPU heat dissipating unit
11/17/2005US20050252637 Heat sink and method for making same
11/17/2005US20050252584 Sputtering target, Al wiring film and electronic component
11/17/2005US20050252398 Pattern form object and a manufacturing method thereof
11/17/2005DE19719703C5 Leistungshalbleitermodul mit Keramiksubstrat Power semiconductor module with a ceramic substrate
11/17/2005DE19613409B4 Leistungsbauelementanordnung Power component arrangement
11/17/2005DE19536525B4 Leiterrahmen für integrierte Schaltungen Head framework for integrated circuits
11/17/2005DE10394006T5 Verfahren zum Herstellen einer integrierten, einen reduzierten Stress aufweisenden Schaltung und Halbleiterchip A method of fabricating an integrated, reduced stress having circuit and semiconductor chip
11/17/2005DE10393618T5 Verfahren und Vorrichtung zum Erreichen von Temperaturgleichförmigkeit und zur Kühlung von Überhitzungspunkten in einer Wärmeerzeugungsvorrichtung A method and apparatus for achieving temperature uniformity, and for the cooling of overheating points in a heat generating device
11/17/2005DE102005019702A1 Schmelzsicherungsanordnung und Herstellungsverfahren Fuse assembly and manufacturing processes
11/17/2005DE102005015001A1 Schwellenspannungsdetektor zur Prozesseffektkompensation Threshold voltage detector for process effect compensation
11/17/2005DE102005005629A1 Sensorfuß, Sensorvorrichtung mit einem solchen und Verfahren zur Herstellung der Sensorvorrichtung Sensor, Sensor device and with such a method for producing the sensor device
11/17/2005DE102005002787A1 Leistungs-Metalloxid-Halbleitervorrichtung in Vertikal-Bauart mit Überstrom-Schutzfunktion Power metal oxide semiconductor device in vertical design with over-current protection function
11/17/2005DE102004036143A1 Linsenmodul und Verfahren zur Herstellung desselben Lens module and method of manufacturing the same
11/17/2005DE102004033647A1 Gehäusestruktur Housing structure
11/17/2005DE102004031920B4 Mehrchippackung und Herstellungsverfahren Multi-chip package and manufacturing processes
11/17/2005DE102004025684A1 Optoelektronischer Halbleiterchip und Verfahren zum Ausbilden einer Kontaktstruktur zur elektrischen Kontaktierung eines optoelektronischen Halbleiterchips The optoelectronic semiconductor chip and method of forming a contact structure for the electrical contacting of an optoelectronic semiconductor chip
11/17/2005DE102004023646A1 Standard cell arrangement e.g. for DRAM semiconductor chip, has standard cell and open space for connection for cross connection between current supply and arranged on edge of standard cell
11/17/2005DE102004021261A1 Halbleiterbauelement mit einem Hybrid-Metallisierungsschichtstapel für eine verbesserte mechanische Festigkeit während und nach dem Einbringen in ein Gehäuse A semiconductor device with a hybrid metallization layer for improved mechanical strength during, and after insertion in a housing
11/17/2005DE102004021239A1 Lange getemperte integrierte Schaltungsanordnungen und deren Herstellungsverfahren Long tempered integrated circuit assemblies and their method of preparation
11/17/2005DE102004020580A1 Verfahren zur Herstellung eines BGA-Chipmoduls und BGA-Chipmodul Process for the preparation of a BGA chip module and BGA-chip module
11/17/2005DE102004020547A1 Composite consisting of a semiconductor device and a carrier substrate, and elastically deformable wave-like protruberances, useful in semiconductor technology
11/17/2005DE102004019568A1 Substrate for a power semiconductor module has electronic components and connections on metal conductor on an isolation layer and recesses beneath or next to these
11/17/2005DE102004012026B3 Anordnung zum Kühlen Arrangement for cooling
11/17/2005DE102004011667A1 Vorrichtung mit einem Halbleiterchip und einem mikrofluidischen System und Verfahren zur Herstellung Device having a semiconductor chip and a microfluidic system and method for producing
11/17/2005DE102004010852A1 IC with normal operation and configuration operation has the clocking signal derived from the external power supply feed
11/16/2005EP1596643A1 EMI gasket
11/16/2005EP1596442A2 Optoelektronischer Halbleiterchip und Verfahren zum Ausbilden einer Kontaktstruktur zur elektrischen Kontaktierung eines optoelektronischen Halbleiterchips
11/16/2005EP1596438A2 Semiconductor device, manufacturing method of semiconductor device and module for optical device
11/16/2005EP1596436A1 Electronic circuit and method for manufacturing an electronic circuit
11/16/2005EP1596435A2 A pattern form object and a manufacturing method thereof
11/16/2005EP1596434A1 Semiconductor device
11/16/2005EP1596433A1 A method for creating neo-wafers from singulated integrated circuit die and a device made according to the method
11/16/2005EP1595919A1 Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
11/16/2005EP1595905A1 Process for producing high-purity epoxy resin and epoxy resin composition
11/16/2005EP1595296A1 Packaging of organic light-emitting diodes using reactive polyurethane
11/16/2005EP1595291A2 Minimum-dimension, fully-silicided mos driver and esd protection design for optimized inter-finger coupling
11/16/2005EP1595290A2 Micro fuse
11/16/2005EP1595289A2 Thermal interconnect systems methods of production and uses thereof
11/16/2005EP1595288A1 Semiconductor module
11/16/2005EP1595287A2 Electronic component comprising a semiconductor chip and method for producing said component
11/16/2005EP1595283A2 Methods for selectively bumping integrated circuit substrates and related structures
11/16/2005EP1595282A1 Metal etching method for an interconnect structure and metal interconnect structure obtained by such method
11/16/2005EP1595277A2 Low voltage nmos-based electrostatic discharge clamp
11/16/2005EP1595276A2 Patterning layers comprised of spin-on ceramic films
11/16/2005EP1595275A2 Interconnect structures incorporating low-k dielectric barrier films
11/16/2005EP1595099A1 Cooling device of hybrid-type
11/16/2005EP1232679B1 Printed circuit board employing lossy power distribution network to reduce power plane resonances
11/16/2005EP1186037B1 Multi-chip module for leads-on-chip (loc) assembly and method for production of the same.
11/16/2005EP1025748B1 A chip supporting element and use thereof
11/16/2005EP0984485B1 Wiring forming method for semiconductor device
11/16/2005CN2741192Y Electric inductor with high-quality factor
11/16/2005CN2741188Y Structure of reverse-fuse memory assembly
11/16/2005CN2741187Y Impulsive circulating heat tube for cooling electronic device
11/16/2005CN2741186Y Electronic radiator of semiconductor
11/16/2005CN2741185Y Heat conduit structure
11/16/2005CN2741184Y Heat-conducting plate structure of radiating module
11/16/2005CN2741183Y Assembling and ring sealing structure of semiconductor and semiconductor assembly
11/16/2005CN1698201A Integrated interconnection arrangement
11/16/2005CN1698200A Adhesive film for semiconductor, metal sheet with such adhesive film, wiring substrate with adhesive film, semiconductor device, and method for manufacturing semiconductor device
11/16/2005CN1698199A Method and apparatus for cooling a portable computer
11/16/2005CN1698198A Semiconductor device and method of manufacturing the same
11/16/2005CN1698196A In-print method and in-print device
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