Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2005
11/17/2005WO2005109483A1 Substrate for electronic device and method for processing same
11/17/2005WO2005109473A2 Adhesion improvement for dielectric layers to conductive materials
11/17/2005WO2005109330A1 Radio-frequency system in package including antenna
11/17/2005WO2005108897A2 Heat transfer device and method of making same
11/17/2005WO2005108487A1 Methods for improving the flux compatibility of underfill formulations
11/17/2005WO2005108483A1 Electronic component device
11/17/2005WO2005108468A1 Method for forming organic silica film, organic silica film, wiring structure, semiconductor device, and composition for film formation
11/17/2005WO2005108459A1 Liquid epoxy resin composition
11/17/2005WO2005108458A1 Curable resin composition, overcoats, and process for formation thereof
11/17/2005WO2005108283A1 Temperature resistant hermetic sealing formed at low temperatures for mems packages
11/17/2005WO2005108057A1 Resin-impregnated flexible graphite articles
11/17/2005WO2005096367A8 Heater, reflow apparatus, and solder bump forming method and apparatus
11/17/2005WO2005072248A3 Area array packages with overmolded pin-fin heat sinks
11/17/2005WO2005067526A3 Flipchip qfn package and method therefore
11/17/2005WO2005064641A3 Semiconductor device and method of fabricating the same
11/17/2005WO2005049957A3 High temperature environment tool system and method
11/17/2005WO2005036616A3 Heat sinks
11/17/2005WO2005029295A3 Dynamic fluid spray jet delivery system
11/17/2005WO2005017970A3 Module for epas/ehpas applications
11/17/2005WO2004034432A9 Power mosfet
11/17/2005US20050256241 Metal filler particles dispersed in solvent-free hybrid epoxy polymer matrix; electronics; semiconductors; heat sinks
11/17/2005US20050255722 Micro blade assembly
11/17/2005US20050255710 Porous materials
11/17/2005US20050255701 Methods of forming semiconductor constructions
11/17/2005US20050255694 Hardening of copper to improve copper CMP performance
11/17/2005US20050255686 Method of manufacturing semiconductor device
11/17/2005US20050255676 Configuring a performance state of an integrated circuit die on wafer
11/17/2005US20050255672 Method and resulting structure for manufacturing semiconductor substrates
11/17/2005US20050255664 Method of forming a metal-insulator-metal capacitor
11/17/2005US20050255662 Semiconductor device with load resistor and fabrication method
11/17/2005US20050255650 Semiconductor device
11/17/2005US20050255646 Heatsink device and method
11/17/2005US20050255637 Method for assembling semiconductor die packages with standard ball grid array footprint
11/17/2005US20050255635 Microelectronic assembly having a thermally conductive member with a cavity to contain a portion of a thermal interface material
11/17/2005US20050255634 Chemical-enhanced package singulation process
11/17/2005US20050255633 Methods for producing an electronic device having microscopically small contact areas
11/17/2005US20050255632 Method of fabricating stacked semiconductor device
11/17/2005US20050255630 Method and apparatus for manufacturing a packaged semiconductor device, packaged semiconductor device obtained with such a method and metal carrier suitable for use in such a method
11/17/2005US20050255628 Microelectronic devices and methods for packaging microelectronic devices
11/17/2005US20050255627 Semiconductor device, method of manufacturing the same, cover for semiconductor device, and electronic equipment
11/17/2005US20050255612 Method of attaching a leadframe to singulated semiconductor dice
11/17/2005US20050255326 Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts
11/17/2005US20050255304 Aligned nanostructure thermal interface material
11/17/2005US20050255303 Multilayer substrate including components therein
11/17/2005US20050255285 Hygroscopic molding
11/17/2005US20050255278 Adhesive film, lead frame with adhesive film, and semiconductor device using same
11/17/2005US20050255057 Cosmetic formulations comprising ZnO nanoparticles
11/17/2005US20050254220 Electronics unit
11/17/2005US20050254217 Fastener for heat sink
11/17/2005US20050254216 Electronic apparatus with heat-dissipating structure
11/17/2005US20050254215 Use of thermally conductive vias to extract heat from microelectronic chips and method of manufacturing
11/17/2005US20050254208 Air flow direction neutral heat transfer device
11/17/2005US20050254190 ESD dissipative structural components
11/17/2005US20050254109 On-the-fly laser beam path error correction for specimen target location processing
11/17/2005US20050254013 Projection LED cooling
11/17/2005US20050253620 Method for testing using a universal wafer carrier for wafer level die burn-in
11/17/2005US20050253619 Method for testing using a universal wafer carrier for wafer level die burn-in
11/17/2005US20050253467 Heat-emitting element cooling apparatus
11/17/2005US20050253286 Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device
11/17/2005US20050253285 Supporting unit for semiconductor manufacturing device and semiconductor manufacturing device with supporting unit installed
11/17/2005US20050253284 Semiconductor package and method for fabricating the same
11/17/2005US20050253282 Temperature resistant hermetic sealing formed at low temperatures for MEMS packages
11/17/2005US20050253280 Semiconductor device and method for fabricating the same
11/17/2005US20050253279 Semiconductor chip package and method for fabricating the same
11/17/2005US20050253278 Universal interconnect die
11/17/2005US20050253277 Film for protecting mother glass for flat panel display and use thereof
11/17/2005US20050253276 Film for protecting mother glass for flat panel display and use thereof
11/17/2005US20050253275 Flip chip package and process of forming the same
11/17/2005US20050253274 Semiconductor device of chip-on-chip structure, assembling process therefor, and semiconductor chip to be bonded to solid surface
11/17/2005US20050253273 Method for integrating pre-fabricated chip structures into functional electronic systems
11/17/2005US20050253271 Semiconductor apparatus
11/17/2005US20050253269 Semiconductor device
11/17/2005US20050253268 Method and structure for improving adhesion between intermetal dielectric layer and cap layer
11/17/2005US20050253267 Semiconductor device
11/17/2005US20050253266 Semiconductor device and method for manufacturing the same
11/17/2005US20050253265 Metal seed layer deposition
11/17/2005US20050253264 Semiconductor device and method of manufacturing the semiconductor device
11/17/2005US20050253263 Wiring substrate and process for manufacturing the same
11/17/2005US20050253262 Method of manufacturing different bond pads on the same substrate of an integrated circuit package
11/17/2005US20050253261 Electronic device package structures
11/17/2005US20050253260 Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus
11/17/2005US20050253259 Integrated circuit packaging method and structure for redistributing configuration thereof
11/17/2005US20050253258 Solder flow stops for semiconductor die substrates
11/17/2005US20050253257 Integrated passive devices
11/17/2005US20050253256 Supply line arrangement, off chip driver arrangement, and semiconductor circuitry module
11/17/2005US20050253255 Integrated passive devices
11/17/2005US20050253254 Windowed package for electronic circuitry
11/17/2005US20050253253 High electrical performance semiconductor package
11/17/2005US20050253252 Direct cooling of LEDs
11/17/2005US20050253251 Heat sink and method for processing surfaces thereof
11/17/2005US20050253250 Mold gates, tape substrates with the mold gates, and packaging methods
11/17/2005US20050253249 Multi-layered complementary wire structure and manufacturing method thereof
11/17/2005US20050253248 Multilayer wiring substrate and method of manufacturing multilayer wiring substrate
11/17/2005US20050253247 Semiconductor device and manufacturing method therefor
11/17/2005US20050253246 Stacked land grid array package
11/17/2005US20050253245 Package design and method for electrically connecting die to package
11/17/2005US20050253244 Chip embedded package structure
11/17/2005US20050253243 Semiconductor device structure with adhesion-enhanced semiconductor die
11/17/2005US20050253242 Semiconductor die attachment for high vacuum tubes
11/17/2005US20050253241 Semiconductor device assemblies including an encapsulant located over intermediate conductive elements and filling a space between a semiconductor die and a carrier of the assembly
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