Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2005
11/23/2005CN1700455A Heat pipe
11/23/2005CN1700454A Power stack
11/23/2005CN1700453A Structure of forming pressure contact with power semiconductor module
11/23/2005CN1700452A Semiconductor device mounting structure
11/23/2005CN1700451A Substrate contact and method of forming the same
11/23/2005CN1700450A Secondary packaging device of avalanche photodiode for infrared photodetection
11/23/2005CN1700436A Wired circuit board
11/23/2005CN1700435A 半导体器件 Semiconductor devices
11/23/2005CN1700434A Test circuit under pad
11/23/2005CN1700431A Circuit device, manufacturing method thereof, and sheet-like board member
11/23/2005CN1699495A Epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device which uses the same
11/23/2005CN1228886C Needle gate array contact and needle gate array socket
11/23/2005CN1228856C Solid image detecting device
11/23/2005CN1228844C Electrostatic protection circuit using grid coupling metal-oxide half field effect transistor
11/23/2005CN1228843C Bidirectional over-voltage and electrostatic discharge protector
11/23/2005CN1228842C Fin type heat radiator
11/23/2005CN1228841C Flexible integrated monochip circuit
11/23/2005CN1228838C Structure reinforced open window type semiconductor packaging unit
11/23/2005CN1228837C 半导体装置 Semiconductor device
11/23/2005CN1228829C Identifying method of mark on semiconductor device
11/23/2005CN1228828C Opened lead frame type semiconductor package structure and mfg process
11/23/2005CN1228825C Semiconductor chip package and process for making same
11/23/2005CN1228824C Method for producing semiconductor device and semiconductor device
11/23/2005CN1228677C Substrate conducting wiring cutting method and device, electronic device manufacturing method and device
11/23/2005CN1228391C Macromolecule polymer composition containing clean filler incorporated therein
11/23/2005CN1228383C Paste for connecting circuit, anisotropic conductive paste and applications thereof
11/22/2005US6967845 Integrated heat dissipating device with curved fins
11/22/2005US6967844 Ceramic heat sink with micro-pores structure
11/22/2005US6967843 System and method for dissipating heat from an electronic board
11/22/2005US6967840 Clearing of vapor lock in a microchannel cooling subsystem
11/22/2005US6967839 Cooling device for light valve
11/22/2005US6967494 Wafer-interposer assembly
11/22/2005US6967416 Shared on-chip decoupling capacitor and heat-sink devices
11/22/2005US6967412 Wafer level underfill and interconnect process
11/22/2005US6967410 Electronic device, method of manufacturing the same, and electronic instrument
11/22/2005US6967407 Semiconductor device and method of manufacturing the semiconductor device
11/22/2005US6967405 Film for copper diffusion barrier
11/22/2005US6967404 Semiconductor device having radiation structure
11/22/2005US6967403 Package structure with a heat spreader and manufacturing method thereof
11/22/2005US6967402 Hermetically sealed semiconductor power module and large scale module comprising the same
11/22/2005US6967401 Semiconductor device, semiconductor module and hard disk
11/22/2005US6967400 IC chip package
11/22/2005US6967399 Semiconductor device manufacturing method having a step of applying a copper foil on a substrate as a part of a wiring connecting an electrode pad to a mounting terminal
11/22/2005US6967398 Module power distribution network
11/22/2005US6967396 Semiconductor device
11/22/2005US6967395 Mounting for a package containing a chip
11/22/2005US6967394 Multi-chip package
11/22/2005US6967393 Semiconductor differential interconnect
11/22/2005US6967392 Seal ring structure for radio frequency integrated circuits
11/22/2005US6967390 Electronic component and method of manufacturing same
11/22/2005US6967389 Wafer with semiconductor chips mounted thereon
11/22/2005US6967381 Semiconductor device
11/22/2005US6967378 Semiconductor integrated circuit device configured to prevent the generation of a reverse current in a MOS transistor
11/22/2005US6967371 System with meshed power and signal buses on cell array
11/22/2005US6967370 Integrated semiconductor circuit having a multiplicity of memory cells
11/22/2005US6967357 Voltage-driven power semiconductor device
11/22/2005US6967347 Terahertz interconnect system and applications
11/22/2005US6967282 Flip chip MMIC on board performance using periodic electromagnetic bandgap structures
11/22/2005US6967183 Electrocatalyst powders, methods for producing powders and devices fabricated from same
11/22/2005US6967179 Oxidation and heat resistance; dielectrics; forming boron nitride from organoboron polymer
11/22/2005US6967171 Insulation film etching method
11/22/2005US6967165 Method for fabricating multilayer interconnect and method for checking the same
11/22/2005US6967162 Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding
11/22/2005US6967160 Method of manufacturing semiconductor device having nickel silicide with reduced interface roughness
11/22/2005US6967155 Adhesion of copper and etch stop layer for copper alloy
11/22/2005US6967151 Method of manufacturing a semiconductor device
11/22/2005US6967128 Semiconductor device and method of manufacturing the same
11/22/2005US6967127 Methods for making semiconductor packages with leadframe grid arrays
11/22/2005US6967126 Method for manufacturing plastic ball grid array with integral heatsink
11/22/2005US6967125 Quad flat no lead (QFN) grid array package, method of making and memory module and computer system including same
11/22/2005US6967111 Techniques for reticle layout to modify wafer test structure area
11/22/2005US6967110 Sensitive test structure for assessing pattern anomalies
11/22/2005US6967109 Process monitoring methods in a plasma processing apparatus, monitoring units, and a sample processing method using the monitoring units
11/22/2005US6966936 Processing system, evacuating system for processing system, low-pressure CVD system, and evacuating system and trapping device for low-pressure CVD system
11/22/2005US6966363 Heat collector with mounting plate
11/22/2005US6966361 Bi-level heat sink
11/22/2005US6966359 Radiator plate rapid cooling apparatus
11/22/2005US6966358 Portable augmented silent cooling docking station
11/22/2005US6966357 Venturi fan
11/22/2005CA2144740C A thin multichip module
11/17/2005WO2005109981A1 Heat spreader with controlled z-axis conductivity
11/17/2005WO2005109638A1 Package for piezoelectric oscillation element, and piezoelectric oscillator
11/17/2005WO2005109613A1 An electromagnetic pump and use thereof
11/17/2005WO2005109581A1 Connector or other circuit element having an indirectly coupled integrated circuit
11/17/2005WO2005109528A1 Electronic part and method of producing the same
11/17/2005WO2005109523A1 Optoelectronic receiver
11/17/2005WO2005109519A1 Charge carrier flow apparatus and methods
11/17/2005WO2005109516A1 Split-channel antifuse array architecture
11/17/2005WO2005109513A1 Electronic package having a patterned layer on backside of its substrate, and the fabrication thereof
11/17/2005WO2005109506A1 Carrier for multilayer semiconductor device and process for manufacturing multilayer semiconductor device
11/17/2005WO2005109505A1 Power semiconductor circuit
11/17/2005WO2005109504A1 Electronic circuit and method for manufacturing an electronic circuit
11/17/2005WO2005109502A1 Integrated circuit package with improved power signal connection
11/17/2005WO2005109501A2 ESD PROTECTION STRUCTURE WITH SiGe BJT DEVICES
11/17/2005WO2005109500A2 System and method for sensitivity optimization of rf receiver using adaptive nulling
11/17/2005WO2005109499A2 Semiconductor component provided with a rewiring substrate and method for the production thereof
11/17/2005WO2005109498A2 Cut-out heat slug for integrated circuit device packaging
11/17/2005WO2005109497A1 Twin fin arrayed cooling devices
11/17/2005WO2005109496A1 Chip module and method for production of a chip module
11/17/2005WO2005109485A2 Metallic air-bridges
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